EP2S180F1020C4 vs EP2S180F1020C3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S180F1020C4 disebabkan oleh Intel dan EP2S180F1020C3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2S180F1020C4 EP2S180F1020C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Obsolete
Family Stratix II —
Logic Elements (LEs) 179400 —
Adaptive Logic Modules (ALMs) 89760 (approximate, derived from LE count) —
Equivalent LEs 179400 —
Logic Array Blocks (LABs) 8970 8,970
Total RAM Bits 9383040 (approx. 1146 Kbit / 1.16 Mbit usable blocks) —
Embedded Multipliers (18x18) 768 —
PLLs 12 —
Maximum User I/O 742 —
Kemasan 1020-BBGA (FineLine BGA, FC-FBGA), 33x33 mm 1020-ball FBGA (flip-chip BGA)
Supply Voltage - Core 1.15 V to 1.25 V (typical 1.2 V) —
Process Technology 90 nm CMOS —
Suhu Operasi 0C to +85C (commercial, C4 grade) Commercial (0C to +85C)
Status RoHS Non-compliant (per Heisener and alterachips listings) [DATA_NEEDED: RoHS status]
Lead Free [DATA_NEEDED: lead-free status] —
Jenis Pemasangan Surface Mount (BGA, ball grid array) Surface Mount
Supplier Device Package 1020-FBGA (33x33) —
Series — Stratix II
Device Family — EP2S180
Equivalent Logic Elements (LEs) — 179,400
Embedded Memory (RAM bits) — 9,383,040
Maximum User I/Os — 742
Process Node — 90 nm, all-layer copper SRAM
Core Voltage — 1.2 V
Speed Grade — C3
DSP Blocks — Dedicated high-speed multipliers
Memory Interfaces Supported — DDR2 SDRAM, QDRII SRAM, RLDRAM II
I/O Standards — LVDS, LVPECL, SSTL, HSTL
Configuration Method — SRAM-based (volatile, requires boot device)
Development Toolchain — Quartus II / Quartus Prime

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