MPC8255ACVVMHBB vs MPC8245LZU266D مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MPC8255ACVVMHBB بواسطة NXP Semiconductors و MPC8245LZU266D بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ نشط
مقارنة المواصفات
| المعامل | MPC8255ACVVMHBB | MPC8245LZU266D |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | نشط | نشط |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Family | PowerQUICC II MPC82xx | — |
| Core Architecture | PowerPC G2 (32-bit) | — |
| Number of Cores | 1 | — |
| Operating Frequency | 266 MHz | — |
| Core Voltage | 2 V | — |
| I/O Voltage | 3.3 V | — |
| العلبة | 480-TBGA (37.5 x 37.5 mm) | 352-TBGA (35 mm x 35 mm) |
| Ball Pitch | 1.0 mm (typical for 480-TBGA) | — |
| Packaging | Tray | — |
| Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| حالة RoHS | Compliant | [DATA_NEEDED: confirm per lot] |
| Communications Processor Module (CPM) | Integrated RISC-based CPM with FCC/MCC/SCC | — |
| System Bus | 64-bit 60x bus | — |
| JTAG / COP Debug | Yes | — |
| Series | — | MPC82xx |
| Part Status | — | Active |
| Core Processor | — | PowerPC 603e |
| Number of Cores / Bus Width | — | 1 Core / 32-bit |
| Speed (Clock Frequency) | — | 266 MHz |
| Performance | — | 505.4 MIPS |
| Co-Processor / DSP | — | None |
| RAM Controllers | — | SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | [DATA_NEEDED: display controller details] |
| Ethernet | — | [DATA_NEEDED: integrated Ethernet?] |
| PCI Interface | — | 32-bit, 33/66 MHz |
| Memory Controller Max Frequency | — | 133 MHz (SDRAM), up to 2 GB |
| Serial I/O | — | I2C, UART, I2O |
| جهد التغذية | — | 3.3 V (typ.) |
| Process Technology | — | 0.25 um CMOS |
| درجة حرارة التشغيل | — | 0 C to +105 C (commercial) |
| نوع التركيب | — | Surface Mount |
| Tray Quantity | — | [DATA_NEEDED: tray qty per manufacturer packing] |
| Lead-Free Status | — | Lead-free (BGA balls, SnAgCu) |