XC3S1500-4FG676I - 1.5M Gate Spartan-3 FPGA | AMD
부품 번호: XC3S1500-4FG676I ✓ 활성XC3S1500-4FG676I 개요
A field-programmable gate array, or FPGA, is a programmable digital semiconductor used to implement control logic, signal processing, interface bridging, and embedded systems through a configurable logic and interconnect fabric. FPGAs occupy the programmable-logic portion of the integrated-circuit hierarchy and can shorten development cycles by replacing application-specific gate arrays with reconfigurable devices.
The Spartan-3 architecture provides 29,952 configurable logic cells and 487 user I/O in this 676-BGA configuration. Its 1.2 V core supply and 630 MHz listed performance make it useful for demanding parallel data paths, protocol handling, instrumentation, communications, and embedded control. The package offers substantial pin and routing capacity compared with smaller FPGA packages.
The XC3S1500 combines programmable logic cells, programmable I/O blocks, dedicated memory resources, internal clocking, and configurable interconnect within one device. This architecture permits parallel datapaths and deterministic control logic to coexist on the same FPGA, reducing external component count compared with a design assembled from separate logic devices.
Typical uses include industrial automation, communication equipment, test and measurement, video or image processing, embedded storage systems, and high-performance controller prototypes. Designers can also use it to consolidate several fixed-function logic functions into one reconfigurable device while preserving software or configuration-based field updates.
PCB implementation requires careful BGA-layout practices, including the manufacturer-recommended land pattern, multilayer board construction, controlled-impedance routing, complete power and ground planes, and decoupling close to supply pins. Configuration memory, clocking, JTAG access, I/O standards, and bank-specific voltage requirements must be planned before schematic capture.
This product page combines the listed device specifications, a focused package-aware comparison, practical design guidance, and ordering information for engineers evaluating the XC3S1500-4FG676I for programmable-logic designs.
드롭인 대체품: XC3S1500-4FG676I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: XC3S1500-4FG676I (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Temperature Grade, Package, Product Type, Terminal Count.
XC3S1500-4FG676C
✅ 드롭인가격 문의
데이터시트 보기 →XC3S1500-4FGG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S1500-4FGG676C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC3S1500-5FG676C
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →XC3S1500-5FGG676C
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC3S1500-4FG676I 최대 정격 & 전기적 특성
| Product Type | Spartan-3 Field Programmable Gate Array (FPGA) |
| System Gates | 1,500,000 gates |
| Logic Cells | 29,952 cells |
| Maximum Performance | 630 MHz |
| Core Supply Voltage | 1.2 V |
| User I/O | 487 I/O |
| 패키지 | 676-pin BGA |
| Device Family | Spartan-3 |
| Speed Grade | -4 |
| Temperature Grade | Industrial |
| Programmable Logic Type | SRAM-based FPGA |
| Process Technology | 90 nm |
| 실장 유형 | Surface Mount |
XC3S1500-4FG676I 676-pin bga 핀 구성 가이드
XC3S1500-4FG676I(676-pin bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC3S1500-4FG676I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC3S1500-4FG676I 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Communications and Protocol Bridging, Test and Measurement Systems, Embedded Control and Data Acquisition, Signal Processing and Image Pipelines, Programmable Logic Prototyping.
Industrial Automation Controllers
The XC3S1500-4FG676I fits industrial automation controllers that need substantial parallel logic and extensive external connectivity. Its 29,952 logic cells can organize motion sequencing, machine-state management, interlocks, counters, and communication protocols, while 487 user I/O support encoders, sensors, actuators, and industrial interfaces. The industrial-temperature suffix supports deployment in temperature-variable factory equipment. Place the 676-pin BGA on a multilayer control board, keep power and ground distribution continuous, and isolate timing-sensitive I/O according to the selected bank voltages.
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Communications and Protocol Bridging
The XC3S1500-4FG676I is suitable for communications equipment requiring simultaneous handling of multiple interfaces and wide parallel data paths. Its 29,952 logic cells and 487 user I/O can support frame processing, buffering, clock-domain crossing, protocol conversion, and test logic within one programmable device. The listed 630 MHz performance is useful for pipelined datapaths, while the 1.2 V core supply simplifies modern digital power planning. Designers should assign pins by I/O-bank capability and preserve timing margins for high-speed interfaces.
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Test and Measurement Systems
The XC3S1500-4FG676I can implement the parallel acquisition, sequencing, trigger, and pattern-generation logic found in sophisticated test equipment. Its 29,952 logic cells allow multiple instrument channels to share a programmable architecture, and 487 user I/O provide connections to converters, relay matrices, and acquisition hardware. The listed 630 MHz speed supports timing-rich digital functions, while industrial-temperature ordering suits laboratory and production equipment operating in varied ambient conditions.
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Embedded Control and Data Acquisition
The XC3S1500-4FG676I can consolidate embedded control, acquisition, and data-processing functions into one FPGA-based platform. A design can use its 29,952 logic cells for sensor conditioning logic, digital filtering, control sequencing, and local data movement, while 487 user I/O connect external sensors and actuators. The device's 1.2 V core supply and listed 630 MHz performance support a compact modern implementation. Plan configuration memory, clocking, I/O voltage banks, and JTAG access during the architecture phase.
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Signal Processing and Image Pipelines
The XC3S1500-4FG676I supports parallel signal-processing pipelines because its 29,952 logic cells and listed 630 MHz performance can implement filters, counters, lookup logic, and control state machines. The 487 user I/O provide broad connectivity to sensors, converters, memory interfaces, and external processing elements. This makes the device applicable to industrial imaging, waveform analysis, and specialized signal conditioning. Designers should pipeline critical paths, register high-speed interfaces, and apply appropriate timing constraints to every clock domain.
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Programmable Logic Prototyping
The XC3S1500-4FG676I is useful for prototyping substantial digital systems before custom silicon becomes economical. Its 1.5 million system gates, 29,952 logic cells, and 487 user I/O allow multiple processor interfaces, bus bridges, storage controllers, and test features to be evaluated in one FPGA. The 676-pin BGA provides access to a large I/O count but demands careful escape-routing and assembly planning. Engineers should preserve the same pin constraints and interfaces as the target ASIC whenever possible.
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추천 제품 요약
엔지니어링 참조 데이터: XC3S1500-4FG676I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC3S1500-4FG676C | XC3S1500-4FGG676I | XC3S1500-4FGG676C | XC3S1500-5FG676C | XC3S1500-5FGG676C |
|---|---|---|---|---|---|---|
| Package | 676-pin BGA | 676-pin BGA | 676-pin BGA | 676-pin BGA | 676-pin BGA | 676-pin BGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| Logic Cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells | 29,952 cells |
| Speed Grade | -4 | -4 | -4 | -4 | -5 | -5 |
| Temperature Grade | Industrial | Commercial | Industrial | Commercial | Commercial | Commercial |
주요 차별점
- Industrial-temperature suffix (vs XC3S1500-4FG676C)
- Original FG ordering structure (vs XC3S1500-4FGG676I)
- Lower listed speed grade with established continuity (vs XC3S1500-5FG676C)
설계 노트
Implement the 676-pin BGA on a multilayer PCB using the exact manufacturer package drawing and recommended stack-up. Continuous power and ground planes should be placed close to the device to minimize loop inductance and provide high-current return paths. Escape-route configuration, clock, JTAG, and user I/O signals according to the official recommendations, and validate the stack-up against the selected I/O standards and anticipated 630 MHz device performance.
Plan the 1.2 V core rail as a dedicated, low-noise supply and verify all required I/O-bank voltages independently. Place decoupling capacitance at the device power balls with very short current paths, and provide additional bulk capacitance near the power-source section of the board. Use separate filtering for sensitive supply domains if required, and account for startup current, configuration behavior, and the voltage ramps required by the manufacturer guidance.
Create a timing plan before assigning high-speed user I/O. The XC3S1500-4FG676I has 487 user I/O, but pin availability and usable voltage standards depend on the selected bank configuration. Apply the manufacturer's I/O timing constraints, avoid routing high-speed signals over split power planes, and use source-synchronous or clock-forwarding techniques where supported. Review all clock domains with static timing analysis after placement.
Do not approve XC3S1500-4FG676C as a replacement solely because it has the same 676-BGA format; its commercial-temperature grade may be unsuitable for the target environment. Likewise, distinguish FGG and FG ordering suffixes and verify their package attributes. Confirm the exact ball map, configuration interface, voltage requirements, and qualification status. Similar family names do not by themselves prove that every board and firmware configuration remains interchangeable.
규정 준수 정보
No explicit compliance designation for the exact XC3S1500-4FG676I ordering code was established. The FGG ordering variants referenced by cross-reference material are associated with RoHS-compliant and lead-free construction, but those claims are not assigned to the FG target.
