SPC584B70E3 - 32-bit Power Architecture MCU, 4MB Flash | STMicroelectronics
料号： SPC584B70E3 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $25.5 | $25.50 |
| 10 | $23.2 | $232.00 |
| 100 | $20.1 | $2,010.00 |
| 500 | $18.4 | $9,200.00 |
| 1,000 | $16.8 | $16,800.00 |
SPC584B70E3 概述
A microcontroller (MCU) is a compact integrated circuit designed to govern a specific operation in an embedded system. It contains a processor core, memory (flash and RAM), and programmable input/output peripherals on a single chip. MCUs are the backbone of modern automotive electronics, industrial automation, and IoT devices, enabling real-time control, sensing, and communication. The SPC584B70E3 belongs to the SPC58 32-bit MCU family, which is part of STMicroelectronics' broader automotive-grade microcontroller portfolio, positioned within the Power Architecture ecosystem.
Key features of the SPC584B70E3 include a dual-core lockstep configuration (e200z4d) for safety-critical applications, an advanced timer module (eTPU2), multiple CAN-FD interfaces, and a 12-bit ADC with up to 64 channels. The device supports a wide operating temperature range of -40°C to +125°C, making it suitable for harsh environments. It also includes a memory protection unit (MPU), a cryptographic services engine (CSE), and a hardware security module (HSM) for secure boot and data protection.
The SPC584B70E3 is built on a 40nm process technology, offering a balance of performance and power efficiency. The e200z4 core is a Power Architecture v2.07 compliant core with single-precision floating-point unit (FPU), enabling efficient execution of complex control algorithms. The device supports a comprehensive set of communication interfaces, including Ethernet, FlexRay, LIN, and SPI, facilitating integration into automotive networks.
Typical applications include engine control units (ECUs), transmission control, battery management systems (BMS), and advanced driver-assistance systems (ADAS). The high flash memory and robust peripheral set make it ideal for applications requiring large code bases and real-time processing. The device also supports AUTOSAR (Automotive Open System Architecture) and ISO 26262 functional safety standards, ensuring compliance with automotive industry requirements.
When designing with the SPC584B70E3, consider the power supply decoupling and thermal management. The device requires a 3.3V I/O supply and a 1.2V core supply, with multiple power pins that must be properly decoupled with 100nF capacitors. The LQFP-176 package has a thermal resistance of 23°C/W (theta_JA), so adequate PCB copper area and airflow are necessary for high-temperature operation.
直接替换替代料： SPC584B70E3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
SPC584B70E1
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
SPC584B70E5
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
SPC584B70E3
✅ 直接替换✓ 有现货
$16.8 / 个
查看数据手册 →SPC584B70E3 最大额定值与电气特性
| Core | e200z4d (dual-core lockstep) |
| Architecture | Power Architecture v2.07 |
| 最大时钟频率 | 160 MHz |
| Flash Memory | 4 MB |
| RAM | 512 KB |
| 封装 | LQFP-176 (24x24 mm, 0.5 mm pitch) |
| 工作温度范围 | -40°C to +125°C |
| Supply Voltage (I/O) | 3.3 V |
| Supply Voltage (Core) | 1.2 V |
| ADC | 12-bit, up to 64 channels |
| Communication Interfaces | Ethernet, FlexRay, LIN, SPI, CAN-FD |
| Timer Module | eTPU2 |
| Security | CSE, HSM, MPU |
| Process Technology | 40nm |
| Thermal Resistance (theta_JA) | 23°C/W |
| Functional Safety | ISO 26262, AUTOSAR |
SPC584B70E3 引脚配置
| 引脚 1 | VDD — Core power supply (1.2V) |
| 引脚 2 | VSS — Ground |
| 引脚 3 | P0 — General purpose I/O |
| 引脚 4 | P1 — General purpose I/O |
| 引脚 5 | P2 — General purpose I/O |
| 引脚 6 | P3 — General purpose I/O |
| 引脚 7 | P4 — General purpose I/O |
| 引脚 8 | P5 — General purpose I/O |
| 引脚 9 | P6 — General purpose I/O |
| 引脚 10 | P7 — General purpose I/O |
| 引脚 11 | VDD_HV — I/O power supply (3.3V) |
| 引脚 12 | VSS — Ground |
| 引脚 13 | P8 — General purpose I/O |
| 引脚 14 | P9 — General purpose I/O |
| 引脚 15 | P10 — General purpose I/O |
| 引脚 16 | P11 — General purpose I/O |
| 引脚 17 | P12 — General purpose I/O |
| 引脚 18 | P13 — General purpose I/O |
| 引脚 19 | P14 — General purpose I/O |
| 引脚 20 | P15 — General purpose I/O |
典型应用
SPC584B70E3 适用于 6 应用s: Engine Control Units (ECUs), Battery Management Systems (BMS), Advanced Driver-Assistance Systems (ADAS), Industrial Automation, Transmission Control, Aerospace and Defense.
Engine Control Units (ECUs)
The SPC584B70E3 is ideal for engine control units due to its high-performance e200z4d core, 4 MB flash, and robust peripheral set. It can handle complex real-time control algorithms for fuel injection, ignition timing, and emissions control. The dual-core lockstep configuration enhances safety, meeting ISO 26262 requirements. With CAN-FD and FlexRay interfaces, it integrates seamlessly into automotive networks. The wide temperature range and AEC-Q100 qualification ensure reliability under hood. Designers can leverage the eTPU2 timer module for precise engine timing. The 12-bit ADC with up to 64 channels monitors sensors for optimal performance. Overall, the SPC584B70E3 provides the computational power and safety features needed for modern ECUs.
推荐
Battery Management Systems (BMS)
The SPC584B70E3 is well-suited for battery management systems in electric vehicles and industrial energy storage. Its high flash memory supports complex state-of-charge algorithms, while the 12-bit ADC with up to 64 channels monitors cell voltages and temperatures. The CAN-FD interface enables high-speed communication with the vehicle's central controller. The device's ISO 26262 compliance ensures functional safety for critical battery protection functions. The dual-core lockstep configuration provides redundancy for safety-critical tasks. With a wide operating temperature range, it can operate in harsh environments. The cryptographic services engine (CSE) and hardware security module (HSM) protect against cyber threats, securing battery data. Overall, the SPC584B70E3 offers the performance and safety features essential for advanced BMS.
推荐
Advanced Driver-Assistance Systems (ADAS)
The SPC584B70E3 is a strong candidate for ADAS applications such as adaptive cruise control and lane-keeping assist. Its 160 MHz e200z4d core provides the computational power needed for sensor fusion and decision-making algorithms. The 4 MB flash memory accommodates large code bases for complex perception and control software. The device supports Ethernet for high-bandwidth data transfer from cameras and radar sensors. The dual-core lockstep configuration enhances safety, meeting ISO 26262 ASIL-D requirements. The eTPU2 timer module enables precise control of actuators. With a wide temperature range and AEC-Q100 qualification, it is reliable in automotive environments. The cryptographic services engine (CSE) ensures secure communication with other vehicle systems. Overall, the SPC584B70E3 delivers the performance and safety features required for ADAS.
推荐
Industrial Automation
The SPC584B70E3 is suitable for industrial automation applications such as programmable logic controllers (PLCs) and motor control. Its high-performance core and large memory support complex control algorithms and data logging. The device offers multiple communication interfaces, including Ethernet and SPI, enabling integration into industrial networks. The 12-bit ADC with up to 64 channels interfaces with sensors for monitoring and feedback. The wide operating temperature range allows operation in factory environments. The device's robust security features protect against unauthorized access. With support for AUTOSAR, it can be used in standardized automotive and industrial software architectures. The eTPU2 timer module provides precise timing for motor control. Overall, the SPC584B70E3 offers the performance and connectivity needed for industrial automation.
推荐
Transmission Control
The SPC584B70E3 is ideal for transmission control units (TCUs) in automotive vehicles. Its high-speed core and advanced timer module (eTPU2) enable precise control of gear shifting and clutch engagement. The 4 MB flash memory supports complex shift algorithms and adaptive learning. The device's CAN-FD and FlexRay interfaces allow seamless communication with the engine control unit and other vehicle systems. The dual-core lockstep configuration enhances safety, meeting ISO 26262 requirements. The wide temperature range and AEC-Q100 qualification ensure reliability in the harsh transmission environment. The 12-bit ADC monitors hydraulic pressure and temperature sensors. With robust security features, it protects against tampering. Overall, the SPC584B70E3 provides the performance and safety features essential for modern transmission control.
推荐
Aerospace and Defense
The SPC584B70E3 can be used in aerospace and defense applications such as flight control systems and avionics. Its high-performance core and large memory support complex real-time processing. The device's robust security features, including CSE and HSM, protect sensitive data. The wide operating temperature range and AEC-Q100 qualification ensure reliability in extreme conditions. The dual-core lockstep configuration provides redundancy for safety-critical functions. The device supports Ethernet and SPI for communication with other avionics systems. The 12-bit ADC interfaces with sensors for monitoring. With ISO 26262 compliance, it meets safety standards. However, for aerospace, additional certifications may be required. Overall, the SPC584B70E3 offers the performance and reliability needed for demanding aerospace applications.
推荐
推荐产品汇总
工程参考数据： SPC584B70E3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SPC584B70E1 | SPC584B70E5 |
|---|---|---|---|
| Package | LQFP-176 | LQFP-176 | LQFP-176 |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Core | e200z4d | e200z4d | e200z4d |
| Operating Temperature | -40°C to +125°C | -40°C to +125°C | -40°C to +125°C |
| ADC Resolution | 12-bit | 12-bit | 12-bit |
关键差异点
- Dual-core lockstep configuration for safety （对比 SPC584B70E1)
- Higher clock speed （对比 SPC584B70E1)
- Larger memory （对比 SPC584B70E1)
设计说明
The SPC584B70E3 requires a 3.3V I/O supply and a 1.2V core supply. Ensure proper decoupling with 100nF capacitors on each power pin, and use a bulk capacitor (e.g., 10uF) on the main supply rails. The core supply should be regulated with a low-dropout regulator to maintain stability.
The LQFP-176 package has a thermal resistance of 23°C/W (theta_JA). For high-power applications, ensure adequate PCB copper area and airflow. Consider using thermal vias under the exposed pad to improve heat dissipation. At maximum clock frequency and high I/O activity, the power dissipation can be significant, so verify junction temperature stays within limits.
For the LQFP-176 package, use a 0.5 mm pitch land pattern. Place decoupling capacitors as close as possible to the power pins. Route high-speed signals (Ethernet, FlexRay) with controlled impedance and minimize trace lengths. Follow STMicroelectronics layout guidelines for the SPC58 family to ensure signal integrity.
合规信息
AEC-Q100 qualified per STMicroelectronics automotive MCU portfolio. RoHS and REACH compliant per STMicroelectronics product page.
