10AS057H3F34E2SG - Arria 10 SX SoC FPGA, 570K LE, 1.5GHz | Intel
MPN: 10AS057H3F34E2SG ✓ نشط10AS057H3F34E2SG نظرة عامة
An SoC FPGA is a class of integrated circuit that combines a hard processor core subsystem with traditional programmable logic fabric on a single die. The Arria 10 SX sits within the broader taxonomy of programmable logic devices, branching upward from FPGA through SoC FPGA to heterogeneous compute platforms. By merging a deterministic ARM Cortex-A9 subsystem with parallel logic, SoC FPGAs minimize latency between the processor and custom accelerators, making them ideal for applications requiring real-time DSP, high-throughput I/O, and embedded Linux or RTOS execution on the same silicon.
Key features of the 10AS057H3F34E2SG include 570K logic elements, 1.5 GHz ARM Cortex-A9 dual-core MPCore with CoreSight debug, 24 high-speed transceivers supporting protocols such as PCIe Gen3 and 10 Gigabit Ethernet, on-chip DSP blocks for fixed- and floating-point operations, and a 20 nm process technology. The 1152-ball flip-chip BGA package supports high-density signal breakout and a thermal envelope compatible with industrial-grade forced-air cooling.
Architecturally, the device implements a hard processor system (HPS) tightly coupled to the FPGA fabric through high-bandwidth AXI bridges, allowing shared access to DDR4 memory controllers from both subsystems. Process technology is 20 nm with a 0.9 V core supply, balancing static leakage and dynamic performance. On-chip memory, phase-locked loops, and hardened memory controllers reduce external component count.
Typical applications include 5G baseband and radio unit processing, software-defined radio (SDR), radar and electronic warfare signal processing, industrial machine vision with embedded analytics, and high-performance test and measurement instrumentation. The combination of ARM Cortex-A9 cores and parallel FPGA fabric also suits medical imaging accelerators and aerospace signal processing payloads.
When designing with this device, allocate PCB layer stack for the 1152-ball FC-FBGA escape, follow Intel's power-rail sequencing recommendations for the HPS and FPGA core domains, and consider thermal dissipation across the full SoC operating envelope including transceivers at full data rate.
This page synthesizes distributor availability, drop-in alternatives within the Arria 10 SX family, and practical design notes not consolidated in the standalone datasheet.
بدائل مباشرة لـ 10AS057H3F34E2SG — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 10AS057H3F34E2SG (نفس عامل الشكل والبصمة) — يختلف في Package, Logic Elements, Speed Grade, Mounting Type, RoHS Status.
10AS057H3F34E2LG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10AS057H3F34E2LG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10AS057H2F34E2SG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10AS057H2F34E2LG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10AS057H1F34E1HG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10AS066H3F34I2SG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10AS048K3F35I2SG
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10AS057H3F34E2SG الحدود القصوى والخصائص الكهربائية
| Family | Arria 10 SX |
| Device Type | System on Chip (SoC) FPGA |
| Logic Elements | 570,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Core Speed | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| العلبة | 1152-FBGA, FC (35x35 mm) |
| نوع التركيب | Surface Mount (flip-chip BGA) |
| Terminal Form | BALL |
| Number of Terminals | 1152 |
| Package Shape | Square Grid Array |
| Operating Temperature Grade | Industrial / Extended (per ordering code) |
| حالة RoHS | Compliant |
| Lead Free | Yes |
دليل تكوين أطراف 10AS057H3F34E2SG square grid array
تكوين الأطراف لـ 10AS057H3F34E2SG (حزمة square grid array). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ 10AS057H3F34E2SG.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
10AS057H3F34E2SG مناسب لـ 6 التطبيقs: 5G Baseband and Radio Unit Processing, Software Defined Radio (SDR), Radar and Electronic Warfare Signal Processing, Industrial Machine Vision with Embedded Analytics, Medical Imaging Accelerators, Test and Measurement Instrumentation.
5G Baseband and Radio Unit Processing
The 10AS057H3F34E2SG is well matched to 5G baseband and radio unit designs because its 570K logic elements deliver the parallel throughput required for LDPC and Polar channel decoding, while the dual 1.5 GHz ARM Cortex-A9 cores execute Layer-2/3 protocol stacks. Integrated transceivers support CPRI and eCPRI fronthaul links, reducing external PHY count. The 1152-ball FC-FBGA package handles the high pin count of multi-antenna MIMO and provides the thermal headroom for sustained transceiver operation at full data rate, making it a strong fit for both baseband units (BBU) and remote radio heads (RRH).
موصى به
Software Defined Radio (SDR)
For software defined radio platforms, the 10AS057H3F34E2SG combines a deterministic ARM Cortex-A9 host running Linux or RTOS with parallel FPGA fabric for wideband DSP. The 570K logic elements accommodate digital down/up-conversion, channelization filters, and FFT pipelines for waveforms spanning HF through microwave. Tight AXI coupling between HPS and FPGA enables sample-stream sharing through shared DDR4, which is critical for low-latency modulation recognition and adaptive filtering. This makes the part a strong fit for tactical and commercial SDR deployments.
موصى به
Radar and Electronic Warfare Signal Processing
In radar and electronic warfare, the 10AS057H3F34E2SG's DSP blocks handle pulse compression, MTI filtering, and digital beamforming in real time. The dual ARM Cortex-A9 subsystem handles tracker and display tasks, offloading the FPGA to maximize signal-processing throughput. With 24 transceivers, the device interfaces directly to RF ADCs and DACs at multi-gigasample rates, enabling phased-array radar and EW receiver architectures. The 35x35 mm FC-FBGA package and industrial temperature grade (in the I-speed variant) suit defense and aerospace deployments.
موصى به
Industrial Machine Vision with Embedded Analytics
The 10AS057H3F34E2SG supports industrial machine vision by processing high-resolution camera streams through its FPGA fabric while running inference and control tasks on the ARM Cortex-A9 cores. Its parallel architecture accelerates convolutional neural networks, optical flow, and defect-detection algorithms at line rate. The HPS runs Linux plus a real-time OS such as RTEMS for deterministic actuator control, and the device's high-speed transceivers connect to GigE Vision, CoaXPress, or Camera Link interfaces. The 1152-ball BGA accommodates multi-camera fan-out with on-chip DMA.
موصى به
Medical Imaging Accelerators
For medical imaging equipment such as ultrasound, CT, and MRI reconstruction, the 10AS057H3F34E2SG delivers the parallel arithmetic throughput required by beamformers and back-projection algorithms. The FPGA fabric runs real-time DSP pipelines while the ARM Cortex-A9 cores manage patient interface, image post-processing, and DICOM networking. Its SoC integration reduces board area and BOM versus discrete CPU-plus-FPGA designs, which is critical for portable cart-based ultrasound and bedside monitors. The 20 nm process balances performance with the low leakage needed for medical thermal envelopes.
موصى به
Test and Measurement Instrumentation
The 10AS057H3F34E2SG is suited for high-end test and measurement instruments such as protocol analyzers, oscilloscopes, and signal generators. The FPGA fabric implements real-time trigger logic, decoders, and FFT analysis while the ARM cores run the user interface, automation, and remote-control stacks. The transceivers provide multi-gigabit serial links for industry-standard instrument I/O such as 10 GbE and PCIe Gen3. The 1152-ball FC-BGA integrates cleanly into instruments that already require large-format backplanes with high-density signal routing.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 10AS057H3F34E2SG — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 10AS057H3F34E2LG | 10AS057H2F34E2SG | 10AS057H2F34E2LG | 10AS057H1F34E1HG | 10AS066H3F34I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 570,000 | 570,000 | 660,000 |
| Speed Grade | H3 | H3 | H2 | H2 | H1 | H3 |
| Temperature Grade | E2 (Commercial) | E2 (Commercial) | E2 (Commercial) | E2 (Commercial) | E1 (Commercial) | I2 (Industrial) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
أبرز الفروقات
- Highest available speed grade (H3) for the Arria 10 SX 570K LE density (مقابل10AS057H2F34E2SG)
- Balanced resource profile for cost-sensitive 5G and radar designs (مقابل10AS066H3F34I2SG)
- Hard dual-core ARM Cortex-A9 MPCore subsystem (مقابل10AX032E3F29E2SG)
ملاحظات التصميم
The 1152-ball FC-FBGA requires a high-density PCB stack-up with microvia-in-pad technology. Use Intel's reference design layer-count and via-pattern guidance (typically 14+ layers for full signal escape without dog-bone fan-out). Match BGA pad diameters exactly to the Intel land-pattern recommendation to avoid solder joint defects, and route all HPS DDR4 signals with matched length and 100-ohm differential impedance as specified in the Arria 10 SX external memory interface guidelines.
At typical SoC FPGA workloads (FPGA fabric near 80% utilization, HPS at 1.5 GHz, transceivers at full data rate), junction-to-ambient thermal resistance (theta_JA) must be derated using Intel's published curves; expected dissipation is on the order of 15-25 W. Use a heatsink with thermal interface material, adequate forced-airflow, or a cold-plate solution; verify with the Intel Arria 10 SX power calculator early in the design to size your thermal solution before board layout freeze.
Sequence the power rails in the order specified by Intel: HPS core first, then FPGA core, then I/O and transceiver supplies. Use the recommended PMIC/controller such as the Intel Enpirion EM11x series with proper soft-start timing. Allow at least 100 ms between HPS and FPGA core ramps to prevent latch-up. Add bulk decoupling as close as possible to each supply pin, and verify in-rush current against your DC source capability.
Estimated: Configuring boot from QSPI or SD card requires correct BSEL/PSEL strap resistors sampled at HPS reset; wrong straps lead to 'no boot' failures that mimic silicon faults. Validate strap values against the Arria 10 SX HPS technical reference manual before PCB fab. Also confirm that the Quartus Prime pin-planner assignments include HPS-dedicated pins (not shared with FPGA fabric) to avoid tool-time errors.
معلومات الامتثال
RoHS and REACH compliance stated by Intel/Altera product page. AEC-Q100 not applicable - this is an SoC FPGA, not an automotive-grade IC. Conflict-minerals compliance per Intel supply-chain policy.
