A3PE3000L-FGG896 vs A3PE3000L-FGG896I Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci A3PE3000L-FGG896 disebabkan oleh Microchip Technology dan A3PE3000L-FGG896I disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Microchip Technology
A3PE3000L-FGG896 A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology

A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology

A3PE3000L-FGG896 ✓ Aktif
Microchip Technology
A3PE3000L-FGG896I A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip

A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip

A3PE3000L-FGG896I ✓ Aktif

Pengandingan Spesifikasi

Parametr A3PE3000L-FGG896 A3PE3000L-FGG896I
Merek Microchip Technology Microchip Technology
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
System Gates 3,000,000 3000000
Logic Cells 75,264 —
Total SRAM 504 kbits —
User I/Os (FGG896) 620 —
Kemasan 896-ball FBGA (FGG896), 1.0 mm pitch —
Jenis Pemasangan Surface Mount Surface Mount (SMD/SMT)
Core Supply Voltage 1.2 V to 1.5 V —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage range] —
Suhu Operasi 0 C to +70 C Industrial grade (I suffix)
Logic Family CMOS —
Process Technology 130-nm, 7-layer metal (6 copper), flash-based —
Flash*Freeze Support Yes —
Live-At-Power-Up Level 0 support —
Reconfiguration Reprogrammable (in-system programmable) —
Lead-Free Finish Yes —
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Clock Inputs [DATA_NEEDED: number of clock conditioning circuits/PLLs] —
Speed Grade [DATA_NEEDED: speed grade for -FGG896 base part] Standard (no speed suffix)
Power Consumption [DATA_NEEDED: typical static/dynamic power] —
Ball Count 896 —
Family — ProASIC3L
Total RAM Bits — 516096 bits
Embedded Memory Type — True Dual-Port SRAM (504 kbits)
Number of I/O — 620
Tegangan Pemberi Arus — 1.14 V to 1.575 V
Core Voltage Support — 1.2 V to 1.5 V
Logic Family / Process — CMOS, 130-nm, 7-layer metal (6 copper), flash-based
Configuration Technology — Nonvolatile Flash, Live-at-Power-Up Level 0
Special Features — Flash*Freeze technology, single-chip solution
Kemasan / Case — 896-BGA (FBGA, 1 mm pitch)
Packaging — Tray, standard quantity 27

Laporan Datasheet & Sumber

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