A3PE600-1FGG256I vs A3PE600-FGG256I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3PE600-1FGG256I بواسطة Microchip Technology و A3PE600-FGG256I بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
A3PE600-1FGG256I ✓ نشطMicrochip Technology
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG256I ✓ نشطمقارنة المواصفات
| المعامل | A3PE600-1FGG256I | A3PE600-FGG256I |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| System Gates | 600000 | 600000 gates |
| Logic Cells | 13824 | — |
| Embedded SRAM | 110592 bits (up to 504 kbits family density) | — |
| User I/O | 165 | 165 |
| Maximum System Performance | 272 MHz | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | CMOS flash FPGA |
| Configuration Memory | On-chip Flash (Live at Power-Up, Level 0) | On-chip Flash (non-volatile, single-chip) |
| العلبة | 256-LBGA (FBGA-256), 1.0 mm ball pitch | 256-FBGA (S-PBGA-B256), 17 x 17 mm |
| درجة حرارة التشغيل | -40C to +100C (TJ), industrial | -40C to +85C (Industrial) |
| نوع التركيب | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Speed Grade | -1 | — |
| Family | ProASIC3E | ProASIC3E Flash FPGA |
| Reprogrammability | Yes (single-chip, no external boot PROM) | — |
| Typical Application Domains | Industrial, communications, medical, aerospace/defense | — |
| حالة RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead free) |
| Logic Elements (VersaTiles) | — | 13824 |
| Embedded Flash Memory | — | 110592 bits |
| Maximum Internal Performance | — | 350 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 1.6 mm |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible packages |