10AS057H2F34E2SG - Arria 10 SX SoC FPGA 570K LE | Intel
MPN: 10AS057H2F34E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4200 | $4,200.00 |
| 10 | $3950 | $39,500.00 |
| 100 | $3700 | $370,000.00 |
| 500 | $3480 | $1,740,000.00 |
| 1,000 | $3250 | $3,250,000.00 |
Drop-in alternatives for 10AS057H2F34E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS057H2F34E2LG
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View Datasheet →10AS057H1F34E1HG
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View Datasheet →10AS057H2F34E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Process Technology | 20 nm (FPGA fabric) / 28 nm (HPS) |
| Package | 1152-FBGA, FC (35x35 mm) |
| Ball Pitch | 1.0 mm |
| Speed Grade | E2 (extended temperature) |
| Core Voltage | 0.9 V nominal |
| Operating Temperature | -40C to +100C (extended grade) |
| Mounting Type | Surface Mount |
| Supply Type | Tray |
| Transceiver Data Rate (max) | 14.1 Gbps |
| DSP Blocks | Yes (variable-precision, 27x27 multipliers) |
| RoHS Status | Compliant |
10AS057H2F34E2SG 1152-fbga, fc (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS057H2F34E2SG (1152-fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057H2F34E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H2F34E2SG is suitable for 6 applications: Software-Defined Radio (SDR) Baseband, Industrial Machine Vision, Radar and Lidar Pre-Processing, Medical Imaging Accelerators, Aerospace and Defense Signal Processing, 5G Small-Cell Baseband.
Software-Defined Radio (SDR) Baseband
The 10AS057H2F34E2SG's 570K logic elements and dual ARM Cortex-A9 HPS running at 1.5 GHz make it ideal for software-defined radio baseband processing. The FPGA fabric handles parallel digital down-conversion (DDC), channelization filters, and FFT kernels, while the HPS runs a real-time Linux OS for protocol stack and packet processing. With 14.1 Gbps transceivers, the device interfaces directly to RF ADCs/DACs (e.g., AD9371) and supports CPRI and 10GbE backhaul links. The tight HPS-to-FPGA coherent interconnect (AXI bridges) eliminates the latency of external processor-to-FPGA links.
Recommended
Industrial Machine Vision
The 10AS057H2F34E2SG suits high-throughput industrial machine vision pipelines where the HPS runs image pre-processing (debayering, lens correction) and an OS for camera control, while the FPGA fabric accelerates parallel pixel-pipeline operations (Sobel, Canny edge detection, CNN inference). The HPS peripherals — Gigabit Ethernet for GigE Vision cameras, USB for 3D sensors, and SATA for high-speed storage — enable direct integration without external glue. At 1.5 GHz HPS, the device handles 4K@60fps pre-processing while offloading feature extraction to the FPGA fabric.
Recommended
Radar and Lidar Pre-Processing
The 10AS057H2F34E2SG is well-suited to automotive and industrial radar/lidar pre-processing. The FPGA fabric handles high-bandwidth ADC sample ingestion (LVDS or JESD204B), range-Doppler FFT computation, and CFAR detection, while the HPS runs object tracking and classification algorithms. Its variable-precision DSP blocks enable power-efficient fixed-point math for FFT sizes up to 65k points. With 1.5 GHz HPS, the device can process 8 simultaneous radar channels in real time at sub-1 ms latency, critical for autonomous driving decision loops.
Recommended
Medical Imaging Accelerators
The 10AS057H2F34E2SG accelerates medical imaging workloads such as ultrasound beamforming, CT reconstruction, and MRI pre-processing. The FPGA fabric's parallel architecture handles thousands of ultrasound channel data streams simultaneously, while the HPS orchestrates image reconstruction and display. The device's medical-grade reliability and CoSight debug enable deterministic real-time performance required for diagnostic imaging. DDR3/DDR4 HPS controllers support high-bandwidth image data buffering for 3D/4D medical imaging modalities.
Recommended
Aerospace and Defense Signal Processing
The 10AS057H2F34E2SG serves aerospace and defense applications such as electronic warfare (EW), SIGINT, and secure communications. The extended temperature grade (-40C to +100C) and 14.1 Gbps transceivers support ruggedized, high-bandwidth processing platforms. The HPS runs a secure OS for crypto key management and protocol handling, while the FPGA fabric accelerates high-rate signal processing kernels. The device's wide operating temperature range and high-reliability BGA package suit airborne and ground-mobile deployments.
Recommended
5G Small-Cell Baseband
The 10AS057H2F34E2SG is deployed in 5G small-cell baseband units where mid-density FPGA logic and HPS integration enable cost-effective PHY-layer processing. The FPGA fabric handles CPRI/JESD204B front-haul interface, channel coding (LDPC, Polar), and FFT/iFFT for OFDM, while the HPS runs a real-time OS for MAC scheduling and management-plane protocols. With 14.1 Gbps transceivers, the device supports 4T4R small-cell configurations at sub-6 GHz with low power envelope.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H2F34E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H2F34E2LG | 10AS057H1F34E1HG | 10AS048H4F34E3SG | 10AS032H4F34E3SG |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Logic Elements | 570,000 | 570,000 | 570,000 | 480,000 | 320,000 |
| HPS Maximum Frequency | 1.5 GHz | 1.5 GHz | 1.0 GHz | 1.5 GHz | 1.5 GHz |
| Speed Grade | E2 | E2 | E1 | E3 | E3 |
| Operating Temperature | -40C to +100C (extended) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Transceiver Max Data Rate | 14.1 Gbps | 14.1 Gbps | 17.4 Gbps | 12.5 Gbps | 12.5 Gbps |
| Process Technology | 20nm | 20nm | 20nm | 20nm | 20nm |
Key Differentiators
- 570K LE and dual ARM Cortex-A9 HPS in single package (vs 10AX032E3F29E2SG)
- Higher logic density at the same E2 speed grade (vs 10AS048H4F34E3SG)
- Mid-range Arria 10 SX with extended temperature grade (vs 10AS032H4F34E3SG)
Design Notes
The 1152-FBGA package requires a heatsink or cold-plate for sustained operation above 5W of total device power. Estimated: at typical HPS+FPGA utilization (40% logic toggle rate, 50% DSP utilization, 1.5 GHz HPS), junction power dissipation is approximately 8-12W. Use the Arria 10 thermal model (AN-786) to compute junction temperature from measured case temperature. A thermal interface material (TIM) with thermal conductivity >= 3.0 W/mK is recommended between the lid and heatsink.
The 35x35 mm FC-FBGA with 1.0 mm ball pitch requires a high-density PCB stack-up with microvia-in-pad (VIPPO) processing on the BGA breakout layer. Use a 12-layer or 14-layer PCB with 4-6 routing layers dedicated to BGA escape. Per Arria 10 AN-789 PCB design guide, route signal traces on the top layer under the BGA using escape vias to inner layers; keep reference planes continuous under the BGA for power integrity. Add 10uF X7R bypass capacitors at each power pin group within 50 mils of the pin.
The Arria 10 SX device requires multiple power rails: 0.9V core (VCC), 0.95V HPS core, 1.8V/2.5V/3.0V I/O banks (VCCIO), 1.8V PLL analog (VCCPLL), and transceiver supplies (VCCR/VCCP/VCCT). Each rail has a strict sequencing requirement; the Power Management Controller (PMC) manages hot-socketing and power sequencing per the Arria 10 Power Management User Guide. Use Intel-recommended PMICs such as the Enpirion EN6363QI for efficiency and sequencing compliance.
Do not omit the configuration source selection — Arria 10 SX supports JTAG, EPCQ flash, SD card, and HPS bootloader. Boot order is software-configurable but must be set via Quartus Prime pin assignments and the BootROM. Ensure the configuration flash (e.g., EPCQL1024) is sized for the FPGA bitstream plus any HPS preloader and bootloader images, which can total 32-64 MB for Linux systems.
For 14.1 Gbps transceiver operation (E2 speed grade), controlled impedance routing (100 ohm differential) with length matching within 5 mils per pair is required. Use Arria 10 transceiver channel simulation models (IBIS-AMI) with your stack-up to validate pre-emphasis and equalization settings. Reference Arria 10 Transceiver PHY User Guide for detailed channel loss budget and crosstalk analysis procedures.
Compliance Information
RoHS and lead-free status per Intel/ALTERA product page. AEC-Q100 not applicable — this is an FPGA, not a discrete automotive-grade IC. See Intel's Conflict Minerals Report for CFSI compliance.
