EP2S180F1020C4 vs EP2S180F1020C3 तुलना
विस्तृत दोनों ओर की तुलना EP2S180F1020C4 द्वारा Intel और EP2S180F1020C3 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2S180F1020C4 | EP2S180F1020C3 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Family | Stratix II | — |
| Logic Elements (LEs) | 179400 | — |
| Adaptive Logic Modules (ALMs) | 89760 (approximate, derived from LE count) | — |
| Equivalent LEs | 179400 | — |
| Logic Array Blocks (LABs) | 8970 | 8,970 |
| Total RAM Bits | 9383040 (approx. 1146 Kbit / 1.16 Mbit usable blocks) | — |
| Embedded Multipliers (18x18) | 768 | — |
| PLLs | 12 | — |
| Maximum User I/O | 742 | — |
| पैकेज | 1020-BBGA (FineLine BGA, FC-FBGA), 33x33 mm | 1020-ball FBGA (flip-chip BGA) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | 90 nm CMOS | — |
| ऑपरेटिंग तापमान | 0C to +85C (commercial, C4 grade) | Commercial (0C to +85C) |
| RoHS स्थिति | Non-compliant (per Heisener and alterachips listings) | [DATA_NEEDED: RoHS status] |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| माउंटिंग प्रकार | Surface Mount (BGA, ball grid array) | Surface Mount |
| Supplier Device Package | 1020-FBGA (33x33) | — |
| Series | — | Stratix II |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Process Node | — | 90 nm, all-layer copper SRAM |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C3 |
| DSP Blocks | — | Dedicated high-speed multipliers |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |