EP1SGX25DF672I7N vs EP1SGX25F Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP1SGX25DF672I7N disebabkan oleh Intel dan EP1SGX25F disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP1SGX25DF672I7N | EP1SGX25F |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | — |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Kemasan | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | FineLine BGA (672-ball variant exists) |
| Logic Family | CMOS | — |
| Suhu Operasi | 0 °C to 85 °C (industrial) | [DATA_NEEDED: operating temperature range] |
| Lead-Free | Yes | — |
| Status RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Registers | — | 26,274 |
| Total Memory Bits | — | 1,944,576 |
| Maximum GXB Transceiver Channels | — | 20 |
| Maximum Data Rate per Channel | — | 3.1875 Gbps |
| CDR / Embedded SERDES | — | Yes (per channel) |
| Speed Grades | — | Multiple (commercial and industrial) |
| Supply Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| Process Node | — | [DATA_NEEDED: process technology node] |
| Design Tool | — | Quartus II |