MRF8P9040NR1 vs MRF8S9120NR3 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MRF8P9040NR1 بواسطة NXP Semiconductors و MRF8S9120NR3 بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MRF8P9040NR1 - 40W 960MHz RF Power MOSFET | NXP Semiconductors
MRF8P9040NR1 ✓ نشطمقارنة المواصفات
| المعامل | MRF8P9040NR1 | MRF8S9120NR3 |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | MOSFETs | MOSFETs |
| حالة دورة الحياة | نشط | نشط |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| نوع الترانزستور | N-Channel Lateral MOSFET (RF Power) | Lateral N-Channel MOSFET, Enhancement-Mode |
| Technology | HV8 Lateral N-Channel Enhancement-Mode | — |
| Operating Frequency Range | 728 MHz to 960 MHz | 865 MHz to 960 MHz (usable 700-1000 MHz) |
| Drain-Source Voltage (Vdss) Max | 70 V | — |
| Continuous Drain Current (Id) | 320 mA (per DigiKey listing) | — |
| Test Drain Supply Voltage | 28 V | — |
| Output Power (Pout) Avg | 4.0 W (CW / modulated at 28 V, 960 MHz) | — |
| Power Gain (Gps) at 960 MHz | 19.1 dB | — |
| العلبة | TO-272 WB-4 (air-cavity overmold, 4 lead + flange) | OM-780-2 (ceramic air-cavity, flange mount) |
| نوع التركيب | Surface Mount / Flange Mount | Flange / chassis mount (through-hole RF package) |
| عدد الأطراف | 4 (Drain on flange) | — |
| Modulation Formats Supported | CDMA, W-CDMA, LTE | W-CDMA, LTE, GSM/EDGE, multi-carrier |
| PA Topology Suitability | Class AB, Class C | — |
| مستوى MSL | 3 | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes (per typical NXP HV8 family) | — |
| Part Number | — | MRF8S9120NR3 |
| Application | — | W-CDMA / cellular base station RF power amplifier final stage |
| Drain Supply Voltage (VDD) | — | 28 V |
| Average Output Power | — | 33 W (W-CDMA, single-carrier) |
| Power Gain (typical) | — | 19.8 dB |
| Quiescent Drain Current (IDQ) | — | 800 mA typical |
| Operating Class | — | Class AB, Class C |
| Maximum Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| Lead Finish | — | Gold metallisation (typical for HV8 process) |