EP1SGX25DF672I7N vs EP1SGX25F مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP1SGX25DF672I7N بواسطة Intel و EP1SGX25F بواسطة Altera. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP1SGX25DF672I7N | EP1SGX25F |
|---|---|---|
| العلامة التجارية | Intel | Altera |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | Obsolete | NRND |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | — |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| العلبة | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | FineLine BGA (672-ball variant exists) |
| Logic Family | CMOS | — |
| درجة حرارة التشغيل | 0 °C to 85 °C (industrial) | [DATA_NEEDED: operating temperature range] |
| Lead-Free | Yes | — |
| حالة RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Registers | — | 26,274 |
| Total Memory Bits | — | 1,944,576 |
| Maximum GXB Transceiver Channels | — | 20 |
| Maximum Data Rate per Channel | — | 3.1875 Gbps |
| CDR / Embedded SERDES | — | Yes (per channel) |
| Speed Grades | — | Multiple (commercial and industrial) |
| Supply Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| Process Node | — | [DATA_NEEDED: process technology node] |
| Design Tool | — | Quartus II |