EP2A25F672I6 vs EP2A25F672I7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A25F672I6 disebabkan oleh Intel dan EP2A25F672I7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2A25F672I6 | EP2A25F672I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.15 µm CMOS |
| Kemasan | 672-ball FineLine BGA (FBGA-672) | 672-pin FC-FBGA |
| Core Voltage | 1.5 V | 1.5 V |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | 7 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | Yes (Embedded System Blocks) |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 24,320 |
| Gate Count | — | 900,000 |
| Maximum Frequency | — | 500 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Programmable I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS |
| Configuration Interface | — | JTAG |