EP1SGX25DF672I7N vs EP1SGX25F Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25DF672I7N sa pamamagitan ng Intel at EP1SGX25F sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1SGX25DF672I7N | EP1SGX25F |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | Stratix GX | Stratix GX |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | — |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Packhaging | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | FineLine BGA (672-ball variant exists) |
| Logic Family | CMOS | — |
| Temperature na Operasyon | 0 °C to 85 °C (industrial) | [DATA_NEEDED: operating temperature range] |
| Lead-Free | Yes | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Registers | — | 26,274 |
| Total Memory Bits | — | 1,944,576 |
| Maximum GXB Transceiver Channels | — | 20 |
| Maximum Data Rate per Channel | — | 3.1875 Gbps |
| CDR / Embedded SERDES | — | Yes (per channel) |
| Speed Grades | — | Multiple (commercial and industrial) |
| Supply Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O voltage] |
| Process Node | — | [DATA_NEEDED: process technology node] |
| Design Tool | — | Quartus II |