EPC2TC32UCF48 vs EPC2T32UCAF48 Perbandingan
Perbandingan bersamaan detil EPC2TC32UCF48 dari Intel dan EPC2T32UCAF48 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPC2TC32UCF48 | EPC2T32UCAF48 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | NRND | Aktif |
| Tipe Memori | Non-volatile configuration PROM (CMOS Flash-based) | — |
| Memory Density | 1.6 Mbit (1.6 Mb / 32 Mbit raw) | — |
| Memory Configuration | Serial configuration bitstream storage | — |
| Supply Voltage (VCC) | 3.0 V to 3.6 V (3.3 V typical) | — |
| Supply Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (bank-level) | — |
| Output Drive Current (VCCIO) | [DATA_NEEDED: IOH/IOL at 3.3 V VCCIO] | — |
| Programming Interface | IEEE Std. 1149.1 JTAG (in-system programmable) | — |
| Configuration Interface | Altera serial PROM interface (DCLK, DATA, nCONFIG, nSTATUS, CONF_DONE) | — |
| Supported Configuration Modes | FPP, AS, PS, JTAG (mode dependent on target FPGA MSEL pins) | — |
| Daisy Chain Support | Yes (multi-device cascade for >16 Mbit FPGAs) | — |
| Maximum Cascaded Capacity | Up to 16 Mbit total across chain | — |
| Suhu Kerja | 0C to +70C (commercial) | [DATA_NEEDED: operating temperature range] |
| Paket | 48-pin TQFP (7x7 mm) | QFP-48 (CAF48) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Status RoHS | [DATA_NEEDED: confirm RoHS compliance] | [DATA_NEEDED: RoHS compliance] |
| Lead Free | [DATA_NEEDED: confirm lead-free] | — |
| Device Type | — | Configuration PROM for SRAM-based FPGAs |
| Memory Capacity | — | 32 Mbit |
| Antarmuka | — | Serial / Parallel configuration; JTAG (IEEE 1149.1) ISP |
| Tegangan Pemuat | — | 3.0 V to 3.6 V (3.3 V typical) |
| Configuration Modes | — | Serial, Parallel (8/16-bit) |
| JTAG Interface | — | 4-wire (TMS, TCK, TDI, TDO) |
| Cascade Support | — | Yes (nCASC pin for multi-device chains) |
| Process Technology | — | CMOS non-volatile memory |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | EPC2 (Enhanced Configuration Device) |