EP4CGX75DF27I6N vs EP4CGX75DF27C8N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP4CGX75DF27I6N بواسطة Intel و EP4CGX75DF27C8N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP4CGX75DF27I6N | EP4CGX75DF27C8N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | Cyclone IV GX | — |
| Device Model | EP4CGX75 | — |
| Logic Elements (LE) | 73,920 | 73,920 |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Embedded Memory Bits | 4,257,792 | — |
| Embedded Memory Blocks | M9K (9 Kbit) | — |
| Maximum User I/O | 310 | — |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| PLLs | [DATA_NEEDED: total PLL count] | 4 |
| Hard PCIe Blocks | x1 / x2 Gen1 | — |
| Process Node | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| العلبة | FBGA-672 (FineLine BGA) | 672-ball FBGA (F27) |
| Pin / Ball Count | 672 | — |
| Operating Temperature (I6N suffix) | -40C to +100C (industrial) | — |
| Configuration Modes | JTAG, Serial, Parallel | — |
| حالة RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Device Family | — | Cyclone IV GX |
| Logic Array Blocks (LAB) | — | 4,605 |
| Embedded Memory | — | 4,257,792 bits (approx. 532 Kbits RAM) |
| Embedded 18x18 Multipliers | — | 274 |
| User I/O Pins | — | 310 |
| High-Speed Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm low-power CMOS |
| Operating Temperature (Commercial) | — | 0C to +85C |
| نوع التركيب | — | Surface Mount |
| Configuration Method | — | SRAM-based, requires external config device |
| PCIe Hard IP | — | PCIe Gen1 x1/x2/x4 endpoint |
| Lead-Free / Halogen-Free | — | Yes / [DATA_NEEDED: halogen free status] |