EPC2TC32UCF48 vs EPC2T32UCAF48 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EPC2TC32UCF48 بواسطة Intel و EPC2T32UCAF48 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EPC2TC32UCF48 | EPC2T32UCAF48 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | Memory ICs | Memory ICs |
| حالة دورة الحياة | NRND | نشط |
| نوع الذاكرة | Non-volatile configuration PROM (CMOS Flash-based) | — |
| Memory Density | 1.6 Mbit (1.6 Mb / 32 Mbit raw) | — |
| Memory Configuration | Serial configuration bitstream storage | — |
| Supply Voltage (VCC) | 3.0 V to 3.6 V (3.3 V typical) | — |
| Supply Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (bank-level) | — |
| Output Drive Current (VCCIO) | [DATA_NEEDED: IOH/IOL at 3.3 V VCCIO] | — |
| Programming Interface | IEEE Std. 1149.1 JTAG (in-system programmable) | — |
| Configuration Interface | Altera serial PROM interface (DCLK, DATA, nCONFIG, nSTATUS, CONF_DONE) | — |
| Supported Configuration Modes | FPP, AS, PS, JTAG (mode dependent on target FPGA MSEL pins) | — |
| Daisy Chain Support | Yes (multi-device cascade for >16 Mbit FPGAs) | — |
| Maximum Cascaded Capacity | Up to 16 Mbit total across chain | — |
| درجة حرارة التشغيل | 0C to +70C (commercial) | [DATA_NEEDED: operating temperature range] |
| العلبة | 48-pin TQFP (7x7 mm) | QFP-48 (CAF48) |
| نوع التركيب | Surface Mount | Surface Mount |
| مستوى MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| حالة RoHS | [DATA_NEEDED: confirm RoHS compliance] | [DATA_NEEDED: RoHS compliance] |
| Lead Free | [DATA_NEEDED: confirm lead-free] | — |
| Device Type | — | Configuration PROM for SRAM-based FPGAs |
| Memory Capacity | — | 32 Mbit |
| الواجهة | — | Serial / Parallel configuration; JTAG (IEEE 1149.1) ISP |
| جهد التغذية | — | 3.0 V to 3.6 V (3.3 V typical) |
| Configuration Modes | — | Serial, Parallel (8/16-bit) |
| JTAG Interface | — | 4-wire (TMS, TCK, TDI, TDO) |
| Cascade Support | — | Yes (nCASC pin for multi-device chains) |
| Process Technology | — | CMOS non-volatile memory |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | EPC2 (Enhanced Configuration Device) |