EP2A40F1020C7N vs EP2A40F1020C8N तुलना
विस्तृत दोनों ओर की तुलना EP2A40F1020C7N द्वारा Intel और EP2A40F1020C8N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP2A40F1020C7N - APEX II 1.5M Gates FPGA, 735 I/O, FC-FBGA-1020 | Intel
EP2A40F1020C7N Obsoleteविशेषता तुलना
| पैरामीटर | EP2A40F1020C7N | EP2A40F1020C8N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Family | APEX II | — |
| Technology | 0.15 µm all-layer copper CMOS, up to 8 metal layers | — |
| System Gates | 1,500,000 (1.5 M) | — |
| Logic Elements | 38,400 | — |
| Embedded Memory | ESB-based, 504 Kbits total | — |
| Maximum Internal Performance | 562 MHz | — |
| Propagation Delay | 1.55 ns | — |
| User I/O Pins | 735 | — |
| PLLs | 4 | — |
| Clock Networks | 12 | — |
| True-LVDS Data Rate | 1 Gbps | — |
| Supported I/O Standards | True-LVDS, LVPECL, PCML, HyperTransport, LVTTL, LVCMOS, PCI, SSTL | — |
| Core Supply Voltage | 1.5 V nominal (1.425 V – 1.575 V) | — |
| Logic Family | CMOS | — |
| पैकेज | FC-FBGA-1020, 33 × 33 mm, 1.0 mm pitch, fine-line | — |
| ऑपरेटिंग तापमान | 0 °C to +85 °C (commercial, C7 grade) | 0 °C to 85 °C |
| Terminal Form | BGA ball (flip-chip) | Ball |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Device Family | — | APEX II |
| Logic Technology | — | CMOS |
| Logic Gates | — | 1.5 million |
| Logic Cells | — | 38,400 |
| Nominal Supply Voltage | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| User I/Os | — | 735 |
| Package Terminal Count | — | 1,020 pins |
| Package Type | — | FC-FBGA, BGA-1020 |
| Package Body Size | — | 33 mm x 33 mm |
| Ball Pitch | — | 1 mm |
| Reported Operating Frequency | — | 376 MHz |
| Alternative Reported Frequency | — | 562 MHz |
| Reported Propagation Delay | — | 1.78 ns |
| Alternative Reported Propagation Delay | — | 1.55 ns |
| Fabrication Process | — | 0.15 µm |
| Maximum Reported Metal Layers | — | 8 layers |
| RoHS स्थिति | — | unknown |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |