XC6SLX45T-2FG484C - 43,661-Cell Spartan-6 LXT | AMD
料号： XC6SLX45T-2FG484C ✓ 量产中XC6SLX45T-2FG484C 概述
An FPGA is a semiconductor whose internal digital logic, interconnect, memory blocks, and I/O paths are configured after manufacture. A field-programmable gate array belongs to the programmable-logic hierarchy, combining parallel digital processing resources with configurable peripherals. Spartan-6 devices add DSP slices and block RAM, allowing one package to implement control logic, signal processing, data acquisition, and communication functions without combining several discrete components.
The XC6SLX45T-2FG484C provides 43,661 logic cells organized into 3,411 configurable logic blocks. Its 296 I/Os support communication with external processors, memories, converters, transceivers, and display or control peripherals. The device uses a 1.2 V supply, while its 484-pin BGA package accommodates the substantial pin count needed for high-density parallel interfaces. A -2 speed grade is identified directly by the ordering code.
For digital signal processing, the programmable architecture can combine parallel data paths with dedicated DSP48 resources and block RAM. This architecture is useful when a design needs deterministic sampling, filtering, waveform generation, or fixed-point arithmetic without relying on a separate DSP processor. Parallel configurable logic also supports bus arbitration, protocol conversion, state machines, and high-speed control functions within a single device.
Typical uses include industrial automation, communications infrastructure, test and measurement equipment, embedded imaging, audio processing, and high-volume control systems. The 484-ball package is particularly appropriate for boards that need many external signals and cannot fit the pin count of a smaller FPGA. Designs should still account for board-space, heat-spreading, routing-density, and power-supply requirements associated with a large BGA device.
A key implementation consideration is the distinction between the 43,661-cell XC6SLX45T design point and smaller or newer programmable-logic families. Before migration, validate pin assignments, clocking, memory interfaces, configuration data, I/O standards, and timing constraints. Use the AMD Spartan-6 package pinout files and device documentation when assigning every ball and planning the PCB footprint.
This product page combines the confirmed device identity and package details with practical application guidance, alternative-part comparisons, and design-focused selection criteria. It is intended to help engineers determine whether the XC6SLX45T-2FG484C fits an existing Spartan-6 design and how temperature-grade or speed-grade alternatives affect qualification and reuse.
直接替换替代料： XC6SLX45T-2FG484C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC6SLX45T-2FG484C （相同外形与封装尺寸） ——差异在于 Device Type, Package, Package Type, Logic Cells, Speed Grade.
XC6SLX45T-2FGG484I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45T-3FGG484C
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45T-3FGG484I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45T-N3FG484I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX45-2FGG484C
✅ 直接替换联系询价
查看数据手册 →XC6SLX45T-2FG484C 最大额定值与电气特性
| Device Type | Spartan-6 LXT Field-Programmable Gate Array |
| Logic Cells | 43,661 cells |
| Configurable Logic Blocks | 3,411 CLBs |
| User I/O Count | 296 I/Os |
| Core Supply Voltage | 1.2 V |
| Manufacturing Technology | 45 nm CMOS |
| 封装 | 484-pin FBGA |
| Performance Grade | -2 speed grade |
| Temperature-Grade Code | C commercial grade |
| Programmable Logic Technology | 45 nm FPGA technology |
| FPGA Family | Spartan-6 LXT |
| Device Category | Field-programmable gate array |
| Package Ball Count | 484 balls |
| 安装类型 | Surface mount |
| RoHS 状态 | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
XC6SLX45T-2FG484C 484 balls 引脚配置指南
XC6SLX45T-2FG484C（484 balls 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC6SLX45T-2FG484C.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC6SLX45T-2FG484C 适用于 6 应用s: Industrial Automation Controller, Communications Signal Processing, Test and Measurement Equipment, Embedded Data Acquisition, Audio and DSP Processing, Embedded Communications Gateway.
Industrial Automation Controller
The XC6SLX45T-2FG484C fits an industrial automation controller because it combines 43,661 logic cells, 3,411 configurable logic blocks, and 296 I/Os in one programmable device. Those resources can coordinate sensor inputs, motor-control sequencing, interlocks, communications, and diagnostics without splitting every function among separate processors. The -2 grade supports timing-sensitive control logic, while the 484-pin FBGA provides enough external connections for parallel digital I/O and multiple peripheral buses. For production equipment, confirm that the commercial temperature option covers the enclosure ambient and review the timing margin, power estimate, and industrial lifecycle plan before release.
推荐
Communications Signal Processing
The XC6SLX45T-2FG484C is suitable for communications signal-processing modules that combine programmable logic with parallel data paths. Its 43,661 logic cells can implement framing, channelization, filtering control, and interface protocols, while the device's DSP and memory resources can accelerate suitable arithmetic stages. The 296 I/Os allow direct connection to transceivers, converters, clocks, and test equipment without excessive multiplexing. The -2 grade should be checked against worst-case transceiver timing and synchronization paths, and the PCB should provide controlled clocks, decoupled supplies, and short return paths for high-speed interfaces.
推荐
Test and Measurement Equipment
The XC6SLX45T-2FG484C can serve as the control and pattern-generation core in test and measurement equipment. Parallel programmable logic supports instrument sequencing, trigger routing, status aggregation, and data capture, while 296 I/Os provide broad connectivity to converters, relays, memory devices, and communication controllers. The 43,661-cell capacity allows a single FPGA to combine control functions with configurable DSP or memory-based data processing. Because the -2 grade is a defined performance class rather than a guarantee for every interface, timing closure should be performed for the highest-rate acquisition or trigger path, including board skew and clock uncertainty.
推荐
Embedded Data Acquisition
The XC6SLX45T-2FG484C fits embedded acquisition systems that must collect, filter, and route multiple parallel data streams. Its 296 I/Os can connect ADC and DAC interfaces directly, and its 43,661 logic cells provide control, buffering, channel multiplexing, and protocol conversion around the sampling pipeline. Dedicated programmable resources also allow a design to implement parallel filtering or decimation without a separate DSP package. Board design should account for simultaneous switching noise, input settling, clock distribution, and analog isolation; the power estimate should reflect the actual I/O activity rather than only logic utilization.
推荐
Audio and DSP Processing
The XC6SLX45T-2FG484C is appropriate for audio and general digital signal-processing products where filters, mixing, modulation, or waveform generation must share a single programmable platform. Its Spartan-6 architecture provides configurable logic alongside DSP48 and block-RAM resources, and the -2 grade offers a defined speed class for timing analysis. The 296 I/Os can connect audio converters, control interfaces, and synchronization signals with less external routing than a smaller FPGA. Validate audio-clock jitter, sample-rate conversion boundaries, memory timing, and thermal performance; the device should not be selected solely by logic-cell count when deterministic DSP throughput is the governing requirement.
推荐
Embedded Communications Gateway
The XC6SLX45T-2FG484C can serve as an embedded communications gateway that bridges multiple serial or parallel interfaces while performing packet handling and protocol conversion. Its 43,661 logic cells and 296 I/Os allow multiple channels, buffering logic, and supervisory functions to share one FPGA, reducing the component count in compact industrial systems. The -2 performance grade supports deterministic parallel processing, but external PHY timing and board-level skew still require analysis. A robust implementation should isolate clocks, use controlled-impedance routing for high-speed links, provide local decoupling for every supply rail, and verify reset, boot, and configuration behavior across all operating states.
推荐
推荐产品汇总
工程参考数据： XC6SLX45T-2FG484C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX45T-2FGG484I | XC6SLX45T-3FGG484C | XC6SLX45T-3FGG484I | XC6SLX45T-N3FG484I |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 484-pin FBGA | 484-pin FBGA - same package class | 484-pin FBGA - same package class | 484-pin FBGA - same package class | 484-pin FBGA - same package class |
| FPGA Family | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT | Spartan-6 LXT |
| Logic Cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells |
| Performance Grade | -2 | -2 | -3 | -3 | N3 |
| Temperature Suffix | C commercial grade | I industrial-grade suffix | C commercial-grade suffix | I industrial-grade suffix | I industrial-grade suffix |
| Special Feature | -2 commercial-temperature ordering option | Industrial-temperature ordering option | -3 speed grade with commercial-temperature suffix | -3 speed grade with industrial-temperature suffix | N3 designation with industrial-temperature suffix |
关键差异点
- Established 43,661-cell Spartan-6 LXT resource level （对比 XC6SLX45T-3FGG484C)
- Lower speed grade than the -3 alternatives （对比 XC6SLX45T-3FGG484I)
- Commercial-temperature ordering option （对比 XC6SLX45T-2FGG484I)
- Large 484-pin FBGA interface capacity （对比 XC6SLX45T-N3FG484I)
设计说明
Use the exact AMD 484-pin package drawing and ball map to create the PCB footprint. Confirm body dimensions, ball diameter, land pattern, solder-mask definition, and paste apertures before releasing fabrication files. A nominal package description is not enough for a large BGA because even a small ball-pitch or land-size error can affect solderability. Validate the footprint against the assembled board using the manufacturer's package data and inspect the X-ray and cross-section criteria appropriate for the fabrication facility.
Plan separate, locally decoupled supplies for the 1.2 V core and any external I/O supply rails. Place the required input and bulk capacitors at the power balls identified in the AMD pinout documentation, keep each connection short, and provide adequate via arrays at BGA power balls. Power estimation must reflect actual logic utilization, clock rates, memory activity, and I/O standards because a lightly configured design and a fully routed parallel interface can produce materially different demand. Validate the result against worst-case ambient and temperature conditions.
Treat configuration, clock, and high-speed interface routing as separate layout concerns. Keep the configuration path away from sensitive signals, maintain continuous return-plane references, and follow AMD guidance for each supported configuration mode. Use dedicated clock-capable routing where required and observe the intended clock region's boundaries. For parallel interfaces, account for package skew and board delay in the timing budget; identical logic-cell counts do not guarantee identical interface timing across different package codes or speed grades.
The 484-pin FBGA can concentrate heat around the die while presenting limited top-side escape area. Use the package thermal data and an appropriate copper spreading pattern rather than relying only on exposed component height for cooling. A thermal estimate should combine package thermal resistance, actual power dissipation, ambient temperature, enclosure airflow, and the board's copper area. Recheck the junction-temperature margin at the highest expected I/O activity and consider a heat spreader when the calculated margin is insufficient.
Do not interchange -2, -3, or N3 performance designations without rerunning timing and power analysis. Likewise, the C and I suffixes affect the intended temperature range even when the family, logic-cell count, and package appear similar. Confirm the complete ordering code, configuration bitstream compatibility, package ball map, and lifecycle status before using an alternative. A footprint-compatible device can still create a functional or qualification problem if its speed, temperature, or operating-status requirements differ.
合规信息
The commercial C suffix identifies a temperature-grade option rather than a documented automotive qualification. Lead-free, RoHS, REACH, halogen-free, and conflict-minerals statuses were not stated in the cited material and remain unknown.