MPX12DP vs MPXC2011DT1 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MPX12DP بواسطة NXP Semiconductors و MPXC2011DT1 بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MPX12DP | MPXC2011DT1 |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Pressure Sensors | Pressure Sensors |
| حالة دورة الحياة | Obsolete | نشط |
| Pressure Type | Differential | Differential |
| Operating Pressure Range | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) | 0 kPa to 10 kPa (0 PSI to 1.45 PSI) |
| Sensitivity | 5.5 mV/kPa typical | 2.5 mV/kPa typical |
| Full-Scale Span | 35 mV typical (20 mV min / 75 mV max) | — |
| نطاق جهد الخرج | 0 mV to 55 mV at 3 V excitation | — |
| Excitation Voltage | 3 V DC typical | 3 V DC to 10 V DC (10 V nominal) |
| Linearity | +/-5% of span | — |
| Pressure Port Style | Dual axial tube, 4.93 mm (0.19 in) diameter | — |
| Compensation | Uncompensated (external required) | On-chip temperature compensated and calibrated |
| نوع الخرج | Analog Wheatstone bridge (mV) | Analog Wheatstone bridge (ratiometric) |
| Package / Mounting | 4-SIP through-hole module | — |
| درجة حرارة التشغيل | -40C to +125C | 0 °C to +85 °C |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| نوع التركيب | Through Hole | Through-hole (PCB mount with side-port tubing) |
| حالة RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status not in web data] |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| مستوى MSL | Not applicable (through-hole) | — |
| Full-Scale Output | — | 25 mV typical at 10 V excitation |
| العلبة | — | 4-SSIP Chip Pak module, side port |
| Port Style | — | Female, 3.25 mm (0.128 in) barbed side port |
| Termination Style | — | Through-hole PCB, 4 leads |
| Technology | — | Piezoresistive silicon strain gauge |
| Module Dimensions | — | 7.6 mm x 12.8 mm nominal |