EP2A40F1020C7N vs EP2A40F1020C8N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2A40F1020C7N بواسطة Intel و EP2A40F1020C8N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Intel
EP2A40F1020C7N - APEX II 1.5M Gates FPGA, 735 I/O, FC-FBGA-1020 | Intel
EP2A40F1020C7N Obsoleteمقارنة المواصفات
| المعامل | EP2A40F1020C7N | EP2A40F1020C8N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | Obsolete | Obsolete |
| Family | APEX II | — |
| Technology | 0.15 µm all-layer copper CMOS, up to 8 metal layers | — |
| System Gates | 1,500,000 (1.5 M) | — |
| Logic Elements | 38,400 | — |
| Embedded Memory | ESB-based, 504 Kbits total | — |
| Maximum Internal Performance | 562 MHz | — |
| Propagation Delay | 1.55 ns | — |
| User I/O Pins | 735 | — |
| PLLs | 4 | — |
| Clock Networks | 12 | — |
| True-LVDS Data Rate | 1 Gbps | — |
| Supported I/O Standards | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, SSTL | — |
| Core Supply Voltage | 1.5 V nominal (1.425 V – 1.575 V) | — |
| Logic Family | CMOS | — |
| العلبة | FC-FBGA-1020, 33 × 33 mm, 1.0 mm pitch, fine-line | — |
| درجة حرارة التشغيل | 0 °C to +85 °C (commercial, C7 grade) | 0 °C to 85 °C |
| Terminal Form | BGA ball (flip-chip) | Ball |
| نوع التركيب | Surface Mount | Surface Mount |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| حالة RoHS | — | unknown |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |