TPS544C20RVF - 18V, 30A SWIFT Buck Converter | Texas Instruments
料号： TPS544C20RVF ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.25 | $112.50 |
| 100 | $9.85 | $985.00 |
| 500 | $8.95 | $4,475.00 |
| 1,000 | $8.1 | $8,100.00 |
TPS544C20RVF 概述
A buck converter (step-down switching regulator) is a type of DC-DC converter that produces a lower regulated output voltage from a higher input voltage by rapidly switching an inductor and rectifying the resulting waveform. Within the power-management IC hierarchy, buck converters belong to the broader switching-regulator family alongside boost, buck-boost, and SEPIC topologies, and they are favored over linear regulators (LDOs) when high step-down ratios and high output currents must be achieved with high efficiency. The TPS544C20 belongs to TI's SWIFT (Switcher With Integrated FET Technology) family of integrated FET converters, which combine the power stage, control logic, and compensation into a single IC.
Key features of the TPS544C20RVF include 30A continuous output current in a 5 mm × 7 mm LQFN-CLIP package, selectable D-CAP / D-CAP2 modes for flexible transient tuning, lossless low-side MOSFET current sensing that eliminates external shunt resistors, and a PMBus 1.3 / 1.2 compatible interface for output voltage margining, fault monitoring, telemetry of VOUT / IOUT / temperature, and on/off control. An internal 600 mV ±0.5% reference and a MODE pin allow the user to select between D-CAP and D-CAP2 control architectures.
Typical applications include high-density 30A point-of-load (POL) rails on server motherboards, telecom base-station equipment, FPGA and ASIC core/SerDes supplies, industrial automation controllers, and networking switches where PMBus telemetry and adaptive voltage scaling (AVS) are required. The wide 4.5V to 18V input range also makes it well suited for 5V and 12V intermediate bus architectures. The combination of high switching frequency capability, integrated power stage, and digital interface keeps the external BOM small and the transient response fast.
When designing with this device, ensure adequate PCB copper area for thermal dissipation (the LQFN-CLIP thermal pad must be soldered to a sufficiently large copper pour), respect the 18V absolute-maximum input rating, and follow TI's recommended inductor and output-capacitor selection from the manufacturer datasheet for stable D-CAP/D-CAP2 operation.
直接替换替代料： TPS544C20RVF ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： TPS544C20RVF （相同外形与封装尺寸） ——差异在于 Digital Interface, Package, Mounting Type, Output Voltage Range, Topology.
快速对比工具——选择替代料号进行并排对比：
TPS544C20RVFR
✅ 直接替换✓ 有现货
$5.21 / 个
查看数据手册 →TPS544C20RVFT
✅ 直接替换📋 参考替代料（不在目录中）
TPS544B20RVFR
✅ 直接替换✓ 有现货
$5.1 / 个
查看数据手册 →TPS544C25RVFR
✅ 直接替换📋 参考替代料（不在目录中）
TPS544C20RVF 最大额定值与电气特性
| 拓扑 | Synchronous Buck (Step-Down) |
| 输入电压范围 | 4.5 V to 18 V |
| 输出电压范围 | 0.6 V to 5.5 V |
| Continuous Output Current | 30 A |
| Reference Voltage Accuracy | 600 mV, ±0.5% |
| High-Side MOSFET RDS(on) | 4.5 mΩ (typical, integrated NexFET) |
| Low-Side MOSFET RDS(on) | 2.0 mΩ (typical, integrated NexFET) |
| Control Modes | D-CAP and D-CAP2 (selectable via MODE pin) |
| Current Sensing | Lossless, internal low-side MOSFET sensing |
| Digital Interface | PMBus 1.3 / 1.2 compatible |
| 封装 | 40-pin LQFN-CLIP (RVF) 5 mm × 7 mm |
| Pitch | 0.5 mm |
| 工作温度范围 | -40C to +125C |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
TPS544C20RVF 40-pin lqfn-clip (rvf) 5 mm × 7 mm 引脚配置指南
TPS544C20RVF（40-pin lqfn-clip (rvf) 5 mm × 7 mm 封装）的引脚配置。 该功率器件具有栅极、漏极和源极端子。对于无极性封装，请参阅制造商数据手册以了解确切的引脚 1 方向和封装尺寸细节。常见应用包括电源设计、电机驱动和负载开关。
暂无详细引脚数据： TPS544C20RVF.
请参阅 数据手册 以查看完整引脚配置。
典型应用
TPS544C20RVF 适用于 6 应用s: Server and Datacenter Point-of-Load (POL), Telecom Base Station Power Supplies, FPGA and ASIC Core/SerDes Power, Industrial Automation Controllers, Networking Switch and Router ASIC Supplies, High-End Storage and SSD Controller Power.
Server and Datacenter Point-of-Load (POL)
The TPS544C20RVF delivers 30A from a 4.5V-18V intermediate bus to power server CPU cores, memory, and ASICs in hyperscale datacenters. Its 30A continuous current in 5 mm × 7 mm LQFN-CLIP footprint enables high-density POL designs that minimize PCB area, while the PMBus interface provides real-time VOUT / IOUT / temperature telemetry for adaptive voltage scaling (AVS) and load-line optimization across many parallel rails on a single motherboard.
推荐
Telecom Base Station Power Supplies
The TPS544C20RVF is well matched to 12V intermediate-bus architectures powering RF power amplifiers, baseband DSPs, and SERDES PHYs in 4G/5G base stations. Its 4.5V-18V input range accepts the standard -48V telecom bus after a front-end intermediate bus converter, while 30A output handles multi-amp transients during PA burst mode. The PMBus interface supports margining and fault telemetry required by telecom OAM requirements.
推荐
FPGA and ASIC Core/SerDes Power
FPGA and ASIC core rails typically demand 30A with sub-1V output and tight DC accuracy, which the TPS544C20RVF delivers via its 0.6V-5.5V adjustable output and ±0.5% reference. Selectable D-CAP2 mode provides the fast transient response required by FPGA core voltage transitions between DVFS states, while PMBus enables AVS closed-loop control. The integrated NexFET power stage reduces PCB area versus discrete FET solutions.
推荐
Industrial Automation Controllers
Industrial PLCs and motor-control boards require robust 24V-input-tolerant point-of-load converters; the TPS544C20RVF's 18V maximum and 4.5V minimum comfortably cover 12V and 15V industrial buses. With 30A continuous output and -40C to +125C operating range, the device survives factory-floor thermal stress, while PMBus monitoring allows centralized fault logging across a machine's controllers via I2C/SMBus.
推荐
Networking Switch and Router ASIC Supplies
Enterprise switches and routers rely on high-current, low-voltage rails to power switching ASICs and packet processors. The TPS544C20RVF delivers 30A in a small 5 mm × 7 mm footprint, enabling dense multi-rail designs. Its PMBus interface supports telemetry needed for thermal and power-budget management in chassis with many parallel switch ASICs, and D-CAP2 control handles fast load steps typical of packet-processing traffic.
推荐
High-End Storage and SSD Controller Power
Enterprise SSDs and storage controllers require tightly regulated low-voltage, high-current rails with telemetry for predictive failure analysis. The TPS544C20RVF's 30A output, 0.6V minimum VOUT, and PMBus-reported IOUT and temperature enable storage designers to monitor per-rail health. The LQFN-CLIP footprint fits dense storage controller PCBs where every square millimeter of board area matters.
推荐
推荐产品汇总
工程参考数据： TPS544C20RVF ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | TPS544C20RVFR | TPS544C20RVFT | TPS544B20RVFR | TPS544C25RVFR |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 40-pin LQFN-CLIP (RVF) 5x7 mm | 40-pin LQFN-CLIP (RVF) 5x7 mm - same | 40-pin LQFN-CLIP (RVF) 5x7 mm - same | 40-pin LQFN-CLIP (RVF) 5x7 mm - same | 40-pin LQFN-CLIP (RVF) 5x7 mm - same |
| Output Current | 30 A | 30 A | 30 A | 20 A | 30 A |
| Input Voltage Range | 4.5 V to 18 V | 4.5 V to 18 V | 4.5 V to 18 V | 4.5 V to 18 V | 4.5 V to 18 V |
| Output Voltage Range | 0.6 V to 5.5 V | 0.6 V to 5.5 V | 0.6 V to 5.5 V | 0.6 V to 5.5 V | 0.5 V to 5.5 V |
| Control Mode Pin Function | MODE (D-CAP / D-CAP2 select) | MODE (D-CAP / D-CAP2 select) | MODE (D-CAP / D-CAP2 select) | MODE (D-CAP / D-CAP2 select) | SYNC / RESET_B (dual-function) |
| PMBus Interface | Yes (1.3 / 1.2 compatible) | Yes (1.3 / 1.2 compatible) | Yes (1.3 / 1.2 compatible) | Yes (1.3 / 1.2 compatible) | Yes (1.3 / 1.2 compatible) |
| Price Tier (qty 1000) | $8.10 | $8.10 | $8.10 | $7.20 | $9.50 |
关键差异点
- Pin-compatible 30A option with same NexFET power stage （对比 TPS544B20RVFR)
- MODE pin preserves selectable D-CAP / D-CAP2 control （对比 TPS544C25RVFR)
- Lower quiescent current vs older TPS54620 family （对比 TPS54620RHLR)
设计说明
Estimated: at VIN=12V, VOUT=1V, and 30A load, the TPS544C20RVF dissipates (12V-1V) × 30A = 330W. Even at 95% efficiency that is ~16.5W of heat in the LQFN-CLIP package. The exposed thermal pad MUST be soldered to a multi-layer PCB copper pour of at least 1 square inch on top and inner layers with thermal vias; without this the device will quickly thermal-shutdown at full load.
Place input capacitors (typically 22 µF X7R ceramic per phase) as close as possible to the PVIN and PGND pins to minimize switching-loop inductance. The exposed thermal pad should use an array of 0.3 mm thermal vias on a 1 mm grid connecting top-layer copper to inner-layer ground planes. Keep the MODE / PMBus traces away from the switching node to avoid noise coupling into the digital interface.
Do not exceed the 18V absolute-maximum input rating; transients above 18V will permanently damage the integrated NexFETs. Always populate both bootstrap (BOOT) and bypass capacitors exactly as shown in the manufacturer datasheet typical application circuit. Do not leave PMBus address straps floating - tie ADRx to AGND or VLOG through a resistor to set the desired SMBus address and avoid bus collisions.
When operating in D-CAP2 mode, the output-capacitor ESR must remain within the loop-stable range specified in the manufacturer datasheet (typically 1-10 mΩ for ceramic). Excessive ESR causes sub-harmonic oscillation; insufficient ESR causes poor transient response. TI's WEBENCH Power Designer tool can simulate stability for chosen inductor and capacitor combinations before PCB layout.
合规信息
Standard TI lead-free, halogen-free, RoHS-compliant part per TI product folder. Not AEC-Q100 qualified; for automotive 30A applications consider the TI-Q1 automotive-graded SWIFT variants.
