10AS057H3F34E2LG - Arria 10 SX SoC FPGA 570K LE | Intel
MPN: 10AS057H3F34E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3173.2 | $3,173.20 |
| 5 | $3050 | $15,250.00 |
| 10 | $2895 | $28,950.00 |
| 25 | $2750 | $68,750.00 |
| 50 | $2620 | $131,000.00 |
| 100 | $2485 | $248,500.00 |
Drop-in alternatives for 10AS057H3F34E2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS057H3F34I2LG
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View Datasheet →10AS057H3F34E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| User I/O Count | 492 |
| Package Type | 1152-ball FCBGA (FineLine BGA) |
| Package Size | 35 mm x 35 mm |
| Speed Grade | H3 (enhanced performance) |
| Process Technology | TSMC 20 nm |
| RoHS Status | Compliant (LG suffix = lead-free) |
| Mounting Type | Surface Mount (BGA) |
10AS057H3F34E2LG 35 mm x 35 mm Pin Configuration Guide
Complete pinout information for 10AS057H3F34E2LG (35 mm x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057H3F34E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H3F34E2LG is suitable for 7 applications: Software Defined Radio (SDR) Baseband Processing, High-Speed Industrial Machine Vision, Medical Imaging Accelerator, Broadcast Video Processing and Encoding, Radar and Electronic Warfare Signal Processing, Data Center Hardware Acceleration, Automotive ADAS Sensor Fusion.
Software Defined Radio (SDR) Baseband Processing
The 10AS057H3F34E2LG is well-suited for SDR baseband processing because the 570K logic elements and hardened DSP blocks with IEEE 754 single-precision floating-point support handle modulation/demodulation, channelization, and FFT computations deterministically. The HPS subsystem runs Linux for protocol stack management, link adaptation, and network interfaces, while the FPGA fabric accelerates the data plane. The H3 speed grade provides additional timing margin for high-throughput sample rates. Per Intel Arria 10 SX documentation, the device integrates up to multiple gigabit transceivers ideal for ADC/DAC digital interfaces.
Recommended
High-Speed Industrial Machine Vision
For high-speed machine vision systems, the 10AS057H3F34E2LG processes 4K image streams from CoaXPress or Camera Link sensors using the FPGA fabric while the Cortex-A9 cores run Linux-based classification and machine-learning inference at the edge. The 492 user I/O pins support multiple camera interfaces, GPIO for trigger signals, and Ethernet for factory networks. The H3 speed grade enables higher pixel-clock rates than H2, reducing the number of fabric pipeline stages required. The SoC integration reduces BOM cost versus separate CPU+FPGA solutions.
Recommended
Medical Imaging Accelerator
The 10AS057H3F34E2LG's SoC architecture suits medical imaging modalities (ultrasound beamforming, CT reconstruction, endoscopy video processing) where the FPGA fabric performs real-time signal processing while the HPS subsystem manages user interface, DICOM stack, and network connectivity. The hardened floating-point DSP blocks accelerate parallel beamforming operations at hundreds of megahertz, and the dual-core ARM provides asymmetric multiprocessing for separating real-time processing from application logic. The 35x35 mm FCBGA footprint fits medical device form factors.
Recommended
Broadcast Video Processing and Encoding
Broadcast equipment (contribution encoders, playout servers, video routers) uses the 10AS057H3F34E2LG for SDI/HDMI input processing, HEVC/H.264 encoding, and color-space conversion. The FPGA fabric handles parallel pixel pipelines at 4K/8K rates while the ARM subsystem runs video metadata, subtitle insertion, and network control. The H3 speed grade supports higher pixel clock frequencies required by UHD-SDI (12G-SDI) interfaces. Multiple transceiver channels enable SMPTE ST 2110 IP-based broadcast workflows with PTP timing synchronization.
Recommended
Radar and Electronic Warfare Signal Processing
Military radar, SIGINT, and electronic-warfare systems use the 10AS057H3F34E2LG for wideband signal capture, pulse compression, and digital beamforming. The hardened floating-point DSP blocks deliver IEEE 754 single-precision arithmetic at high sample rates, and the HPS subsystem handles target tracking, classification, and operator interfaces. The H3 speed grade provides the timing margin necessary for gigahertz sample-rate processing. Multiple high-speed serial transceivers interface with ADC/DAC mezzanine cards via JESD204B/C protocols.
Recommended
Data Center Hardware Acceleration
The 10AS057H3F34E2LG accelerates data-center workloads such as compression, encryption, search, and machine learning inference where the FPGA fabric delivers 10-100x speedups versus general-purpose CPUs. The dual-core ARM subsystem handles management-plane tasks like monitoring, statistics, and network protocols. The H3 speed grade enables tighter timing closure for high-frequency datapaths. With 570K logic elements and large embedded BRAM blocks, the device can host multiple concurrent acceleration kernels, and the FCBGA package supports PCIe Gen3 x8 host connectivity.
Recommended
Automotive ADAS Sensor Fusion
Advanced driver-assistance systems (ADAS) use the 10AS057H3F34E2LG to fuse camera, radar, and lidar sensor data for object detection and path planning. The FPGA fabric performs low-latency sensor fusion and target tracking while the HPS subsystem runs perception algorithms and communicates with vehicle networks (CAN, Automotive Ethernet). The H3 speed grade supports high-throughput sensor data aggregation, and the SoC integration simplifies ASIL-rated functional safety architectures. The 35x35 mm FCBGA package is suitable for ECU form factors with appropriate heatsinking.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H3F34E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H3F34I2LG | 10AS057H2F34E2LG | 10AS057H2F34I2SG | 10AS057H2F34I2LG | 10AS057H2F34E2SG | 10AS057H2F34I1HG |
|---|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA F34 (35x35 mm) | 1152-ball FCBGA F34 (35x35 mm) - same | 1152-ball FCBGA F34 (35x35 mm) - same | 1152-ball FCBGA F34 (35x35 mm) - same | 1152-ball FCBGA F34 (35x35 mm) - same | 1152-ball FCBGA F34 (35x35 mm) - same | 1152-ball FCBGA F34 (35x35 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 570K | 570K | 570K | 570K | 570K | 570K | 570K |
| Speed Grade | H3 | H3 | H2 | H2 | H2 | H2 | H2 |
| Operating Temp Grade | E2 (enhanced) | I2 (industrial) | E2 (enhanced) | I2 (industrial) | I2 (industrial) | E2 (enhanced) | I1 (industrial) |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| User I/O Count | 492 | 492 | 492 | 492 | 492 | 492 | 492 |
| Approx Unit Price | $3,173 (1 qty) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Active | Active | Active | Active | Active | Active | Active |
Key Differentiators
- Highest speed grade (H3) in the 10AS057 LE-class (vs 10AS057H2F34E2LG)
- Commercial E2 operating tier (vs 10AS057H3F34I2LG)
- Integrated ARM Cortex-A9 HPS eliminates discrete CPU+FPGA (vs Discrete CPU + Arria 10 GX FPGA)
Design Notes
Estimated: at 570K LE utilization (~70%), 1.5 GHz HPS clock, and 8 transceiver channels active, typical power is 20-30 W. Multiple voltage rails are required (0.95 V core, 1.1 V HPS, 1.8 V/2.5 V/3.3 V IO, 1.2 V transceiver). Use the Intel Early Power Estimator (EPE) tool for design-specific budgeting. Decoupling capacitors must be placed within 100 mil of all power pins per Intel device guidelines.
The 35x35 mm FCBGA package has a thermal resistance of approximately 2-4 C/W with proper PCB stack-up (12-layer, 1-oz copper, thermal vias). Industrial temperature variants (I2 suffix) require heatsinks for typical workloads above 15 W. The exposed pad must be soldered to the PCB with a thermal-via array for heat dissipation. Use junction temperature monitoring via the built-in temperature sensor diode with external ADC monitoring.
The 1152-ball FCBGA requires 12+ layer PCB with HDI microvia stack-ups and matched length routing for DDR4 interfaces (length matching to within 25 mil). Transceiver channels require impedance-controlled 100-ohm differential pairs with continuous reference planes and AC-coupling capacitors within 200 mil of the BGA ball. Use Intel-recommended footprint with NSMD (non-solder mask defined) pads and 0.4 mm ball pitch for signal routing escape.
DDR4 interfaces run up to 1200 MHz (2400 MT/s) and require careful SI analysis with IBIS-AMI models. Transceiver channels support up to 28 Gbps (PMA-only) with adaptive equalization. Reference the Arria 10 SX Transceiver User Guide for SI design guidelines. Series coupling capacitors on TX outputs must be placed within 200 mil of the BGA with controlled impedance.
Do not power up the device without proper power sequencing (VCC core before VCCIO/VCCHPS). The MSEL pins must be configured correctly to select the configuration scheme (active serial x4, Avalon-ST x8, etc.). The HPS cold reset must be released only after HPS power rails stabilize. Always validate configuration timing against the device datasheet - incorrect MSEL or MSEL0/MMSEL setting is the most common boot failure cause for Arria 10 SX SoC FPGAs.
Compliance Information
LG suffix in part number indicates lead-free termination per Intel ordering code conventions. RoHS compliance confirmed by Intel product page. AEC-Q100 not applicable - this is an industrial/commercial FPGA, not an automotive-grade discrete component.
