EP1SGX25DF672I7N vs EP1SGX25F Perbandingan
Perbandingan bersamaan detil EP1SGX25DF672I7N dari Intel dan EP1SGX25F dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1SGX25DF672I7N | EP1SGX25F |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | — |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Paket | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | FineLine BGA (672-ball variant exists) |
| Logic Family | CMOS | — |
| Suhu Kerja | 0 °C to 85 °C (industrial) | [DATA_NEEDED: operating temperature range] |
| Lead-Free | Yes | — |
| Status RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Registers | — | 26,274 |
| Total Memory Bits | — | 1,944,576 |
| Maximum GXB Transceiver Channels | — | 20 |
| Maximum Data Rate per Channel | — | 3.1875 Gbps |
| CDR / Embedded SERDES | — | Yes (per channel) |
| Speed Grades | — | Multiple (commercial and industrial) |
| Supply Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| Process Node | — | [DATA_NEEDED: process technology node] |
| Design Tool | — | Quartus II |