MC9S08DZ60AMLF vs MC9S08DZ60ACLF مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08DZ60AMLF بواسطة NXP Semiconductors و MC9S08DZ60ACLF بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF Nrndمقارنة المواصفات
| المعامل | MC9S08DZ60AMLF | MC9S08DZ60ACLF |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | NRND |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Maximum CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 4 KB | — |
| Data EEPROM | Embedded EEPROM | — |
| Connectivity | CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 24-channel (16-channel 12-bit ADC per FindIC overview) | — |
| ADC Conversion Time | 2.5 us | — |
| Analog Comparators | 1 | — |
| جهد التغذية | 3.3 V / 5 V | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug | On-chip background debug (BGND instruction) | — |
| العلبة | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| نوع التركيب | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| حالة RoHS | RoHS compliant (per distributor listing) | Compliant |
| حالة دورة الحياة | NRND (Not Recommended for New Designs) per NXP | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] |
| Core | — | HCS08 (8-bit CISC) |
| Core Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| EEPROM / Emulated EEPROM | — | Available (size [DATA_NEEDED: EEPROM size]) |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Supply Rails | — | 3.3 V / 5 V |
| ADC | — | 24-channel, 12-bit, 2.5 us conversion |
| CAN | — | 1 x CAN 2.0 A/B |
| LIN | — | Master LIN 2.0 interface |
| Communication Peripherals | — | SCI (SPI), IIC, MSCAN |
| Timer / PWM Channels | — | Multiple (count [DATA_NEEDED: timer/PWM channel count]) |
| LCD Driver | — | Yes (on-chip segment LCD driver) |
| مستوى MSL | — | MSL 3 (per JEDEC J-STD-020) |
| Background Debug Mode (BGND) | — | Yes (on-chip emulation/debug) |
| Instruction Set | — | HC08 instruction set with added BGND instruction |