A3P600L-FGG484I vs A3P600-FGG484 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3P600L-FGG484I بواسطة Microchip Technology و A3P600-FGG484 بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | A3P600L-FGG484I | A3P600-FGG484 |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Product Series | ProASIC3L | — |
| FPGA Family | Flash FPGA | — |
| Total System Gates | 600000 | — |
| Logic Elements | 13824 | — |
| User I/Os | 235 | — |
| Maximum System Performance | 350 MHz | — |
| Core Supply Voltage | 1.2 V to 1.5 V | 1.5 V |
| Technology Node | 130 nm CMOS | — |
| Package Type | 484-ball FBGA (PBGA484) | — |
| Package Dimensions | 23 mm x 23 mm | — |
| Package Height | 2.23 mm | — |
| Ball Pitch | 1 mm | — |
| نوع التركيب | Surface Mount | Surface Mount |
| نطاق درجة حرارة التشغيل | [DATA_NEEDED: industrial grade temperature range] | — |
| حالة RoHS | Compliant (Green) | Lead Free |
| Configuration | Non-volatile flash, instant-on | — |
| Low Power Mode | Flash*Freeze | — |
| Family | — | ProASIC3 |
| System Gates | — | 600K |
| Maximum System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm CMOS |
| User I/O Count | — | 235 |
| العلبة | — | 484-Pin FBGA (FGG484) |
| Configuration Memory | — | Flash-based (non-volatile, single chip) |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |