EP2A25F672I6 vs EP2A25F672I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672I6 sa pamamagitan ng Intel at EP2A25F672I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672I6 | EP2A25F672I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.15 µm CMOS |
| Packhaging | 672-ball FineLine BGA (FBGA-672) | 672-pin FC-FBGA |
| Core Voltage | 1.5 V | 1.5 V |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | 7 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | Yes (Embedded System Blocks) |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 24,320 |
| Gate Count | — | 900,000 |
| Maximum Frequency | — | 500 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Programmable I/O Standards | — | LVTTL, LVCMOS, PCI, LVDS |
| Configuration Interface | — | JTAG |