A3PE3000L-FGG896 vs A3PE3000L-FGG896I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3PE3000L-FGG896 بواسطة Microchip Technology و A3PE3000L-FGG896I بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology
A3PE3000L-FGG896 ✓ نشطMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ نشطمقارنة المواصفات
| المعامل | A3PE3000L-FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75,264 | — |
| Total SRAM | 504 kbits | — |
| User I/Os (FGG896) | 620 | — |
| العلبة | 896-ball FBGA (FGG896), 1.0 mm pitch | — |
| نوع التركيب | Surface Mount | Surface Mount (SMD/SMT) |
| Core Supply Voltage | 1.2 V to 1.5 V | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage range] | — |
| درجة حرارة التشغيل | 0 C to +70 C | Industrial grade (I suffix) |
| Logic Family | CMOS | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based | — |
| Flash*Freeze Support | Yes | — |
| Live-At-Power-Up | Level 0 support | — |
| Reconfiguration | Reprogrammable (in-system programmable) | — |
| Lead-Free Finish | Yes | — |
| حالة RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Clock Inputs | [DATA_NEEDED: number of clock conditioning circuits/PLLs] | — |
| Speed Grade | [DATA_NEEDED: speed grade for -FGG896 base part] | Standard (no speed suffix) |
| Power Consumption | [DATA_NEEDED: typical static/dynamic power] | — |
| Ball Count | 896 | — |
| Family | — | ProASIC3L |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| جهد التغذية | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Special Features | — | Flash*Freeze technology, single-chip solution |
| العلبة / الحالة | — | 896-BGA (FBGA, 1 mm pitch) |
| Packaging | — | Tray, standard quantity 27 |