MPC8255ACVVMHBB vs MPC8245LZU266D Perbandingan
Perbandingan bersamaan detil MPC8255ACVVMHBB dari NXP Semiconductors dan MPC8245LZU266D dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ Aktif
Perbandingan Spesifikasi
| Parameter Umum | MPC8255ACVVMHBB | MPC8245LZU266D |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Family | PowerQUICC II MPC82xx | — |
| Core Architecture | PowerPC G2 (32-bit) | — |
| Number of Cores | 1 | — |
| Operating Frequency | 266 MHz | — |
| Core Voltage | 2 V | — |
| I/O Voltage | 3.3 V | — |
| Paket | 480-TBGA (37.5 x 37.5 mm) | 352-TBGA (35 mm x 35 mm) |
| Ball Pitch | 1.0 mm (typical for 480-TBGA) | — |
| Packaging | Tray | — |
| Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| Status RoHS | Compliant | [DATA_NEEDED: confirm per lot] |
| Communications Processor Module (CPM) | Integrated RISC-based CPM with FCC/MCC/SCC | — |
| System Bus | 64-bit 60x bus | — |
| JTAG / COP Debug | Yes | — |
| Series | — | MPC82xx |
| Part Status | — | Active |
| Core Processor | — | PowerPC 603e |
| Number of Cores / Bus Width | — | 1 Core / 32-bit |
| Speed (Clock Frequency) | — | 266 MHz |
| Performance | — | 505.4 MIPS |
| Co-Processor / DSP | — | None |
| RAM Controllers | — | SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | [DATA_NEEDED: display controller details] |
| Ethernet | — | [DATA_NEEDED: integrated Ethernet?] |
| PCI Interface | — | 32-bit, 33/66 MHz |
| Memory Controller Max Frequency | — | 133 MHz (SDRAM), up to 2 GB |
| Serial I/O | — | I2C, UART, I2O |
| Tegangan Pemuat | — | 3.3 V (typ.) |
| Process Technology | — | 0.25 um CMOS |
| Suhu Kerja | — | 0 C to +105 C (commercial) |
| Tipe Mounting | — | Surface Mount |
| Tray Quantity | — | [DATA_NEEDED: tray qty per manufacturer packing] |
| Lead-Free Status | — | Lead-free (BGA balls, SnAgCu) |