XC3S1500-4FG676I - 1.5M Gate Spartan-3 FPGA | AMD
料号： XC3S1500-4FG676I ✓ 量产中XC3S1500-4FG676I 概述
A field-programmable gate array, or FPGA, is a programmable digital semiconductor used to implement control logic, signal processing, interface bridging, and embedded systems through a configurable logic and interconnect fabric. FPGAs occupy the programmable-logic portion of the integrated-circuit hierarchy and can shorten development cycles by replacing application-specific gate arrays with reconfigurable devices.
The Spartan-3 architecture provides 29,952 configurable logic cells and 487 user I/O in this 676-BGA configuration. Its 1.2 V core supply and 630 MHz listed performance make it useful for demanding parallel data paths, protocol handling, instrumentation, communications, and embedded control. The package offers substantial pin and routing capacity compared with smaller FPGA packages.
The XC3S1500 combines programmable logic cells, programmable I/O blocks, dedicated memory resources, internal clocking, and configurable interconnect within one device. This architecture permits parallel datapaths and deterministic control logic to coexist on the same FPGA, reducing external component count compared with a design assembled from separate logic devices.
Typical uses include industrial automation, communication equipment, test and measurement, video or image processing, embedded storage systems, and high-performance controller prototypes. Designers can also use it to consolidate several fixed-function logic functions into one reconfigurable device while preserving software or configuration-based field updates.
PCB implementation requires careful BGA-layout practices, including the manufacturer-recommended land pattern, multilayer board construction, controlled-impedance routing, complete power and ground planes, and decoupling close to supply pins. Configuration memory, clocking, JTAG access, I/O standards, and bank-specific voltage requirements must be planned before schematic capture.
This product page combines the listed device specifications, a focused package-aware comparison, practical design guidance, and ordering information for engineers evaluating the XC3S1500-4FG676I for programmable-logic designs.
直接替换替代料： XC3S1500-4FG676I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC3S1500-4FG676I （相同外形与封装尺寸） ——差异在于 Speed Grade, Temperature Grade, Package, Product Type, Terminal Count.
XC3S1500-4FG676C
✅ 直接替换联系询价
查看数据手册 →XC3S1500-4FGG676I
✅ 直接替换📋 参考替代料（不在目录中）
XC3S1500-4FGG676C
✅ 直接替换📋 参考替代料（不在目录中）
XC3S1500-5FG676C
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XC3S1500-5FGG676C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC3S1500-4FG676I 最大额定值与电气特性
| Product Type | Spartan-3 Field Programmable Gate Array (FPGA) |
| System Gates | 1,500,000 gates |
| Logic Cells | 29,952 cells |
| Maximum Performance | 630 MHz |
| Core Supply Voltage | 1.2 V |
| User I/O | 487 I/O |
| 封装 | 676-pin BGA |
| Device Family | Spartan-3 |
| Speed Grade | -4 |
| Temperature Grade | Industrial |
| Programmable Logic Type | SRAM-based FPGA |
| Process Technology | 90 nm |
| 安装类型 | Surface Mount |
XC3S1500-4FG676I 676-pin bga 引脚配置指南
XC3S1500-4FG676I（676-pin bga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC3S1500-4FG676I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC3S1500-4FG676I 适用于 6 应用s: Industrial Automation Controllers, Communications and Protocol Bridging, Test and Measurement Systems, Embedded Control and Data Acquisition, Signal Processing and Image Pipelines, Programmable Logic Prototyping.
Industrial Automation Controllers
The XC3S1500-4FG676I fits industrial automation controllers that need substantial parallel logic and extensive external connectivity. Its 29,952 logic cells can organize motion sequencing, machine-state management, interlocks, counters, and communication protocols, while 487 user I/O support encoders, sensors, actuators, and industrial interfaces. The industrial-temperature suffix supports deployment in temperature-variable factory equipment. Place the 676-pin BGA on a multilayer control board, keep power and ground distribution continuous, and isolate timing-sensitive I/O according to the selected bank voltages.
推荐
Communications and Protocol Bridging
The XC3S1500-4FG676I is suitable for communications equipment requiring simultaneous handling of multiple interfaces and wide parallel data paths. Its 29,952 logic cells and 487 user I/O can support frame processing, buffering, clock-domain crossing, protocol conversion, and test logic within one programmable device. The listed 630 MHz performance is useful for pipelined datapaths, while the 1.2 V core supply simplifies modern digital power planning. Designers should assign pins by I/O-bank capability and preserve timing margins for high-speed interfaces.
推荐
Test and Measurement Systems
The XC3S1500-4FG676I can implement the parallel acquisition, sequencing, trigger, and pattern-generation logic found in sophisticated test equipment. Its 29,952 logic cells allow multiple instrument channels to share a programmable architecture, and 487 user I/O provide connections to converters, relay matrices, and acquisition hardware. The listed 630 MHz speed supports timing-rich digital functions, while industrial-temperature ordering suits laboratory and production equipment operating in varied ambient conditions.
推荐
Embedded Control and Data Acquisition
The XC3S1500-4FG676I can consolidate embedded control, acquisition, and data-processing functions into one FPGA-based platform. A design can use its 29,952 logic cells for sensor conditioning logic, digital filtering, control sequencing, and local data movement, while 487 user I/O connect external sensors and actuators. The device's 1.2 V core supply and listed 630 MHz performance support a compact modern implementation. Plan configuration memory, clocking, I/O voltage banks, and JTAG access during the architecture phase.
推荐
Signal Processing and Image Pipelines
The XC3S1500-4FG676I supports parallel signal-processing pipelines because its 29,952 logic cells and listed 630 MHz performance can implement filters, counters, lookup logic, and control state machines. The 487 user I/O provide broad connectivity to sensors, converters, memory interfaces, and external processing elements. This makes the device applicable to industrial imaging, waveform analysis, and specialized signal conditioning. Designers should pipeline critical paths, register high-speed interfaces, and apply appropriate timing constraints to every clock domain.
推荐
Programmable Logic Prototyping
The XC3S1500-4FG676I is useful for prototyping substantial digital systems before custom silicon becomes economical. Its 1.5 million system gates, 29,952 logic cells, and 487 user I/O allow multiple processor interfaces, bus bridges, storage controllers, and test features to be evaluated in one FPGA. The 676-pin BGA provides access to a large I/O count but demands careful escape-routing and assembly planning. Engineers should preserve the same pin constraints and interfaces as the target ASIC whenever possible.
推荐
推荐产品汇总
工程参考数据： XC3S1500-4FG676I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC3S1500-4FG676C | XC3S1500-4FGG676I | XC3S1500-4FGG676C | XC3S1500-5FG676C | XC3S1500-5FGG676C |
|---|---|---|---|---|---|---|
| Package | 676-pin BGA | 676-pin BGA | 676-pin BGA | 676-pin BGA | 676-pin BGA | 676-pin BGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| Logic Cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells |
| Speed Grade | -4 | -4 | -4 | -4 | -5 | -5 |
| Temperature Grade | Industrial | Commercial | Industrial | Commercial | Commercial | Commercial |
关键差异点
- Industrial-temperature suffix （对比 XC3S1500-4FG676C)
- Original FG ordering structure （对比 XC3S1500-4FGG676I)
- Lower listed speed grade with established continuity （对比 XC3S1500-5FG676C)
设计说明
Implement the 676-pin BGA on a multilayer PCB using the exact manufacturer package drawing and recommended stack-up. Continuous power and ground planes should be placed close to the device to minimize loop inductance and provide high-current return paths. Escape-route configuration, clock, JTAG, and user I/O signals according to the official recommendations, and validate the stack-up against the selected I/O standards and anticipated 630 MHz device performance.
Plan the 1.2 V core rail as a dedicated, low-noise supply and verify all required I/O-bank voltages independently. Place decoupling capacitance at the device power balls with very short current paths, and provide additional bulk capacitance near the power-source section of the board. Use separate filtering for sensitive supply domains if required, and account for startup current, configuration behavior, and the voltage ramps required by the manufacturer guidance.
Create a timing plan before assigning high-speed user I/O. The XC3S1500-4FG676I has 487 user I/O, but pin availability and usable voltage standards depend on the selected bank configuration. Apply the manufacturer's I/O timing constraints, avoid routing high-speed signals over split power planes, and use source-synchronous or clock-forwarding techniques where supported. Review all clock domains with static timing analysis after placement.
Do not approve XC3S1500-4FG676C as a replacement solely because it has the same 676-BGA format; its commercial-temperature grade may be unsuitable for the target environment. Likewise, distinguish FGG and FG ordering suffixes and verify their package attributes. Confirm the exact ball map, configuration interface, voltage requirements, and qualification status. Similar family names do not by themselves prove that every board and firmware configuration remains interchangeable.
合规信息
No explicit compliance designation for the exact XC3S1500-4FG676I ordering code was established. The FGG ordering variants referenced by cross-reference material are associated with RoHS-compliant and lead-free construction, but those claims are not assigned to the FG target.
