MC9S08DZ60AMLF vs MC9S08DZ60ACLF Perbandingan
Perbandingan bersamaan detil MC9S08DZ60AMLF dari NXP Semiconductors dan MC9S08DZ60ACLF dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S08DZ60AMLF | MC9S08DZ60ACLF |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Maximum CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 60 KB (60K x 8) Flash | — |
| RAM Size | 4 KB | — |
| Data EEPROM | Embedded EEPROM | — |
| Connectivity | CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 24-channel (16-channel 12-bit ADC per FindIC overview) | — |
| ADC Conversion Time | 2.5 us | — |
| Analog Comparators | 1 | — |
| Tegangan Pemuat | 3.3 V / 5 V | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug | On-chip background debug (BGND instruction) | — |
| Paket | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Status RoHS | RoHS compliant (per distributor listing) | Compliant |
| Status Lingkungan Hidup | NRND (Not Recommended for New Designs) per NXP | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] |
| Core | — | HCS08 (8-bit CISC) |
| Core Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| EEPROM / Emulated EEPROM | — | Available (size [DATA_NEEDED: EEPROM size]) |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Supply Rails | — | 3.3 V / 5 V |
| ADC | — | 24-channel, 12-bit, 2.5 us conversion |
| CAN | — | 1 x CAN 2.0 A/B |
| LIN | — | Master LIN 2.0 interface |
| Communication Peripherals | — | SCI (SPI), IIC, MSCAN |
| Timer / PWM Channels | — | Multiple (count [DATA_NEEDED: timer/PWM channel count]) |
| LCD Driver | — | Yes (on-chip segment LCD driver) |
| Level MSL | — | MSL 3 (per JEDEC J-STD-020) |
| Background Debug Mode (BGND) | — | Yes (on-chip emulation/debug) |
| Instruction Set | — | HC08 instruction set with added BGND instruction |