EP2A25F672I6 vs EP2A25F672I7 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2A25F672I6 بواسطة Intel و EP2A25F672I7 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2A25F672I6 | EP2A25F672I7 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | Obsolete |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.15 µm CMOS |
| العلبة | 672-ball FineLine BGA (FBGA-672) | 672-pin FC-FBGA |
| Core Voltage | 1.5 V | 1.5 V |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | 7 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | Yes (Embedded System Blocks) |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| حالة RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| مستوى MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 24,320 |
| Gate Count | — | 900,000 |
| Maximum Frequency | — | 500 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Programmable I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS |
| Configuration Interface | — | JTAG |