MPC8255ACVVMHBB vs MPC8245LZU266D Karşılaştırma
Ayrıntılı yan yana karşılaştırma MPC8255ACVVMHBB tarafından NXP Semiconductors ve MPC8245LZU266D tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ Aktif
Özellik Karşılaştırması
| Parametre | MPC8255ACVVMHBB | MPC8245LZU266D |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Family | PowerQUICC II MPC82xx | — |
| Core Architecture | PowerPC G2 (32-bit) | — |
| Number of Cores | 1 | — |
| Operating Frequency | 266 MHz | — |
| Core Voltage | 2 V | — |
| I/O Voltage | 3.3 V | — |
| Paket | 480-TBGA (37.5 x 37.5 mm) | 352-TBGA (35 mm x 35 mm) |
| Ball Pitch | 1.0 mm (typical for 480-TBGA) | — |
| Packaging | Tray | — |
| Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| RoHS Durumu | Compliant | [DATA_NEEDED: confirm per lot] |
| Communications Processor Module (CPM) | Integrated RISC-based CPM with FCC/MCC/SCC | — |
| System Bus | 64-bit 60x bus | — |
| JTAG / COP Debug | Yes | — |
| Series | — | MPC82xx |
| Part Status | — | Active |
| Core Processor | — | PowerPC 603e |
| Number of Cores / Bus Width | — | 1 Core / 32-bit |
| Speed (Clock Frequency) | — | 266 MHz |
| Performance | — | 505.4 MIPS |
| Co-Processor / DSP | — | None |
| RAM Controllers | — | SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | [DATA_NEEDED: display controller details] |
| Ethernet | — | [DATA_NEEDED: integrated Ethernet?] |
| PCI Interface | — | 32-bit, 33/66 MHz |
| Memory Controller Max Frequency | — | 133 MHz (SDRAM), up to 2 GB |
| Serial I/O | — | I2C, UART, I2O |
| Besleme Gerilimi | — | 3.3 V (typ.) |
| Process Technology | — | 0.25 um CMOS |
| İşletim Sıcaklığı | — | 0 C to +105 C (commercial) |
| Montaj Türü | — | Surface Mount |
| Tray Quantity | — | [DATA_NEEDED: tray qty per manufacturer packing] |
| Lead-Free Status | — | Lead-free (BGA balls, SnAgCu) |