A3P600L-FGG484I vs A3P600-FGG484 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3P600L-FGG484I sa pamamagitan ng Microchip Technology at A3P600-FGG484 sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3P600L-FGG484I - 600K Gate ProASIC3L FPGA | Microchip
A3P600L-FGG484I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3P600L-FGG484I | A3P600-FGG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Product Series | ProASIC3L | — |
| FPGA Family | Flash FPGA | — |
| Total System Gates | 600000 | — |
| Logic Elements | 13824 | — |
| User I/Os | 235 | — |
| Maximum System Performance | 350 MHz | — |
| Core Supply Voltage | 1.2 V to 1.5 V | 1.5 V |
| Technology Node | 130 nm CMOS | — |
| Package Type | 484-ball FBGA (PBGA484) | — |
| Package Dimensions | 23 mm x 23 mm | — |
| Package Height | 2.23 mm | — |
| Ball Pitch | 1 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: industrial grade temperature range] | — |
| Tindminan RoHS | Compliant (Green) | Lead Free |
| Configuration | Non-volatile flash, instant-on | — |
| Low Power Mode | Flash*Freeze | — |
| Family | — | ProASIC3 |
| System Gates | — | 600K |
| Maximum System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm CMOS |
| User I/O Count | — | 235 |
| Packhaging | — | 484-Pin FBGA (FGG484) |
| Configuration Memory | — | Flash-based (non-volatile, single chip) |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |