A3PE600-1FGG256I vs A3PE600-FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng A3PE600-1FGG256I sa pamamagitan ng Microchip Technology at A3PE600-FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
A3PE600-1FGG256I - 600K-Gate Flash FPGA 165 I/O | Microchip
A3PE600-1FGG256I ✓ NakahandaMicrochip Technology
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | A3PE600-1FGG256I | A3PE600-FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| System Gates | 600000 | 600000 gates |
| Logic Cells | 13824 | — |
| Embedded SRAM | 110592 bits (up to 504 kbits family density) | — |
| User I/O | 165 | 165 |
| Maximum System Performance | 272 MHz | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | CMOS flash FPGA |
| Configuration Memory | On-chip Flash (Live at Power-Up, Level 0) | On-chip Flash (non-volatile, single-chip) |
| Packhaging | 256-LBGA (FBGA-256), 1.0 mm ball pitch | 256-FBGA (S-PBGA-B256), 17 x 17 mm |
| Temperature na Operasyon | -40C to +100C (TJ), industrial | -40C to +85C (Industrial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Speed Grade | -1 | — |
| Family | ProASIC3E | ProASIC3E Flash FPGA |
| Reprogrammability | Yes (single-chip, no external boot PROM) | — |
| Typical Application Domains | Industrial, communications, medical, aerospace/defense | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant (lead free) |
| Logic Elements (VersaTiles) | — | 13824 |
| Embedded Flash Memory | — | 110592 bits |
| Maximum Internal Performance | — | 350 MHz |
| Ball Pitch | — | 1.0 mm |
| Package Height | — | 1.6 mm |
| Footprint Compatibility | — | FG256 and FG484 footprint-compatible packages |