EP2A40F1020C7N vs EP2A40F1020C8N Perbandingan
Perbandingan bersamaan detil EP2A40F1020C7N dari Intel dan EP2A40F1020C8N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2A40F1020C7N - APEX II 1.5M Gates FPGA, 735 I/O, FC-FBGA-1020 | Intel
EP2A40F1020C7N ObsoletePerbandingan Spesifikasi
| Parameter Umum | EP2A40F1020C7N | EP2A40F1020C8N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | APEX II | — |
| Technology | 0.15 µm all-layer copper CMOS, up to 8 metal layers | — |
| System Gates | 1,500,000 (1.5 M) | — |
| Logic Elements | 38,400 | — |
| Embedded Memory | ESB-based, 504 Kbits total | — |
| Maximum Internal Performance | 562 MHz | — |
| Propagation Delay | 1.55 ns | — |
| User I/O Pins | 735 | — |
| PLLs | 4 | — |
| Clock Networks | 12 | — |
| True-LVDS Data Rate | 1 Gbps | — |
| Supported I/O Standards | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, SSTL | — |
| Core Supply Voltage | 1.5 V nominal (1.425 V – 1.575 V) | — |
| Logic Family | CMOS | — |
| Paket | FC-FBGA-1020, 33 × 33 mm, 1.0 mm pitch, fine-line | — |
| Suhu Kerja | 0 °C to +85 °C (commercial, C7 grade) | 0 °C to 85 °C |
| Terminal Form | BGA ball (flip-chip) | Ball |
| Tipe Mounting | Surface Mount | Surface Mount |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| Status RoHS | — | unknown |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |