XC7Z030-2SBG485I - Zynq-7000 SoC, 125K Logic Cells | AMD
料号： XC7Z030-2SBG485I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $112.7482 | $112.75 |
XC7Z030-2SBG485I 概述
A System-on-Chip (SoC) is an integrated circuit that consolidates all components of a computer or other electronic system into a single chip. The Zynq-7000 family specifically merges a hard ARM-based processing system (PS) with programmable logic (PL), allowing designers to implement custom hardware accelerators alongside software applications. This architecture enables high-performance, low-latency processing that is not achievable with traditional microprocessors or FPGAs alone.
Key features of the XC7Z030-2SBG485I include 125,000 logic cells, dual ARM Cortex-A9 cores running at 800 MHz, and a 28nm process technology. The device supports a wide range of I/O standards and includes high-speed transceivers for serial communication. The 'I' suffix indicates an industrial temperature grade, with an operating range of -40°C to +100°C, making it suitable for harsh environments.
From a technical perspective, the Zynq-7000 architecture provides a high-bandwidth interconnect between the PS and PL, enabling efficient data transfer. The device includes a memory management unit (MMU) for the ARM cores, as well as a rich set of peripherals including USB, Ethernet, and SPI. The programmable logic can be configured to implement custom peripherals, DSP blocks, or even soft-core processors, offering unparalleled design flexibility.
Typical applications for the XC7Z030-2SBG485I include software-defined radio, motor control, image processing, and automotive driver assistance systems. The combination of a powerful processor and reconfigurable logic makes it an excellent choice for systems that require both high-level control and real-time signal processing.
When designing with this device, careful attention must be paid to power supply decoupling and thermal management. The FCBGA package requires a well-designed PCB with adequate ground planes and thermal vias to ensure reliable operation at high temperatures.
直接替换替代料： XC7Z030-2SBG485I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
XC7Z030-3SBG485I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7Z035-2SBG485I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7Z045-2SBG485I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7Z030-2SBG485I 最大额定值与电气特性
| Family | Zynq-7000 |
| Processor Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Frequency | 800 MHz |
| Logic Cells | 125,000 |
| Process Technology | 28nm |
| 封装 | 484-FCBGA (19x19 mm) |
| 工作温度 | -40°C to +100°C |
| ADC Resolution | 12-bit |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| FPGA Family | Kintex-7 |
| Speed Grade | -2 |
| 生命周期状态 | Active |
XC7Z030-2SBG485I 引脚配置
| 引脚 A1 | VCCINT — Internal core supply voltage |
| 引脚 A2 | GND — Ground |
| 引脚 B1 | IO_L1P_T0 — User I/O bank 0 |
| 引脚 C1 | IO_L1N_T0 — User I/O bank 0 |
| 引脚 D1 | VCCAUX — Auxiliary supply voltage |
| 引脚 E1 | DDR_A[0] — DDR memory address |
| 引脚 F1 | DDR_DQ[0] — DDR memory data |
| 引脚 G1 | MIO[0] — Multiplexed I/O |
| 引脚 H1 | PS_CLK — Processing system clock |
| 引脚 J1 | PS_POR_B — Processing system power-on reset |
| 引脚 K1 | PS_SRST_B — Processing system reset |
| 引脚 L1 | TCK — JTAG clock |
典型应用
XC7Z030-2SBG485I 适用于 6 应用s: Software Defined Radio, Motor Control, Image Processing, Automotive Driver Assistance, Medical Imaging, Industrial IoT Gateway.
Software Defined Radio
The XC7Z030-2SBG485I is ideal for software-defined radio (SDR) systems. Its dual ARM Cortex-A9 cores handle protocol processing, while the Kintex-7 FPGA fabric implements high-speed digital down/up conversion and filtering. The 125K logic cells provide ample resources for complex DSP chains. The 800 MHz processor ensures low-latency control, and the 12-bit ADC supports direct RF sampling. This SoC enables a compact, reconfigurable SDR platform that can adapt to multiple communication standards without hardware changes.
推荐
Motor Control
In motor control applications, the XC7Z030-2SBG485I provides a powerful combination of real-time processing and flexible I/O. The ARM cores can run complex control algorithms like field-oriented control (FOC), while the FPGA fabric implements high-speed PWM generation and encoder interfaces. The 800 MHz clock ensures fast loop closure, and the industrial temperature range (-40°C to +100°C) makes it suitable for factory automation. The programmable logic can also implement safety functions, such as overcurrent protection, with minimal latency.
推荐
Image Processing
The XC7Z030-2SBG485I excels in image processing applications, such as machine vision and medical imaging. The FPGA fabric can implement real-time image filters, edge detection, and feature extraction, offloading these tasks from the ARM processor. The 125K logic cells are sufficient for moderate-complexity vision pipelines. The ARM cores handle higher-level tasks like object recognition and communication. The 12-bit ADC can interface with analog image sensors, and the high-speed transceivers support camera link interfaces.
推荐
Automotive Driver Assistance
For automotive driver assistance systems (ADAS), the XC7Z030-2SBG485I offers the performance and reliability needed for real-time sensor fusion. The ARM cores can run perception algorithms, while the FPGA fabric accelerates pre-processing of camera and LiDAR data. The industrial temperature range ensures operation in extreme conditions. The device's 800 MHz clock and 125K logic cells provide sufficient compute for lane detection and object tracking. The 12-bit ADC can interface with analog sensors, and the device is designed for automotive and medical use.
推荐
Medical Imaging
The XC7Z030-2SBG485I is well-suited for medical imaging devices like ultrasound and CT scanners. The FPGA fabric can implement beamforming and signal processing algorithms, while the ARM cores manage system control and user interface. The 125K logic cells provide enough resources for multi-channel processing. The 800 MHz processor ensures responsive operation, and the industrial temperature range is suitable for medical environments. The device's high-speed transceivers enable fast data transfer to host computers.
推荐
Industrial IoT Gateway
As an industrial IoT gateway, the XC7Z030-2SBG485I can aggregate data from multiple sensors and protocols. The ARM cores run protocol stacks like Modbus and OPC-UA, while the FPGA fabric implements custom sensor interfaces and data preprocessing. The 800 MHz clock provides ample processing power for data aggregation and edge analytics. The 125K logic cells can implement custom communication controllers. The device's industrial temperature range and robust design make it ideal for factory floor deployment.
推荐
推荐产品汇总
工程参考数据： XC7Z030-2SBG485I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7Z030-1SBG485I | XC7Z030-3SBG485I | XC7Z035-2SBG485I | XC7Z045-2SBG485I | XC7Z030-2FFG676I |
|---|---|---|---|---|---|---|
| Package | 484-FCBGA (19x19 mm) | 484-FCBGA (19x19 mm) - same | 484-FCBGA (19x19 mm) - same | 484-FCBGA (19x19 mm) - same | 484-FCBGA (19x19 mm) - same | 676-FCBGA (27x27 mm) - different |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 125,000 | 125,000 | 125,000 | 275,000 | 350,000 | 125,000 |
| Speed Grade | -2 | -1 | -3 | -2 | -2 | -2 |
| Processor Core | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Maximum Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Operating Temperature | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C |
| ADC Resolution | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
关键差异点
- Higher logic density than XC7Z020 （对比 XC7Z020-2CLG484I)
- Industrial temperature grade （对比 XC7Z030-2SBG485C)
- Higher speed grade than XC7Z030-1SBG485I （对比 XC7Z030-1SBG485I)
设计说明
The XC7Z030-2SBG485I requires multiple power rails: VCCINT (internal core), VCCAUX (auxiliary), and VCCO (I/O banks). Proper decoupling is critical. Use a 10uF capacitor for each power pin and a 0.1uF capacitor for high-frequency noise. Refer to the Zynq-7000 PCB Design Guide (UG933) for detailed recommendations. Power sequencing is also important; VCCINT should ramp up before VCCO.
The FCBGA package has a thermal resistance that requires careful management. At 800 MHz with high logic utilization, the device can dissipate several watts. Use a heatsink and ensure adequate airflow. The industrial temperature range (-40°C to +100°C) must be respected. Consider using thermal vias in the PCB to improve heat transfer to the ground plane.
The 484-FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Route DDR memory signals with matched lengths and proper termination. Use a solid ground plane under the device. For the JTAG interface, keep traces short and add pull-up resistors. Follow AMD's layout guidelines in UG933 to ensure signal integrity.
合规信息
RoHS compliant per DigiKey. Not AEC-Q100 qualified; consider XA7Z030 for automotive.
