EP2A40F1020C7N vs EP2A40F1020C8N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A40F1020C7N disebabkan oleh Intel dan EP2A40F1020C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2A40F1020C7N - APEX II 1.5M Gates FPGA, 735 I/O, FC-FBGA-1020 | Intel
EP2A40F1020C7N ObsoletePengandingan Spesifikasi
| Parametr | EP2A40F1020C7N | EP2A40F1020C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX II | — |
| Technology | 0.15 µm all-layer copper CMOS, up to 8 metal layers | — |
| System Gates | 1,500,000 (1.5 M) | — |
| Logic Elements | 38,400 | — |
| Embedded Memory | ESB-based, 504 Kbits total | — |
| Maximum Internal Performance | 562 MHz | — |
| Propagation Delay | 1.55 ns | — |
| User I/O Pins | 735 | — |
| PLLs | 4 | — |
| Clock Networks | 12 | — |
| True-LVDS Data Rate | 1 Gbps | — |
| Supported I/O Standards | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, SSTL | — |
| Core Supply Voltage | 1.5 V nominal (1.425 V – 1.575 V) | — |
| Logic Family | CMOS | — |
| Kemasan | FC-FBGA-1020, 33 × 33 mm, 1.0 mm pitch, fine-line | — |
| Suhu Operasi | 0 °C to +85 °C (commercial, C7 grade) | 0 °C to 85 °C |
| Terminal Form | BGA ball (flip-chip) | Ball |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Status RoHS | — | unknown |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |