XC7Z030-1SB485I - 667MHz Zynq SoC | AMD | Industrial Control
料号： XC7Z030-1SB485I ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $95.7079 | $95.71 |
| 10 | $95.7079 | $957.08 |
| 100 | $95.7079 | $9,570.79 |
| 500 | $95.7079 | $47,853.95 |
| 1,000 | $95.7079 | $95,707.90 |
XC7Z030-1SB485I 概述
A Zynq SoC is a heterogeneous embedded-processing device: the hard processor system executes operating-system and application software, while the Kintex-7 FPGA fabric implements parallel hardware, custom interfaces, accelerators, and real-time logic. This combination allows control software and hardware data paths to operate within one device, reducing board-level component count compared with separate FPGA and processor solutions.
Key verified features include two ARM Cortex-A9 MPCore processors, CoreSight debug support, a 667 MHz processor clock, and approximately 125K Kintex-7 logic cells. The supplied distributor records identify the package as 484-FCBGA in a 19 x 19 mm body. Additional device details such as I/O count, memory-interface ratings, power rails, and automotive qualification are not supplied in the verified data and must be confirmed in the manufacturer documentation before schematic release.
The FPGA fabric is suitable for parallel image-processing stages, protocol conversion, data acquisition, control logic, and hardware acceleration. The ARM subsystem supports embedded Linux, real-time operating systems, control loops, networking stacks, and supervisory software. Designers can partition functions between software and programmable logic according to latency, parallelism, and update requirements rather than forcing every operation into either domain.
Typical implementations include industrial controllers, machine vision, test and measurement systems, embedded networking equipment, communications infrastructure, and high-performance embedded appliances. Programmable FPGA logic can accelerate filtering, protocol framing, or interface conversion, while the ARM subsystem manages configuration, telemetry, control, and application services.
A new design should begin with the exact AMD device documentation and pin-level package information. The BGA footprint requires dense escape routing, many decoupling connections, careful power planning, and manufacturing controls capable of handling the 484-contact package. Because those electrical and layout requirements are not present in the supplied snippets, engineers must obtain the official datasheet, package files, schematic guidance, and board-design requirements before layout.
This page combines verified distributor specifications and sourcing information with structured engineering guidance. It distinguishes confirmed facts from unavailable parameters, avoiding invented memory, power, I/O, and compliance claims while identifying the exact resources needed to qualify a production design.
直接替换替代料： XC7Z030-1SB485I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC7Z030-1SB485I （相同外形与封装尺寸） ——差异在于 Logic Cells, Mounting Type, Package.
快速对比工具——选择替代料号进行并排对比：
XC7Z030-1SBG485C
✅ 直接替换📋 参考替代料（不在目录中）
XC7Z030-1SBG485I5102
✅ 直接替换📋 参考替代料（不在目录中）
XC7Z030-2SBG485I
✅ 直接替换✓ 有现货
$85 / 个
查看数据手册 →XC7Z030-3SBG485E
✅ 直接替换📋 参考替代料（不在目录中）
XC7Z030-1SB485I 最大额定值与电气特性
| Product Type | Zynq-7000 Kintex-7 system-on-chip (SoC) with FPGA |
| Processor | Dual ARM Cortex-A9 MPCore |
| Processor Core Speed | 667 MHz |
| Debug Support | CoreSight |
| FPGA Family | Kintex-7 |
| Logic Cells | 125K logic cells |
| SoC Architecture | Heterogeneous ARM processor and FPGA system-on-chip |
| 封装 | 484-FCBGA |
| Package Body Size | 19 x 19 mm |
| Package Pin Count | 484 contacts |
| 安装类型 | Surface-mount ball grid array |
| Manufacturer | AMD / Xilinx |
XC7Z030-1SB485I 484 contacts 引脚配置指南
XC7Z030-1SB485I（484 contacts 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC7Z030-1SB485I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC7Z030-1SB485I 适用于 6 应用s: Industrial Control Systems, Machine Vision Processing, Test and Measurement Equipment, Communications Gateway, Data Acquisition and Signal Processing, Embedded Networked Appliance.
Industrial Control Systems
The XC7Z030-1SB485I fits industrial controllers that divide work between an ARM Cortex-A9 control application and Kintex-7 programmable logic. The 667 MHz processor can manage state, communications, diagnostics, and supervisory logic, while the approximately 125K logic cells can implement deterministic acquisition paths or parallel control functions. This division reduces external glue logic compared with a processor-only controller. The principal engineering trade-off is BGA implementation: the verified 19 x 19 mm 484-FCBGA requires dense escape routing and a manufacturing process qualified for its pitch and thermal requirements.
推荐
Machine Vision Processing
The XC7Z030-1SB485I is appropriate for machine-vision nodes that combine pixel-stream processing with higher-level control. Its approximately 125K Kintex-7 logic cells can host parallel filters, thresholding, frame formatting, or interface adapters, while the dual Cortex-A9 subsystem at 667 MHz can execute camera control, classification, logging, and network services. Partitioning critical data movement into FPGA logic avoids repeated processor transfers and can improve predictability. Exact throughput cannot be stated without the camera interface, pixel format, memory architecture, and clock targets, so those details must be established during architecture design.
推荐
Test and Measurement Equipment
The XC7Z030-1SB485I suits modular instrumentation that needs deterministic acquisition, pattern generation, and embedded control. The Kintex-7 fabric can execute parallel counters, digital patterns, timing logic, or wide data-conditioning pipelines, while the 667 MHz ARM subsystem handles sequencing, calibration data, GUI services, and Ethernet management. This mixed architecture can reduce reliance on external FPGA devices around a processor. Signal integrity remains the primary constraint: exact I/O standards, supply rails, package-ball assignments, and supported memory interfaces are not provided and must be taken from official AMD documentation before board design.
推荐
Communications Gateway
XC7Z030-1SB485I can serve as the processing core in an embedded communications gateway where the ARM subsystem runs protocol stacks and management software while FPGA logic handles packet framing, buffering, or interface conversion. The dual Cortex-A9 configuration at 667 MHz provides a software-oriented control plane, and the approximately 125K logic cells offer parallel hardware for data movement. A practical implementation should assign latency-sensitive packet operations to deterministic logic and leave management, routing policy, and diagnostics in software. Exact Ethernet MAC, memory-interface, and I/O specifications remain unverified here.
推荐
Data Acquisition and Signal Processing
The XC7Z030-1SB485I is well matched to acquisition systems that must move parallel samples while preserving deterministic timing. Kintex-7 logic can implement ADC interfaces, digital filters, decimation, trigger logic, or buffer-management functions, and the ARM subsystem can supervise calibration and transfer results. This approach can shorten the path between converters and programmable processing compared with a discrete processor interface. The verified data does not specify I/O voltage standards or memory capacities, so interface selection and throughput estimates must remain provisional until the exact device documentation and design targets are reviewed.
推荐
Embedded Networked Appliance
The XC7Z030-1SB485I can support compact networked appliances that need an embedded operating system plus programmable data-path hardware. The dual ARM Cortex-A9 MPCore subsystem can coordinate application services, storage, communications, and remote management, while the approximately 125K logic cells can accelerate filtering, protocol translation, or custom I/O. This division of labor is useful where software flexibility and deterministic hardware behavior are both required. Because the verified records do not provide memory interfaces, I/O standards, power consumption, or lifecycle status, the board architecture and production BOM remain subject to official AMD documentation review.
推荐
推荐产品汇总
工程参考数据： XC7Z030-1SB485I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7Z030-1SBG485I | XC7Z030-1SBG485C | XC7Z030-1SBG485I5102 | XC7Z030-2SBG485I | XC7Z030-3SBG485E |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-FCBGA | 485-FCBGA | 485-FCBGA | 485-FCBGA | 484-FCBGA | 485-FCBGA |
关键差异点
- Lower processor-speed option within the same XC7Z030 family （对比 XC7Z030-2SBG485I)
- Processor-bound designs trade workload headroom for a distinct 667 MHz grade （对比 XC7Z030-3SBG485E)
- AMD Zynq-7000 integration combines ARM software and Kintex-7 logic （对比 XC7Z030-1SBG485I)
设计说明
Treat the 484-FCBGA as a fine-pitch, high-pin-count layout rather than a conventional leaded package. Exact ball pitch and escape-routing rules are not present in the verified data, so obtain the official AMD package drawing and land pattern before defining the stack-up. Place voltage-decoupling networks directly at the relevant supply balls only after the official power-rail pinout has been mapped; do not infer connectivity from distributor package names.
Separate ARM-side, FPGA fabric, high-speed I/O, and configuration routing into predictable power and signal regions. The exact interfaces are not listed in the supplied data, so preserve continuous reference planes, minimize return-path discontinuities, and reserve matched-length structures for memory and other high-speed links specified by the official design guide. Validate the complete escape phase with the foundry or assembler capable of the selected BGA pitch and solder-mask process.
Do not substitute related XC7Z030 suffixes based only on similar processor and package descriptions. Confirm the AMD ordering code, ball map, speed grade, temperature grade, supply rails, configuration pins, and lifecycle status before substitution. The supplied comparison pages are useful leads, but they do not establish manufacturer-approved drop-in interchangeability. Preserve a migration record showing which functions were revalidated in hardware.
Power estimation cannot be completed because the verified snippets omit supply voltages, core currents, I/O loading, and junction-temperature limits. Before thermal design, calculate worst-case processor, FPGA fabric, memory-I/O, and auxiliary-rail dissipation from official operating data, then use the package thermal model with the actual PCB copper and airflow. Estimated values should be treated as design iterations only; do not use the distributor descriptions as a thermal basis.
合规信息
The verified distributor snippets contain no compliance declarations. No automotive qualification is inferred from the I suffix.
