10CL016YE144C8G - Cyclone 10 LP FPGA, 16K LE, 144-EQFP | Intel
MPN: 10CL016YE144C8G ✓ نشط10CL016YE144C8G نظرة عامة
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnects, and dedicated hardware blocks (memory, multipliers, PLLs) that engineers can reconfigure after manufacture. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design hierarchy: more flexible than ASICs, far more parallel than MCUs. The Cyclone 10 LP family specifically targets applications where traditional FPGAs would exceed power or cost budgets, enabling FPGA adoption in industrial, automotive, video, and IoT edge designs where millions of gate equivalents are needed without the NRE of an ASIC.
Key features of the 10CL016YE144C8G include 15,408 logic elements implemented as adaptive logic modules (ALMs) with 8-input fracturable look-up tables, 56 embedded 18x18 multipliers (224 9x9 multipliers), 516 Kbits of embedded SRAM arranged in M9K blocks, four general-purpose PLLs, and up to 78 user I/O pins maximum. The device supports LVDS, LVCMOS, LVTTL, SSTL, and HSTL I/O standards with multiple voltage-referenced standards. Configuration is supported via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes.
The Cyclone 10 LP architecture uses an ALM-based fabric providing better logic packing efficiency than older Cyclone IV/VI architectures. The 144-EQFP exposed-pad package provides thermal performance suitable for moderate power designs without external heatsinking, while configuration flexibility supports multi-boot and remote update behavior via the dedicated configuration controller. The C8 speed grade trades timing margin for lower unit cost compared to C6 or C7 grades.
Typical applications include industrial motor control, video bridging and processing, machine vision interfaces, low-cost PCIe endpoints, IoT gateways, and human-machine interface (HMI) displays. The combination of low static and dynamic power with adequate logic density makes this device particularly suitable for cost-sensitive high-volume products.
When designing with this FPGA, ensure proper decoupling per Intel's power distribution network guidelines (typically 0.1 uF and 10 uF capacitors near each supply pin) and follow the configuration scheme recommendations in the Cyclone 10 LP device handbook to achieve reliable multi-boot and remote update behavior. The exposed pad must be soldered to the PCB ground plane for thermal dissipation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select and source the right Cyclone 10 LP variant for cost-sensitive FPGA designs.
بدائل مباشرة لـ 10CL016YE144C8G — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 10CL016YE144C8G (نفس عامل الشكل والبصمة) — يختلف في Package, Configuration Modes, Operating Temperature, Embedded Memory, Speed Grade.
10CL016YE144I7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
10CL016YE144A7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
10CL016YE144C6N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
10CL016YE144C7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
10CL016YE144C8G الحدود القصوى والخصائص الكهربائية
| Family | Cyclone 10 LP |
| Logic Elements | 15,408 |
| Embedded Memory | 516,096 bits (M9K blocks) |
| Embedded Multipliers | 56 (18x18) |
| User I/O Pins (max) | 78 |
| PLLs | 4 |
| Process Technology | 60 nm low-power |
| Core Voltage | 1.0 V |
| العلبة | 144-pin EQFP Exposed Pad |
| Speed Grade | C8 (slowest commercial) |
| درجة حرارة التشغيل | 0C to +85C (commercial) |
| Configuration Modes | JTAG, AS, PS, FPP |
| I/O Standards | LVDS, LVCMOS, LVTTL, SSTL, HSTL |
| حالة RoHS | Compliant |
| نوع التركيب | Surface Mount |
تكوين أطراف 10CL016YE144C8G
| دبوس 1 | I/O — General purpose user I/O (bank 1) |
| دبوس 2 | I/O — General purpose user I/O (bank 1) |
| دبوس 3 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 4 | I/O — General purpose user I/O (bank 1) |
| دبوس 5 | I/O — General purpose user I/O (bank 1) |
| دبوس 6 | GND — Ground |
| دبوس 7 | I/O — General purpose user I/O (bank 2) |
| دبوس 8 | I/O — General purpose user I/O (bank 2) |
| دبوس 9 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 10 | I/O — General purpose user I/O (bank 2) |
| دبوس 11 | I/O — General purpose user I/O (bank 2) |
| دبوس 12 | GND — Ground |
| دبوس 13 | I/O — General purpose user I/O (bank 3) |
| دبوس 14 | I/O — General purpose user I/O (bank 3) |
| دبوس 15 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 16 | I/O — General purpose user I/O (bank 3) |
| دبوس 17 | I/O — General purpose user I/O (bank 3) |
| دبوس 18 | GND — Ground |
| دبوس 19 | I/O — General purpose user I/O (bank 4) |
| دبوس 20 | I/O — General purpose user I/O (bank 4) |
| دبوس 21 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 22 | I/O — General purpose user I/O (bank 4) |
| دبوس 23 | I/O — General purpose user I/O (bank 4) |
| دبوس 24 | GND — Ground |
| دبوس 25 | I/O — General purpose user I/O (bank 5) |
| دبوس 26 | I/O — General purpose user I/O (bank 5) |
| دبوس 27 | VCCIO5 — I/O bank 5 supply voltage |
| دبوس 28 | I/O — General purpose user I/O (bank 5) |
| دبوس 29 | I/O — General purpose user I/O (bank 5) |
| دبوس 30 | GND — Ground |
| دبوس 31 | I/O — General purpose user I/O (bank 6) |
| دبوس 32 | I/O — General purpose user I/O (bank 6) |
| دبوس 33 | VCCIO6 — I/O bank 6 supply voltage |
| دبوس 34 | I/O — General purpose user I/O (bank 6) |
| دبوس 35 | I/O — General purpose user I/O (bank 6) |
| دبوس 36 | GND — Ground |
| دبوس 37 | I/O — General purpose user I/O (bank 7) |
| دبوس 38 | I/O — General purpose user I/O (bank 7) |
| دبوس 39 | VCCIO7 — I/O bank 7 supply voltage |
| دبوس 40 | I/O — General purpose user I/O (bank 7) |
| دبوس 41 | I/O — General purpose user I/O (bank 7) |
| دبوس 42 | GND — Ground |
| دبوس 43 | I/O — General purpose user I/O (bank 8) |
| دبوس 44 | I/O — General purpose user I/O (bank 8) |
| دبوس 45 | VCCIO8 — I/O bank 8 supply voltage |
| دبوس 46 | I/O — General purpose user I/O (bank 8) |
| دبوس 47 | I/O — General purpose user I/O (bank 8) |
| دبوس 48 | GND — Ground |
| دبوس 49 | MSEL0 — Configuration mode select 0 |
| دبوس 50 | MSEL1 — Configuration mode select 1 |
| دبوس 51 | MSEL2 — Configuration mode select 2 |
| دبوس 52 | nCONFIG — Configuration control (active low) |
| دبوس 53 | nSTATUS — Configuration status (active low) |
| دبوس 54 | CONF_DONE — Configuration done (open drain) |
| دبوس 55 | TCK — JTAG test clock |
| دبوس 56 | TMS — JTAG test mode select |
| دبوس 57 | TDI — JTAG test data in |
| دبوس 58 | TDO — JTAG test data out |
| دبوس 59 | VCCAUX — Auxiliary supply (2.5V) |
| دبوس 60 | GND — Ground |
| دبوس 61 | DATA0 — Configuration data input 0 (AS/PS/FPP) |
| دبوس 62 | nCE0 — Chip enable 0 (active low) |
| دبوس 63 | DCLK — Configuration clock |
| دبوس 64 | VCCINT — Core supply voltage (1.0V) |
| دبوس 65 | GND — Ground |
| دبوس 66 | VCCINT — Core supply voltage (1.0V) |
| دبوس 67 | I/O — General purpose user I/O (bank 1) |
| دبوس 68 | I/O — General purpose user I/O (bank 1) |
| دبوس 69 | GND — Ground |
| دبوس 70 | I/O — General purpose user I/O (bank 1) |
| دبوس 71 | I/O — General purpose user I/O (bank 1) |
| دبوس 72 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 73 | I/O — General purpose user I/O (bank 1) |
| دبوس 74 | I/O — General purpose user I/O (bank 2) |
| دبوس 75 | GND — Ground |
| دبوس 76 | I/O — General purpose user I/O (bank 2) |
| دبوس 77 | I/O — General purpose user I/O (bank 2) |
| دبوس 78 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 79 | I/O — General purpose user I/O (bank 2) |
| دبوس 80 | I/O — General purpose user I/O (bank 2) |
| دبوس 81 | GND — Ground |
| دبوس 82 | I/O — General purpose user I/O (bank 3) |
| دبوس 83 | I/O — General purpose user I/O (bank 3) |
| دبوس 84 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس 85 | I/O — General purpose user I/O (bank 3) |
| دبوس 86 | I/O — General purpose user I/O (bank 3) |
| دبوس 87 | GND — Ground |
| دبوس 88 | I/O — General purpose user I/O (bank 4) |
| دبوس 89 | I/O — General purpose user I/O (bank 4) |
| دبوس 90 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس 91 | I/O — General purpose user I/O (bank 4) |
| دبوس 92 | I/O — General purpose user I/O (bank 4) |
| دبوس 93 | GND — Ground |
| دبوس 94 | I/O — General purpose user I/O (bank 5) |
| دبوس 95 | I/O — General purpose user I/O (bank 5) |
| دبوس 96 | VCCIO5 — I/O bank 5 supply voltage |
| دبوس 97 | I/O — General purpose user I/O (bank 5) |
| دبوس 98 | I/O — General purpose user I/O (bank 5) |
| دبوس 99 | GND — Ground |
| دبوس 100 | I/O — General purpose user I/O (bank 6) |
| دبوس 101 | I/O — General purpose user I/O (bank 6) |
| دبوس 102 | VCCIO6 — I/O bank 6 supply voltage |
| دبوس 103 | I/O — General purpose user I/O (bank 6) |
| دبوس 104 | I/O — General purpose user I/O (bank 6) |
| دبوس 105 | GND — Ground |
| دبوس 106 | I/O — General purpose user I/O (bank 7) |
| دبوس 107 | I/O — General purpose user I/O (bank 7) |
| دبوس 108 | VCCIO7 — I/O bank 7 supply voltage |
| دبوس 109 | I/O — General purpose user I/O (bank 7) |
| دبوس 110 | I/O — General purpose user I/O (bank 7) |
| دبوس 111 | GND — Ground |
| دبوس 112 | I/O — General purpose user I/O (bank 8) |
| دبوس 113 | I/O — General purpose user I/O (bank 8) |
| دبوس 114 | VCCIO8 — I/O bank 8 supply voltage |
| دبوس 115 | I/O — General purpose user I/O (bank 8) |
| دبوس 116 | I/O — General purpose user I/O (bank 8) |
| دبوس 117 | GND — Ground |
| دبوس 118 | I/O — General purpose user I/O (bank 8) |
| دبوس 119 | I/O — General purpose user I/O (bank 8) |
| دبوس 120 | VCCIO8 — I/O bank 8 supply voltage |
| دبوس 121 | I/O — General purpose user I/O (bank 8) |
| دبوس 122 | I/O — General purpose user I/O (bank 1) |
| دبوس 123 | GND — Ground |
| دبوس 124 | I/O — General purpose user I/O (bank 1) |
| دبوس 125 | I/O — General purpose user I/O (bank 1) |
| دبوس 126 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس 127 | I/O — General purpose user I/O (bank 1) |
| دبوس 128 | I/O — General purpose user I/O (bank 1) |
| دبوس 129 | GND — Ground |
| دبوس 130 | VCCAUX — Auxiliary supply (2.5V) |
| دبوس 131 | VCCINT — Core supply voltage (1.0V) |
| دبوس 132 | GND — Ground |
| دبوس 133 | VCCINT — Core supply voltage (1.0V) |
| دبوس 134 | I/O — General purpose user I/O (bank 2) |
| دبوس 135 | I/O — General purpose user I/O (bank 2) |
| دبوس 136 | GND — Ground |
| دبوس 137 | I/O — General purpose user I/O (bank 2) |
| دبوس 138 | I/O — General purpose user I/O (bank 2) |
| دبوس 139 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس 140 | I/O — General purpose user I/O (bank 2) |
| دبوس 141 | I/O — General purpose user I/O (bank 3) |
| دبوس 142 | GND — Ground |
| دبوس 143 | I/O — General purpose user I/O (bank 3) |
| دبوس 144 | I/O — General purpose user I/O (bank 3) |
| دبوس EP | EPAD — Exposed thermal pad - connect to PCB ground plane |
التطبيقات النموذجية
10CL016YE144C8G مناسب لـ 6 التطبيقs: Industrial Motor Control, Video Bridging and Processing, Machine Vision Interfaces, IoT Edge Gateways, Human-Machine Interface (HMI) Displays, Low-Cost PCIe Endpoint Applications.
Industrial Motor Control
The 10CL016YE144C8G is well-suited for industrial motor control and drive applications requiring field-oriented control (FOC), space-vector PWM generation, and encoder feedback processing. Its 56 embedded 18x18 multipliers can implement the Park/Clarke transforms and PI controllers required for FOC loops on multi-axis systems, while the 4 general-purpose PLLs generate precise PWM carrier frequencies from a single crystal reference. The 78 user I/O pins accommodate 3-phase PWM outputs, Hall sensor inputs, QEI encoder interfaces, and communication peripherals (RS-485, CAN, SPI). Power dissipation is moderate thanks to the 60 nm low-power process, allowing fanless operation in sealed industrial enclosures. The commercial C8 speed grade is adequate for motor control loops operating at typical 10-20 kHz PWM frequencies, with substantial margin remaining for protection logic and housekeeping functions.
موصى به
Video Bridging and Processing
The 10CL016YE144C8G can perform video format conversion, scaling, and bridging in cost-sensitive professional and prosumer video equipment. The 56 embedded multipliers handle real-time color space conversion (RGB to YCbCr) and chroma resampling, while the 516 Kbits of M9K memory implements line buffers for scaling and deinterlacing operations. The 78 user I/Os support multiple video interfaces including BT.656 parallel, Camera Link LVDS, and HDMI/DVI auxiliary channels when paired with external serializers. Industrial temperature grade availability (via the -I7N variant) suits outdoor signage and broadcast equipment deployments. Designers should budget logic utilization carefully - typical 1080p60 processing designs consume 40-60% of the 10CL016 capacity, leaving limited headroom for additional features.
موصى به
Machine Vision Interfaces
The 10CL016YE144C8G integrates machine vision preprocessing functions for factory automation and quality inspection systems. Its parallel multiplier array accelerates convolution kernels and Sobel edge detection in real time, while the abundant on-chip M9K memory buffers scan lines from CMOS image sensors without external SRAM. The PLL count supports the multiple clock domains required for sensor interfaces (LVDS, sub-LVDS, HiSPi) and processor hand-off buses. Industrial temperature variants are appropriate for factory floor installations. The C8 speed grade timing margin is sufficient for typical 60-100 MHz pixel clock rates, and the EQFP-144 package enables hand-repairable designs during prototyping - a significant advantage over BGA alternatives in low-volume machine builder markets.
موصى به
IoT Edge Gateways
The 10CL016YE144C8G serves as the processing core for IoT edge gateways aggregating sensor data, running local analytics, and bridging to cloud protocols. The 15,408 logic elements implement protocol conversion stacks (Modbus, BACnet, MQTT, OPC-UA) simultaneously, while the 516 Kbits of embedded memory buffer incoming sensor streams. Multiple PLLs generate independent clocks for Ethernet MAC, wireless module interfaces, and sensor buses. The 78 user I/Os accommodate multiple UARTs, SPI buses, and GPIO expansion for industrial sensor arrays. Low static power makes this Cyclone 10 LP variant suitable for thermally constrained gateway enclosures, and the commercial C8 grade keeps unit costs low for high-volume IoT deployments. The exposed-pad package simplifies thermal dissipation in fanless gateway designs.
موصى به
Human-Machine Interface (HMI) Displays
The 10CL016YE144C8G drives HMI displays in industrial control panels, medical equipment, and point-of-sale terminals. Its embedded multipliers accelerate touch-screen coordinate interpolation and graphics rendering primitives, while the M9K memory blocks serve as display framebuffers for small TFT panels (up to 800x480 resolution). The 78 user I/Os interface with RGB or LVDS display panels, touch controllers, backlight drivers, and user input buttons/encoders. Multiple PLLs generate the precise pixel clock frequencies required by various display timings. The commercial temperature grade suits indoor HMI installations, while the EQFP-144 package allows easy board rework during display bring-up - a frequent requirement when swapping between display vendors with different timing requirements.
موصى به
Low-Cost PCIe Endpoint Applications
The 10CL016YE144C8G can serve as a low-cost PCIe Gen1 endpoint for data acquisition cards, industrial I/O expansion, and embedded computing platforms. Cyclone 10 LP devices include hard PCIe Gen1 IP (root port and endpoint) that consumes minimal logic resources, leaving the 15K logic elements available for application logic. The 56 multipliers support DSP preprocessing functions common in data acquisition pipelines. The 78 user I/Os accommodate multiple auxiliary interfaces alongside the PCIe lanes. The C8 speed grade is adequate for Gen1 (2.5 GT/s) signaling, and the EQFP-144 package allows prototype debugging without the X-ray inspection required for BGA PCIe-capable FPGAs. Designers should pair this device with external PCIe clock sources and follow Intel's PCIe layout guidelines for the E144 package.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 10CL016YE144C8G — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 10CL016YE144I7N | 10CL016YE144A7N | 10CL016YE144C6N | 10CL016YE144C7N |
|---|---|---|---|---|---|
| Package | 144-pin EQFP Exposed Pad | 144-pin EQFP Exposed Pad - same | 144-pin EQFP Exposed Pad - same | 144-pin EQFP Exposed Pad - same | 144-pin EQFP Exposed Pad - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 |
| Speed Grade | C8 | C7 (faster) | C7 (faster) | C6 (fastest) | C7 (faster) |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +125C (automotive) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Embedded Memory | 516 Kbits | 516 Kbits | 516 Kbits | 516 Kbits | 516 Kbits |
| Embedded Multipliers | 56 (18x18) | 56 (18x18) | 56 (18x18) | 56 (18x18) | 56 (18x18) |
| AEC-Q100 Qualified | No | No | Yes | No | No |
| Approximate Unit Cost (1k qty) | $16.40 | Higher (industrial grade) | Highest (automotive grade) | +10% (faster speed) | +5% (faster speed) |
أبرز الفروقات
- C8 speed grade offers lowest cost in Cyclone 10 LP family (مقابل10CL016YE144C6N)
- Commercial temperature grade suits indoor applications (مقابل10CL016YE144I7N)
- EQFP-144 package enables hand-reworkable designs (مقابل10CL016YU484C8G)
ملاحظات التصميم
Estimated: The 10CL016YE144C8G requires multiple supply rails - VCCINT (1.0V core), VCCAUX (2.5V auxiliary), and up to 8 VCCIO bank supplies (1.2V to 3.3V depending on I/O standard). Place 0.1 uF decoupling capacitors within 2 mm of every VCCINT/VCCAUX/VCCIO pin, and add 10 uF bulk capacitors at each supply region. Total quiescent current is typically 100-300 mA depending on logic utilization and clock rates; measure with actual design loaded before finalizing the power tree.
The exposed pad (EPAD) underneath the EQFP-144 package MUST be soldered to a PCB ground plane for proper thermal dissipation and electrical grounding. Failure to solder the EPAD can cause thermal runaway and erratic behavior. Use thermal vias (typically 9-16 vias in a 1.2 mm pitch array) connecting the EPAD to internal ground planes. Follow the recommended PCB footprint in the Cyclone 10 LP device handbook to avoid solder joint reliability issues.
Do not assume C8 speed grade is acceptable for all designs - if your design uses high fanout or complex routing, verify timing closure in Quartus Prime before committing to C8. C6 (fastest) and C7 grades offer additional timing margin at higher cost. Also, ensure MSEL pins are correctly configured for the intended configuration mode (AS vs PS vs JTAG vs FPP); incorrect MSEL settings cause configuration failure. Use the Quartus Prime programmer to verify the configuration chain during bring-up.
معلومات الامتثال
RoHS and REACH compliant per Intel/Altera product page. C8 commercial variant is NOT AEC-Q100 qualified - choose 10CL016YE144A7N variant for automotive applications.
