SPC584B70E3 - 32-bit Power Architecture MCU, 4MB Flash | STMicroelectronics
MPN: SPC584B70E3 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $25.5 | $25.50 |
| 10 | $23.2 | $232.00 |
| 100 | $20.8 | $2,080.00 |
| 500 | $18.9 | $9,450.00 |
| 1,000 | $17.5 | $17,500.00 |
Drop-in alternatives for SPC584B70E3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
SPC584B70E1
β Drop-Inπ Reference alternative (not in catalog)
SPC584B70E3C
β Drop-Inπ Reference alternative (not in catalog)
SPC584B70E5
β Drop-Inπ Reference alternative (not in catalog)
MPC5744P
β Drop-Inπ Reference alternative (not in catalog)
SPC58EC70E3
β Drop-Inπ Reference alternative (not in catalog)
SPC584B70E3 Maximum Ratings & Electrical Characteristics
| Core | e200z4d (Power Architecture) |
| Core Frequency | 160 MHz |
| Flash Memory | 4 MB |
| RAM | 512 KB |
| Package | LQFP-176 (24x24 mm) |
| Operating Temperature | -40Β°C to +125Β°C |
| Supply Voltage (I/O) | 3.3 V |
| Supply Voltage (Core) | 1.2 V |
| ADC Resolution | 12-bit |
| ADC Channels | 64 |
| CAN Interfaces | 4x CAN-FD |
| Ethernet | 1x 10/100 Mbps |
| FlexRay | 1x |
| LIN Interfaces | 4x |
| SPI Interfaces | 3x |
| Timer Modules | eTPU2, eMIOS |
| Security | HSM, CSE |
| Functional Safety | ISO 26262 ASIL-D |
| RoHS | Compliant |
SPC584B70E3 Pin Configuration
| Pin 1 | VDD_HV_IO β I/O supply voltage (3.3V) |
| Pin 2 | VSS β Ground |
| Pin 3 | PF0 β General purpose I/O |
| Pin 4 | PF1 β General purpose I/O |
| Pin 5 | PF2 β General purpose I/O |
| Pin 6 | PF3 β General purpose I/O |
| Pin 7 | VDD_HV_IO β I/O supply voltage (3.3V) |
| Pin 8 | VSS β Ground |
| Pin 9 | PF4 β General purpose I/O |
| Pin 10 | PF5 β General purpose I/O |
| Pin 11 | PF6 β General purpose I/O |
| Pin 12 | PF7 β General purpose I/O |
| Pin 13 | VDD_HV_IO β I/O supply voltage (3.3V) |
| Pin 14 | VSS β Ground |
| Pin 15 | PE0 β General purpose I/O |
| Pin 16 | PE1 β General purpose I/O |
| Pin 17 | PE2 β General purpose I/O |
| Pin 18 | PE3 β General purpose I/O |
| Pin 19 | VDD_HV_IO β I/O supply voltage (3.3V) |
| Pin 20 | VSS β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
SPC584B70E3 is suitable for 6 applications: Engine Control Unit (ECU), Battery Management System (BMS), Advanced Driver-Assistance Systems (ADAS), Industrial Automation, Medical Devices, Aerospace and Defense.
Engine Control Unit (ECU)
The SPC584B70E3 is ideal for engine control units due to its high-performance e200z4d core running at 160 MHz, which can handle complex real-time control algorithms for fuel injection, ignition timing, and emission control. The 4 MB flash memory provides ample space for calibration data and control software, while the multiple CAN-FD interfaces enable communication with other vehicle systems. The device's ISO 26262 ASIL-D certification ensures functional safety for critical engine functions. In a typical ECU, the MCU reads sensor inputs (crank position, throttle position, oxygen sensors) via the 12-bit ADC, processes the data using the FPU, and outputs control signals to actuators (injectors, ignition coils) via the timer modules. The eTPU2 timer module offloads complex timing tasks, reducing CPU load. The wide operating temperature range (-40Β°C to +125Β°C) ensures reliable operation under hood, where temperatures can be extreme. The device's robust communication interfaces (CAN-FD, LIN) allow seamless integration into the vehicle network, enabling diagnostics and software updates.
Recommended
Battery Management System (BMS)
The SPC584B70E3 is well-suited for battery management systems in electric and hybrid vehicles. Its 12-bit ADC with 64 channels can monitor individual cell voltages and temperatures, while the CAN-FD interfaces allow high-speed communication with the vehicle's central control unit. The device's functional safety features (ISO 26262 ASIL-D) are critical for ensuring safe operation of the battery pack. In a BMS, the MCU continuously samples cell voltages and currents, calculates state-of-charge (SoC) and state-of-health (SoH), and controls balancing circuits. The high processing power enables real-time battery modeling and protection algorithms. The device's security features (HSM, CSE) protect against unauthorized access and tampering, which is essential for battery data integrity. The wide temperature range and robust design make it suitable for the harsh automotive environment. The large flash memory allows for storing complex battery algorithms and calibration data.
Recommended
Advanced Driver-Assistance Systems (ADAS)
The SPC584B70E3 is used in ADAS applications such as adaptive cruise control, lane departure warning, and collision avoidance. Its high-performance core and FPU enable real-time processing of sensor data (radar, camera, lidar) and execution of control algorithms. The device's multiple communication interfaces (CAN-FD, Ethernet, FlexRay) allow integration with various sensors and actuators. The functional safety certification (ASIL-D) is essential for ADAS, where failures can have severe consequences. In a typical ADAS application, the MCU receives data from sensors via CAN-FD or Ethernet, processes it to detect objects and make decisions, and sends control commands to the braking or steering systems. The eTPU2 timer module can generate precise PWM signals for actuator control. The device's security features protect against cyber-attacks, which is increasingly important in connected vehicles. The large flash memory supports complex algorithms and sensor fusion.
Recommended
Industrial Automation
The SPC584B70E3 is also suitable for industrial automation applications such as programmable logic controllers (PLCs), motor control, and robotics. Its high-speed core and rich peripheral set (timers, ADC, communication interfaces) enable precise control of motors and machinery. The device's wide operating temperature range and robust design make it suitable for factory environments. In a motor control application, the MCU uses the eTPU2 timer to generate PWM signals for the inverter, reads current and position sensors via the ADC, and implements field-oriented control (FOC) algorithms. The Ethernet interface allows connection to industrial networks (EtherCAT, PROFINET) for remote monitoring and control. The device's security features protect against unauthorized access to industrial systems. The large flash memory supports complex control algorithms and HMI applications.
Recommended
Medical Devices
The SPC584B70E3 can be used in medical devices such as patient monitoring systems, infusion pumps, and diagnostic equipment. Its high performance and reliability make it suitable for life-critical applications. The device's security features (HSM) protect patient data, and its functional safety features support compliance with medical standards (IEC 60601). In a patient monitoring system, the MCU processes vital signs (ECG, SpO2, blood pressure) from sensors, displays them on a screen, and sends alerts via communication interfaces. The 12-bit ADC provides high-resolution data acquisition, and the FPU enables signal processing algorithms. The device's low power consumption is beneficial for battery-powered portable devices. The wide temperature range ensures operation in various clinical environments.
Recommended
Aerospace and Defense
The SPC584B70E3 is used in aerospace and defense applications such as flight control systems, navigation, and communication systems. Its high reliability, wide temperature range, and security features make it suitable for harsh environments. The device's functional safety features support DO-178C certification for avionics software. In a flight control system, the MCU processes sensor data (gyroscopes, accelerometers, GPS) and executes control laws to maintain aircraft stability. The multiple communication interfaces (CAN, Ethernet, FlexRay) allow integration with other avionics systems. The device's security features protect against cyber threats, which is critical in defense applications. The large flash memory supports complex flight software and data logging.
Recommended
Recommended Products Summary
Engineering reference data for SPC584B70E3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SPC584B70E1 | SPC584B70E3C | SPC584B70E5 | MPC5744P |
|---|---|---|---|---|---|
| Package | LQFP-176 | LQFP-176 | LQFP-176 | LQFP-176 | LQFP-176 |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | NXP Semiconductors |
| Core Frequency | 160 MHz | 160 MHz | 160 MHz | 160 MHz | 160 MHz |
| Flash Memory | 4 MB | 2 MB | 4 MB | 6 MB | 2.5 MB |
| RAM | 512 KB | 256 KB | 512 KB | 512 KB | 384 KB |
| ADC Channels | 64 | 64 | 64 | 64 | 64 |
| CAN-FD Interfaces | 4 | 4 | 4 | 4 | 3 |
| Functional Safety | ASIL-D | ASIL-D | ASIL-D | ASIL-D | ASIL-D |
Key Differentiators
- Larger flash memory (4 MB) compared to SPC584B70E1 (2 MB) (vs SPC584B70E1)
- Higher RAM (512 KB) compared to MPC5744P (384 KB) (vs MPC5744P)
- More CAN-FD interfaces (4) compared to MPC5744P (3) (vs MPC5744P)
Design Notes
The SPC584B70E3 requires multiple supply rails: 3.3V for I/O and 1.2V for core. Use low-dropout regulators (LDOs) or DC-DC converters to generate these rails. Place 100nF decoupling capacitors close to each power pin, and add a 10uF bulk capacitor per supply domain. Ensure the power sequencing meets the requirements in the datasheet to avoid latch-up or damage.
The LQFP-176 package has a thermal resistance of 23Β°C/W (theta_JA). At 160 MHz and full peripheral usage, the power dissipation can be around 1.5W, leading to a temperature rise of 34.5Β°C above ambient. Ensure adequate PCB copper area (at least 4 cmΒ²) and airflow for high-temperature environments. Consider using a heatsink if operating near the maximum temperature.
For the LQFP-176 package, use a 4-layer PCB with dedicated power and ground planes. Route high-speed signals (Ethernet, FlexRay) with controlled impedance and keep traces short. Place the crystal oscillator close to the MCU and provide a ground guard ring. Follow the layout guidelines in the ST application note AN2860 for EMC compliance.
Compliance Information
AEC-Q100 qualified for automotive applications. RoHS and REACH compliant per STMicroelectronics.
