XC3S1500-4FG676I - 1.5M Gate Spartan-3 FPGA | AMD
Référence : XC3S1500-4FG676I ✓ ActifXC3S1500-4FG676I Présentation
A field-programmable gate array, or FPGA, is a programmable digital semiconductor used to implement control logic, signal processing, interface bridging, and embedded systems through a configurable logic and interconnect fabric. FPGAs occupy the programmable-logic portion of the integrated-circuit hierarchy and can shorten development cycles by replacing application-specific gate arrays with reconfigurable devices.
The Spartan-3 architecture provides 29,952 configurable logic cells and 487 user I/O in this 676-BGA configuration. Its 1.2 V core supply and 630 MHz listed performance make it useful for demanding parallel data paths, protocol handling, instrumentation, communications, and embedded control. The package offers substantial pin and routing capacity compared with smaller FPGA packages.
The XC3S1500 combines programmable logic cells, programmable I/O blocks, dedicated memory resources, internal clocking, and configurable interconnect within one device. This architecture permits parallel datapaths and deterministic control logic to coexist on the same FPGA, reducing external component count compared with a design assembled from separate logic devices.
Typical uses include industrial automation, communication equipment, test and measurement, video or image processing, embedded storage systems, and high-performance controller prototypes. Designers can also use it to consolidate several fixed-function logic functions into one reconfigurable device while preserving software or configuration-based field updates.
PCB implementation requires careful BGA-layout practices, including the manufacturer-recommended land pattern, multilayer board construction, controlled-impedance routing, complete power and ground planes, and decoupling close to supply pins. Configuration memory, clocking, JTAG access, I/O standards, and bank-specific voltage requirements must be planned before schematic capture.
This product page combines the listed device specifications, a focused package-aware comparison, practical design guidance, and ordering information for engineers evaluating the XC3S1500-4FG676I for programmable-logic designs.
Alternatives de remplacement direct pour XC3S1500-4FG676I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S1500-4FG676I (même facteur de forme et même empreinte) — différant par Speed Grade, Temperature Grade, Package, Product Type, Terminal Count.
XC3S1500-4FG676C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC3S1500-4FGG676I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S1500-4FGG676C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S1500-5FG676C
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC3S1500-5FGG676C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC3S1500-4FG676I Valeurs maximales et caractéristiques électriques
| Product Type | Spartan-3 Field Programmable Gate Array (FPGA) |
| System Gates | 1,500,000 gates |
| Logic Cells | 29,952 cells |
| Maximum Performance | 630 MHz |
| Core Supply Voltage | 1.2 V |
| User I/O | 487 I/O |
| Boîtier | 676-pin BGA |
| Device Family | Spartan-3 |
| Speed Grade | -4 |
| Temperature Grade | Industrial |
| Programmable Logic Type | SRAM-based FPGA |
| Process Technology | 90 nm |
| Type de montage | Surface Mount |
Guide de configuration des broches du XC3S1500-4FG676I 676-pin bga
Configuration des broches du XC3S1500-4FG676I (boîtier 676-pin bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S1500-4FG676I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S1500-4FG676I convient pour 6 applications: Industrial Automation Controllers, Communications and Protocol Bridging, Test and Measurement Systems, Embedded Control and Data Acquisition, Signal Processing and Image Pipelines, Programmable Logic Prototyping.
Industrial Automation Controllers
The XC3S1500-4FG676I fits industrial automation controllers that need substantial parallel logic and extensive external connectivity. Its 29,952 logic cells can organize motion sequencing, machine-state management, interlocks, counters, and communication protocols, while 487 user I/O support encoders, sensors, actuators, and industrial interfaces. The industrial-temperature suffix supports deployment in temperature-variable factory equipment. Place the 676-pin BGA on a multilayer control board, keep power and ground distribution continuous, and isolate timing-sensitive I/O according to the selected bank voltages.
Recommandé
Communications and Protocol Bridging
The XC3S1500-4FG676I is suitable for communications equipment requiring simultaneous handling of multiple interfaces and wide parallel data paths. Its 29,952 logic cells and 487 user I/O can support frame processing, buffering, clock-domain crossing, protocol conversion, and test logic within one programmable device. The listed 630 MHz performance is useful for pipelined datapaths, while the 1.2 V core supply simplifies modern digital power planning. Designers should assign pins by I/O-bank capability and preserve timing margins for high-speed interfaces.
Recommandé
Test and Measurement Systems
The XC3S1500-4FG676I can implement the parallel acquisition, sequencing, trigger, and pattern-generation logic found in sophisticated test equipment. Its 29,952 logic cells allow multiple instrument channels to share a programmable architecture, and 487 user I/O provide connections to converters, relay matrices, and acquisition hardware. The listed 630 MHz speed supports timing-rich digital functions, while industrial-temperature ordering suits laboratory and production equipment operating in varied ambient conditions.
Recommandé
Embedded Control and Data Acquisition
The XC3S1500-4FG676I can consolidate embedded control, acquisition, and data-processing functions into one FPGA-based platform. A design can use its 29,952 logic cells for sensor conditioning logic, digital filtering, control sequencing, and local data movement, while 487 user I/O connect external sensors and actuators. The device's 1.2 V core supply and listed 630 MHz performance support a compact modern implementation. Plan configuration memory, clocking, I/O voltage banks, and JTAG access during the architecture phase.
Recommandé
Signal Processing and Image Pipelines
The XC3S1500-4FG676I supports parallel signal-processing pipelines because its 29,952 logic cells and listed 630 MHz performance can implement filters, counters, lookup logic, and control state machines. The 487 user I/O provide broad connectivity to sensors, converters, memory interfaces, and external processing elements. This makes the device applicable to industrial imaging, waveform analysis, and specialized signal conditioning. Designers should pipeline critical paths, register high-speed interfaces, and apply appropriate timing constraints to every clock domain.
Recommandé
Programmable Logic Prototyping
The XC3S1500-4FG676I is useful for prototyping substantial digital systems before custom silicon becomes economical. Its 1.5 million system gates, 29,952 logic cells, and 487 user I/O allow multiple processor interfaces, bus bridges, storage controllers, and test features to be evaluated in one FPGA. The 676-pin BGA provides access to a large I/O count but demands careful escape-routing and assembly planning. Engineers should preserve the same pin constraints and interfaces as the target ASIC whenever possible.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S1500-4FG676I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S1500-4FG676C | XC3S1500-4FGG676I | XC3S1500-4FGG676C | XC3S1500-5FG676C | XC3S1500-5FGG676C |
|---|---|---|---|---|---|---|
| Package | 676-pin BGA | 676-pin BGA | 676-pin BGA | 676-pin BGA | 676-pin BGA | 676-pin BGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| Logic Cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells |
| Speed Grade | -4 | -4 | -4 | -4 | -5 | -5 |
| Temperature Grade | Industrial | Commercial | Industrial | Commercial | Commercial | Commercial |
Principaux différenciateurs
- Industrial-temperature suffix (vs XC3S1500-4FG676C)
- Original FG ordering structure (vs XC3S1500-4FGG676I)
- Lower listed speed grade with established continuity (vs XC3S1500-5FG676C)
Notes de conception
Implement the 676-pin BGA on a multilayer PCB using the exact manufacturer package drawing and recommended stack-up. Continuous power and ground planes should be placed close to the device to minimize loop inductance and provide high-current return paths. Escape-route configuration, clock, JTAG, and user I/O signals according to the official recommendations, and validate the stack-up against the selected I/O standards and anticipated 630 MHz device performance.
Plan the 1.2 V core rail as a dedicated, low-noise supply and verify all required I/O-bank voltages independently. Place decoupling capacitance at the device power balls with very short current paths, and provide additional bulk capacitance near the power-source section of the board. Use separate filtering for sensitive supply domains if required, and account for startup current, configuration behavior, and the voltage ramps required by the manufacturer guidance.
Create a timing plan before assigning high-speed user I/O. The XC3S1500-4FG676I has 487 user I/O, but pin availability and usable voltage standards depend on the selected bank configuration. Apply the manufacturer's I/O timing constraints, avoid routing high-speed signals over split power planes, and use source-synchronous or clock-forwarding techniques where supported. Review all clock domains with static timing analysis after placement.
Do not approve XC3S1500-4FG676C as a replacement solely because it has the same 676-BGA format; its commercial-temperature grade may be unsuitable for the target environment. Likewise, distinguish FGG and FG ordering suffixes and verify their package attributes. Confirm the exact ball map, configuration interface, voltage requirements, and qualification status. Similar family names do not by themselves prove that every board and firmware configuration remains interchangeable.
Informations de conformité
No explicit compliance designation for the exact XC3S1500-4FG676I ordering code was established. The FGG ordering variants referenced by cross-reference material are associated with RoHS-compliant and lead-free construction, but those claims are not assigned to the FG target.
