EP2S180F1020C4 vs EP2S180F1020C3 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2S180F1020C4 بواسطة Intel و EP2S180F1020C3 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2S180F1020C4 | EP2S180F1020C3 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | Obsolete | Obsolete |
| Family | Stratix II | — |
| Logic Elements (LEs) | 179400 | — |
| Adaptive Logic Modules (ALMs) | 89760 (approximate, derived from LE count) | — |
| Equivalent LEs | 179400 | — |
| Logic Array Blocks (LABs) | 8970 | 8,970 |
| Total RAM Bits | 9383040 (approx. 1146 Kbit / 1.16 Mbit usable blocks) | — |
| Embedded Multipliers (18x18) | 768 | — |
| PLLs | 12 | — |
| Maximum User I/O | 742 | — |
| العلبة | 1020-BBGA (FineLine BGA, FC-FBGA), 33x33 mm | 1020-ball FBGA (flip-chip BGA) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 90 nm CMOS | — |
| درجة حرارة التشغيل | 0C to +85C (commercial, C4 grade) | Commercial (0C to +85C) |
| حالة RoHS | Non-compliant (per Heisener and alterachips listings) | [DATA_NEEDED: RoHS status] |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| نوع التركيب | Surface Mount (BGA, ball grid array) | Surface Mount |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Series | — | Stratix II |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Process Node | — | 90 nm, all-layer copper SRAM |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C3 |
| DSP Blocks | — | Dedicated high-speed multipliers |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |