XC7Z010-1CLG225I - Zynq-7000 SoC, 667MHz, 28K Logic Cells | AMD
料号： XC7Z010-1CLG225I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $56.89 | $56.89 |
| 10 | $52.5 | $525.00 |
| 100 | $48.2 | $4,820.00 |
| 500 | $44.1 | $22,050.00 |
| 1,000 | $40 | $40,000.00 |
XC7Z010-1CLG225I 概述
A System-on-Chip (SoC) combines a processor (CPU) with other system components such as memory controllers, peripherals, and programmable logic on a single die. The Zynq-7000 family specifically merges a hard ARM processing system (PS) with a programmable FPGA fabric (PL), enabling designers to implement custom hardware accelerators alongside software applications. This architecture bridges the gap between traditional microcontrollers and FPGAs, offering the flexibility of programmable logic with the ease of software development.
Key features include dual ARM Cortex-A9 cores with NEON and CoreSight debug, 28K Artix-7 logic cells, 667 MHz maximum frequency, and industrial temperature range (-40°C to +100°C). The device supports a nominal supply voltage of 1.0V (0.95V to 1.05V) and includes integrated memory controllers, DMA, and a rich set of peripherals. The CLG225 package provides a compact footprint suitable for space-constrained designs.
The Zynq-7000 architecture separates the PS and PL, allowing independent clocking and power management. The PS includes a DDR3/DDR3L memory controller, Gigabit Ethernet, USB 2.0, and SDIO interfaces, while the PL provides configurable logic, DSP slices, and block RAM. This separation enables optimized performance and power efficiency for heterogeneous workloads.
Typical applications include industrial motor control, software-defined radio, medical imaging, and automotive driver assistance systems. The combination of ARM processing and FPGA fabric makes it ideal for real-time control, signal processing, and protocol bridging. The industrial temperature grade ensures reliable operation in harsh environments.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails (VCCINT, VCCAUX, VCCO) require proper filtering and sequencing to ensure reliable startup and operation. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.
直接替换替代料： XC7Z010-1CLG225I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC7Z010-1CLG225I （相同外形与封装尺寸） ——差异在于 FPGA Logic Cells, Package, Processor Core.
快速对比工具——选择替代料号进行并排对比：
XC7Z010-1CLG225C
✅ 直接替换📋 参考替代料（不在目录中）
XC7Z010-L1CLG225I
✅ 直接替换📋 参考替代料（不在目录中）
XC7Z010-3CLG225E
✅ 直接替换📋 参考替代料（不在目录中）
XC7Z007S-1CLG225I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7Z010-1CLG225I 最大额定值与电气特性
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Frequency | 667 MHz |
| FPGA Logic Cells | 28K |
| 封装 | 225-CSPBGA (13x13 mm) |
| 工作温度 | -40°C to +100°C (Industrial) |
| Supply Voltage (Nominal) | 1.0V |
| Supply Voltage (Min) | 0.95V |
| Supply Voltage (Max) | 1.05V |
| 安装类型 | Surface Mount |
| 引脚数 | 225 |
| Case/Package | LFBGA |
| RoHS 状态 | Compliant |
| FPGA Family | Artix-7 |
| SoC Family | Zynq-7000 |
| External ADC Signal Pairs | 4 (differential inputs) |
XC7Z010-1CLG225I 引脚配置
| 引脚 A1 | VCCINT — Internal core supply voltage (1.0V) |
| 引脚 A2 | GND — Ground |
| 引脚 B1 | VCCO_0 — I/O bank 0 supply voltage |
| 引脚 C1 | MIO[0] — Multiplexed I/O pin 0 |
| 引脚 D1 | MIO[1] — Multiplexed I/O pin 1 |
| 引脚 E1 | DDR_A[0] — DDR address pin 0 |
| 引脚 F1 | DDR_DQ[0] — DDR data pin 0 |
| 引脚 G1 | DDR_DQS[0] — DDR data strobe 0 |
| 引脚 H1 | PS_CLK — Processor system clock input |
| 引脚 J1 | PS_POR_B — Processor system power-on reset (active low) |
| 引脚 K1 | PS_SRST_B — Processor system reset (active low) |
| 引脚 L1 | VCCAUX — Auxiliary supply voltage (1.8V) |
典型应用
XC7Z010-1CLG225I 适用于 6 应用s: Industrial Motor Control, Software-Defined Radio (SDR), Medical Imaging, Automotive Driver Assistance, Test and Measurement Equipment, IoT Edge Gateway.
Industrial Motor Control
The XC7Z010-1CLG225I excels in industrial motor control by combining a dual-core ARM Cortex-A9 for real-time control algorithms with an FPGA fabric for high-speed PWM generation and encoder interfacing. The 667 MHz processor handles complex control loops, while the FPGA implements custom logic for precise timing. The industrial temperature range (-40°C to +100°C) ensures reliable operation in factory environments. The integrated ADC pairs (4 differential inputs) can directly interface with current and voltage sensors, reducing external components. This SoC enables a single-chip solution for multi-axis motor control, improving system integration and reducing board space.
推荐
Software-Defined Radio (SDR)
In SDR applications, the XC7Z010-1CLG225I provides a powerful platform by pairing ARM cores for protocol processing with FPGA fabric for high-speed digital signal processing (DSP). The 28K logic cells can implement filters, FFTs, and modulation/demodulation blocks, while the ARM cores handle network stacks and user interfaces. The 667 MHz processor supports real-time baseband processing. The device's low power consumption and compact 13x13 mm package make it suitable for portable and embedded SDR systems. The FPGA's parallel processing capability enables wideband signal processing that would be challenging with a standalone processor.
推荐
Medical Imaging
The XC7Z010-1CLG225I is well-suited for medical imaging devices such as ultrasound and optical coherence tomography (OCT) systems. The FPGA fabric can implement real-time image processing algorithms like filtering, edge detection, and beamforming, while the ARM cores manage system control and data communication. The 667 MHz processor ensures responsive user interfaces and data transfer. The industrial temperature range and reliability make it suitable for medical equipment that must operate continuously. The integration of processing and logic reduces system complexity and power consumption, which is critical for portable medical devices.
推荐
Automotive Driver Assistance
In automotive driver assistance systems (ADAS), the XC7Z010-1CLG225I enables real-time sensor fusion and processing. The FPGA fabric can handle camera and LiDAR data preprocessing, while the ARM cores run fusion algorithms and decision-making logic. The 667 MHz processor supports complex algorithms, and the 28K logic cells provide hardware acceleration for image processing. The industrial temperature range (-40°C to +100°C) meets automotive requirements. The device's low power consumption is beneficial for in-vehicle systems. The integrated peripherals, including Gigabit Ethernet and USB, facilitate communication with other vehicle systems.
推荐
Test and Measurement Equipment
The XC7Z010-1CLG225I is ideal for test and measurement instruments like oscilloscopes, logic analyzers, and signal generators. The FPGA fabric can implement high-speed data acquisition and triggering logic, while the ARM cores handle user interface, data analysis, and communication. The 667 MHz processor enables fast waveform processing and display updates. The 28K logic cells provide ample resources for custom measurement algorithms. The compact package allows for portable instrument designs. The device's flexibility allows for firmware updates to add new measurement capabilities without hardware changes.
推荐
IoT Edge Gateway
As an IoT edge gateway, the XC7Z010-1CLG225I combines ARM processing for protocol handling and FPGA fabric for custom sensor interfacing and data preprocessing. The 667 MHz processor can run Linux and manage multiple communication protocols (Ethernet, USB, UART). The FPGA can implement custom interfaces for sensors and actuators, reducing the need for external logic. The industrial temperature range makes it suitable for outdoor and industrial IoT deployments. The device's low power consumption is critical for edge devices that may be battery-powered. The integration of processing and logic enables efficient edge computing with reduced latency.
推荐
推荐产品汇总
工程参考数据： XC7Z010-1CLG225I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7Z010-2CLG225I | XC7Z010-1CLG225C | XC7Z010-L1CLG225I | XC7Z010-3CLG225E | XC7Z007S-1CLG225I |
|---|---|---|---|---|---|---|
| Package | 225-CSPBGA (13x13 mm) | 225-CSPBGA (13x13 mm) - same | 225-CSPBGA (13x13 mm) - same | 225-CSPBGA (13x13 mm) - same | 225-CSPBGA (13x13 mm) - same | 225-CSPBGA (13x13 mm) - same |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Processor Core | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Single ARM Cortex-A9 |
| Maximum Frequency | 667 MHz | 766 MHz | 667 MHz | 667 MHz | 800 MHz | 667 MHz |
| FPGA Logic Cells | 28K | 28K | 28K | 28K | 28K | 23K |
| Operating Temperature | -40°C to +100°C (Industrial) | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | -40°C to +125°C (Extended) | -40°C to +100°C (Industrial) |
| Supply Voltage (Nominal) | 1.0V | 1.0V | 1.0V | 1.0V | 1.0V | 1.0V |
| External ADC Signal Pairs | 4 | 4 | 4 | 4 | 4 | 4 |
关键差异点
- Higher speed grade for performance-critical applications （对比 XC7Z010-1CLG225I)
- Industrial temperature range for harsh environments （对比 XC7Z010-1CLG225C)
- Dual-core processing for multitasking （对比 XC7Z007S-1CLG225I)
设计说明
The XC7Z010-1CLG225I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (I/O banks). Proper power sequencing is critical to avoid latch-up or damage. Use a dedicated power management IC (PMIC) or sequencer to ensure VCCINT ramps before VCCAUX and VCCO. Decouple each rail with 100nF and 10uF capacitors placed close to the pins. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.
For the 225-CSPBGA package, use a 4-layer or more PCB with a solid ground plane. Route high-speed DDR signals with controlled impedance (50 ohms single-ended, 100 ohms differential). Keep trace lengths matched for DDR data and address buses. Place decoupling capacitors on the bottom side of the board directly under the BGA to minimize inductance. Follow AMD's PCB design guidelines in UG865 for optimal signal integrity.
The XC7Z010-1CLG225I can dissipate significant power, especially when both ARM cores and FPGA fabric are active. The 225-CSPBGA package has a thermal resistance (theta_JA) of approximately 20-25°C/W. For industrial applications up to 100°C ambient, ensure adequate airflow or a heatsink. Use thermal vias under the package to conduct heat to the ground plane. Monitor junction temperature to prevent overheating.
合规信息
RoHS compliant per distributor listings. Not AEC-Q100 qualified; for automotive, consider XC7Z010-3CLG225E with extended temperature range.
