10CL025YE144A7G - Cyclone 10 LP FPGA 25K LE, 76 I/O, EQFP-144 | Intel
MPN: 10CL025YE144A7G ✓ نشط10CL025YE144A7G نظرة عامة
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as multipliers, memory blocks, and phase-locked loops (PLLs). Unlike a fixed-function ASIC, an FPGA's logic function is defined after manufacture through a hardware description language (HDL) bitstream, enabling rapid prototyping, field upgrades, and design reuse. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> low-power FPGAs, serving applications where custom logic, parallel processing, and reconfigurable I/O are required.
Key features of the 10CL025YE144A7G include 24,624 logic elements organized into adaptive logic modules (ALMs), 594 kbit of embedded SRAM (M9K blocks), up to 66 embedded 18x18 multipliers, 4 general-purpose PLLs, and support for external memory interfaces including DDR3, DDR2, and LPDDR2. The device supports common I/O standards such as LVDS, LVCMOS, SSTL, and HSTL via 76 general-purpose I/O pins. Configuration is achieved through an industry-standard serial (AS) or JTAG interface using the Quartus Prime design toolchain.
From an architectural standpoint, the Cyclone 10 LP family uses a low-power SRAM-based configuration cell backed by non-volatile flash configuration memory, providing instant-on behavior without an external boot PROM. The core fabric operates at 1.2 V with separate PLL and I/O bank supplies, and the device integrates a hard Memory Controller and PCIe Gen1 controller (soft IP supported in the fabric). This combination delivers ASIC-like deterministic timing at low static power, making the family suitable for industrial, automotive, and battery-powered edge applications.
Typical applications include industrial machine vision, motor control and robotics, video processing and display bridging, factory automation PLCs, low-power IoT gateways, and portable medical instrumentation. The 144-pin EQFP package provides ample I/O for parallel sensor aggregation while keeping board area and BOM cost low.
When designing with the 10CL025YE144A7G, ensure that each I/O bank has its own VCCIO supply matching the connected logic-level standard, and that the GND and core VCC pins are properly decoupled with 100 nF and 10 uF capacitors placed as close to the package as possible. The exposed thermal pad must be soldered to a continuous ground plane for thermal and electrical performance.
This page synthesizes distributor pricing from DigiKey, Mouser, Arrow, and LCSC, alongside drop-in alternative FPGAs, design notes, and parametric comparisons - information not aggregated in the official Altera/Intel datasheet.
بدائل مباشرة لـ 10CL025YE144A7G — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 10CL025YE144A7G (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, Embedded Memory, Logic Elements (LE), Process Technology.
10CL016YE144A7G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10CL025YE144C8G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10CL025YE144C6G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10CL025YE144I7G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10CL010YE144A7G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←LFE5U-25F-8BG256C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
10CL025YE144A7G الحدود القصوى والخصائص الكهربائية
| Family | Cyclone 10 LP |
| Logic Elements | 24,624 LE |
| Embedded Memory | 594 kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 66 |
| General-Purpose PLLs | 4 |
| User I/O Count | 76 |
| العلبة | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad |
| Core Supply Voltage (VCCINT) | 1.2 V |
| نطاق درجة حرارة التشغيل | 0 C to 85 C (commercial, A7 suffix) |
| Speed Grade | -7 |
| Process Technology | Low-power 60 nm |
| Configuration Memory | On-chip flash (instant-on, no external boot PROM) |
| نوع التركيب | Surface Mount |
| Packaging | Tray |
| حالة RoHS | Compliant |
تكوين أطراف 10CL025YE144A7G
| دبوس 1 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 2 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 3 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 4 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 5 | GND — Ground reference |
| دبوس 6 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 7 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 8 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 9 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 10 | VCCIO1A — I/O supply, bank 1A |
| دبوس 11 | I/O_BANK_1B — General-purpose I/O, bank 1B |
| دبوس 12 | I/O_BANK_1B — General-purpose I/O, bank 1B |
| دبوس 13 | GND — Ground reference |
| دبوس 14 | I/O_BANK_1B — General-purpose I/O, bank 1B |
| دبوس 15 | I/O_BANK_1B — General-purpose I/O, bank 1B |
| دبوس 16 | VCCIO1B — I/O supply, bank 1B |
| دبوس 17 | I/O_BANK_2 — General-purpose I/O, bank 2 |
| دبوس 18 | I/O_BANK_2 — General-purpose I/O, bank 2 |
| دبوس 19 | I/O_BANK_2 — General-purpose I/O, bank 2 |
| دبوس 20 | I/O_BANK_2 — General-purpose I/O, bank 2 |
| دبوس 21 | GND — Ground reference |
| دبوس 22 | I/O_BANK_2 — General-purpose I/O, bank 2 |
| دبوس 23 | I/O_BANK_2 — General-purpose I/O, bank 2 |
| دبوس 24 | VCCIO2 — I/O supply, bank 2 |
| دبوس 25 | I/O_BANK_3 — General-purpose I/O, bank 3 |
| دبوس 26 | I/O_BANK_3 — General-purpose I/O, bank 3 |
| دبوس 27 | GND — Ground reference |
| دبوس 28 | I/O_BANK_3 — General-purpose I/O, bank 3 |
| دبوس 29 | I/O_BANK_3 — General-purpose I/O, bank 3 |
| دبوس 30 | VCCIO3 — I/O supply, bank 3 |
| دبوس 31 | I/O_BANK_4 — General-purpose I/O, bank 4 |
| دبوس 32 | I/O_BANK_4 — General-purpose I/O, bank 4 |
| دبوس 33 | I/O_BANK_4 — General-purpose I/O, bank 4 |
| دبوس 34 | I/O_BANK_4 — General-purpose I/O, bank 4 |
| دبوس 35 | GND — Ground reference |
| دبوس 36 | I/O_BANK_4 — General-purpose I/O, bank 4 |
| دبوس 37 | VCCIO4 — I/O supply, bank 4 |
| دبوس 38 | I/O_BANK_5 — General-purpose I/O, bank 5 |
| دبوس 39 | I/O_BANK_5 — General-purpose I/O, bank 5 |
| دبوس 40 | I/O_BANK_5 — General-purpose I/O, bank 5 |
| دبوس 41 | GND — Ground reference |
| دبوس 42 | I/O_BANK_5 — General-purpose I/O, bank 5 |
| دبوس 43 | I/O_BANK_5 — General-purpose I/O, bank 5 |
| دبوس 44 | VCCIO5 — I/O supply, bank 5 |
| دبوس 45 | I/O_BANK_6 — General-purpose I/O, bank 6 |
| دبوس 46 | I/O_BANK_6 — General-purpose I/O, bank 6 |
| دبوس 47 | I/O_BANK_6 — General-purpose I/O, bank 6 |
| دبوس 48 | I/O_BANK_6 — General-purpose I/O, bank 6 |
| دبوس 49 | GND — Ground reference |
| دبوس 50 | I/O_BANK_6 — General-purpose I/O, bank 6 |
| دبوس 51 | VCCIO6 — I/O supply, bank 6 |
| دبوس 52 | I/O_BANK_7 — General-purpose I/O, bank 7 |
| دبوس 53 | I/O_BANK_7 — General-purpose I/O, bank 7 |
| دبوس 54 | I/O_BANK_7 — General-purpose I/O, bank 7 |
| دبوس 55 | GND — Ground reference |
| دبوس 56 | I/O_BANK_7 — General-purpose I/O, bank 7 |
| دبوس 57 | I/O_BANK_7 — General-purpose I/O, bank 7 |
| دبوس 58 | VCCIO7 — I/O supply, bank 7 |
| دبوس 59 | I/O_BANK_8 — General-purpose I/O, bank 8 |
| دبوس 60 | I/O_BANK_8 — General-purpose I/O, bank 8 |
| دبوس 61 | I/O_BANK_8 — General-purpose I/O, bank 8 |
| دبوس 62 | I/O_BANK_8 — General-purpose I/O, bank 8 |
| دبوس 63 | GND — Ground reference |
| دبوس 64 | I/O_BANK_8 — General-purpose I/O, bank 8 |
| دبوس 65 | VCCIO8 — I/O supply, bank 8 |
| دبوس 66 | CLK0 — Dedicated clock input, positive |
| دبوس 67 | CLK0n — Dedicated clock input, negative |
| دبوس 68 | GND — Ground reference |
| دبوس 69 | CLK1 — Dedicated clock input, positive |
| دبوس 70 | CLK1n — Dedicated clock input, negative |
| دبوس 71 | VCCAUX — Auxiliary supply (2.5 V) for PLLs |
| دبوس 72 | GND — Ground reference |
| دبوس 73 | nCONFIG — Configuration start (active-low) |
| دبوس 74 | nSTATUS — Configuration status (active-low) |
| دبوس 75 | CONFIG_DONE — Configuration complete (open-drain) |
| دبوس 76 | GND — Ground reference |
| دبوس 77 | TCK — JTAG test clock |
| دبوس 78 | TMS — JTAG test mode select |
| دبوس 79 | TDI — JTAG test data in |
| دبوس 80 | TDO — JTAG test data out |
| دبوس 81 | GND — Ground reference |
| دبوس 82 | MSEL0 — Configuration mode select 0 |
| دبوس 83 | MSEL1 — Configuration mode select 1 |
| دبوس 84 | MSEL2 — Configuration mode select 2 |
| دبوس 85 | AS_DATA0 — Active Serial data 0 |
| دبوس 86 | AS_DATA1 — Active Serial data 1 |
| دبوس 87 | AS_CLK — Active Serial clock |
| دبوس 88 | AS_nCSO — Active Serial chip select (active-low) |
| دبوس 89 | VCCINT — Core supply (1.2 V) |
| دبوس 90 | GND — Ground reference |
| دبوس 91 | VCCINT — Core supply (1.2 V) |
| دبوس 92 | I/O_BANK_8 — General-purpose I/O, bank 8 |
| دبوس 93 | I/O_BANK_8 — General-purpose I/O, bank 8 |
| دبوس 94 | I/O_BANK_8 — General-purpose I/O, bank 8 |
| دبوس 95 | GND — Ground reference |
| دبوس 96 | I/O_BANK_7 — General-purpose I/O, bank 7 |
| دبوس 97 | I/O_BANK_7 — General-purpose I/O, bank 7 |
| دبوس 98 | VCCIO7 — I/O supply, bank 7 |
| دبوس 99 | I/O_BANK_7 — General-purpose I/O, bank 7 |
| دبوس 100 | GND — Ground reference |
| دبوس 101 | I/O_BANK_6 — General-purpose I/O, bank 6 |
| دبوس 102 | I/O_BANK_6 — General-purpose I/O, bank 6 |
| دبوس 103 | I/O_BANK_6 — General-purpose I/O, bank 6 |
| دبوس 104 | VCCIO6 — I/O supply, bank 6 |
| دبوس 105 | I/O_BANK_6 — General-purpose I/O, bank 6 |
| دبوس 106 | GND — Ground reference |
| دبوس 107 | I/O_BANK_5 — General-purpose I/O, bank 5 |
| دبوس 108 | I/O_BANK_5 — General-purpose I/O, bank 5 |
| دبوس 109 | VCCIO5 — I/O supply, bank 5 |
| دبوس 110 | I/O_BANK_5 — General-purpose I/O, bank 5 |
| دبوس 111 | I/O_BANK_5 — General-purpose I/O, bank 5 |
| دبوس 112 | GND — Ground reference |
| دبوس 113 | I/O_BANK_4 — General-purpose I/O, bank 4 |
| دبوس 114 | I/O_BANK_4 — General-purpose I/O, bank 4 |
| دبوس 115 | VCCIO4 — I/O supply, bank 4 |
| دبوس 116 | I/O_BANK_4 — General-purpose I/O, bank 4 |
| دبوس 117 | I/O_BANK_4 — General-purpose I/O, bank 4 |
| دبوس 118 | GND — Ground reference |
| دبوس 119 | I/O_BANK_3 — General-purpose I/O, bank 3 |
| دبوس 120 | I/O_BANK_3 — General-purpose I/O, bank 3 |
| دبوس 121 | VCCIO3 — I/O supply, bank 3 |
| دبوس 122 | I/O_BANK_3 — General-purpose I/O, bank 3 |
| دبوس 123 | I/O_BANK_3 — General-purpose I/O, bank 3 |
| دبوس 124 | GND — Ground reference |
| دبوس 125 | I/O_BANK_2 — General-purpose I/O, bank 2 |
| دبوس 126 | I/O_BANK_2 — General-purpose I/O, bank 2 |
| دبوس 127 | VCCIO2 — I/O supply, bank 2 |
| دبوس 128 | I/O_BANK_2 — General-purpose I/O, bank 2 |
| دبوس 129 | I/O_BANK_2 — General-purpose I/O, bank 2 |
| دبوس 130 | GND — Ground reference |
| دبوس 131 | I/O_BANK_1B — General-purpose I/O, bank 1B |
| دبوس 132 | I/O_BANK_1B — General-purpose I/O, bank 1B |
| دبوس 133 | VCCIO1B — I/O supply, bank 1B |
| دبوس 134 | I/O_BANK_1B — General-purpose I/O, bank 1B |
| دبوس 135 | I/O_BANK_1B — General-purpose I/O, bank 1B |
| دبوس 136 | GND — Ground reference |
| دبوس 137 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 138 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 139 | VCCIO1A — I/O supply, bank 1A |
| دبوس 140 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 141 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 142 | GND — Ground reference |
| دبوس 143 | I/O_BANK_1A — General-purpose I/O, bank 1A |
| دبوس 144 | I/O_BANK_1A — General-purpose I/O, bank 1A |
التطبيقات النموذجية
10CL025YE144A7G مناسب لـ 7 التطبيقs: Industrial Machine Vision, Motor Control and Robotics, Video Processing and Display Bridging, Factory Automation PLCs, Low-Power IoT Gateways, Portable Medical Instrumentation, LED Display Controllers.
Industrial Machine Vision
The 10CL025YE144A7G's 24,624 logic elements and 66 18x18 multipliers make it well-suited for industrial machine vision pre-processing pipelines where it can perform Bayer demosaicing, Sobel edge detection, and thresholding in parallel across multiple image streams. The 594 kbit embedded M9K memory blocks buffer line-scan data between camera and processor, while the 4 PLLs generate pixel clocks, SDRAM clocks, and Ethernet PHY reference clocks from a single crystal. Its 1.2 V core minimizes heat dissipation in sealed IP67 camera housings.
موصى به
Motor Control and Robotics
For multi-axis motor control and robotic servo loops, the 10CL025YE144A7G's parallel logic fabric can implement up to 8 independent PID controllers at 100 kHz loop rates in a single device. The 66 embedded 18x18 multipliers accelerate Park/Clark transforms and space-vector PWM calculations for Field-Oriented Control (FOC) of 3-phase brushless motors. The 76 user I/Os comfortably handle 24 PWM channels, 8 quadrature encoder inputs, and CAN/RS-485 communications for a 6-axis robotic arm controller.
موصى به
Video Processing and Display Bridging
The 10CL025YE144A7G serves as a low-power video bridge between legacy camera interfaces (BT.601/656, LVDS) and modern MIPI CSI-2 or DisplayPort sinks, supporting up to 1080p60 with simple color-space conversion. The Cyclone 10 LP's hardware multipliers perform deinterlacing and scaling, while 594 kbit of embedded RAM holds scan-line buffers and frame-rate conversion FIFOs. The 1.2 V core voltage enables fan-less operation in signage and kiosk enclosures where reliability is critical.
موصى به
Factory Automation PLCs
The 10CL025YE144A7G's 76 user I/Os combined with on-chip flash configuration memory provide a deterministic, instant-on Programmable Logic Controller (PLC) platform for factory floor applications requiring <100 ms power-to-ready time. The device can implement IEC 61131-3 soft-CPU cores, EtherCAT slave controllers, and PROFIBUS interfaces in fabric. Hardened by the -40C to 100C industrial temperature option (10CL025YE144I7G), it replaces legacy microcontroller-based PLCs in harsh environments.
موصى به
Low-Power IoT Gateways
Battery-powered IoT gateways benefit from the 10CL025YE144A7G's low static power (~125 mW typical), instant-on flash configuration, and ability to run multiple wireless protocol stacks concurrently (LoRa, BLE 5.0, Zigbee) in soft IP. The 24,624 LE fabric can host a RISC-V soft CPU (e.g., VexRiscv) for local MQTT processing, while the 4 PLLs derive radio clocks from a single 32.768 kHz crystal. The exposed-pad EQFP package provides efficient thermal dissipation for always-on operation.
موصى به
Portable Medical Instrumentation
The 10CL025YE144A7G's deterministic timing, low power, and DSP-rich fabric support portable patient-monitoring devices such as pulse oximeters, ECG Holter monitors, and ultrasound front-ends. The 66 embedded 18x18 multipliers accelerate FFT and digital filtering of biosignals, while the 594 kbit M9K memory holds FIR/IIR coefficient tables and sample buffers. Operating from a 1.2 V core reduces battery drain, extending continuous-monitoring runtime beyond 24 hours on a single 1500 mAh cell.
موصى به
LED Display Controllers
Driving large LED video walls requires precise parallel control of thousands of PWM channels - a task perfectly matched to the 10CL025YE144A7G's parallel logic fabric. The device can scan up to 32 output channels per logic block while performing gamma correction and color-depth enhancement in real time. The 4 PLLs generate pixel clocks for HUB75 LED panels, and the 594 kbit embedded RAM holds display refresh buffers, eliminating the need for external SRAM in many mid-size installations.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 10CL025YE144A7G — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 10CL016YE144A7G | 10CL025YE144C8G | 10CL025YE144C6G | 10CL025YE144I7G | 10CL010YE144A7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | EQFP-144 (22x22 mm) | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same | EQFP-144 (22x22 mm) - same |
| Logic Elements | 24,624 LE | 16,624 LE (-33%) | 24,624 LE (same) | 24,624 LE (same) | 24,624 LE (same) | 10,320 LE (-58%) |
| Embedded Memory | 594 kbit | 504 kbit (-15%) | 594 kbit (same) | 594 kbit (same) | 594 kbit (same) | 414 kbit (-30%) |
| 18x18 Multipliers | 66 | 56 (-15%) | 66 (same) | 66 (same) | 66 (same) | 46 (-30%) |
| User I/O | 76 | 78 (+2) | 76 (same) | 76 (same) | 76 (same) | 76 (same) |
| Speed Grade | -7 | -7 | -8 (slower) | -6 (faster) | -7 | -7 |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | -40 C to 100 C (industrial) | 0 C to 85 C |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Configuration Memory | On-chip flash (instant-on) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
أبرز الفروقات
- Highest logic density in the Cyclone 10 LP 144-pin EQFP package family (مقابل10CL016YE144A7G)
- On-chip flash configuration provides instant-on without external boot PROM (مقابل10CL010YE144A7G)
- Commercial temperature variant offers lower cost than industrial-grade (مقابل10CL025YE144I7G)
ملاحظات التصميم
Estimated: At 25 C ambient with 50% logic utilization and 100 MHz typical toggle rate, the 10CL025YE144A7G draws approximately 250 mA from VCCINT (1.2 V). Each VCCIO bank can draw up to 100 mA at 3.3 V depending on I/O toggle rate and loading. Provide a star-routed power distribution network with one 100 nF ceramic decoupling cap per VCC pin and one 10 uF bulk capacitor per supply rail placed within 25 mm of the package. The VCCAUX 2.5 V rail for PLLs requires a ferrite bead filter to isolate PLL analog supply from digital switching noise. Refer to the Cyclone 10 LP device handbook PowerPlay section for tool-estimated power figures specific to your design.
Route all eight VCCIO bank supplies independently to allow mixed-voltage I/O standards. Each bank should have its own 100 nF + 10 uF decoupling pair, with the 100 nF cap placed within 2 mm of the device pin. The exposed thermal pad (EPAD) must be soldered to a continuous ground plane with at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) to provide both electrical reference and thermal dissipation. Use a 4-layer PCB with dedicated ground and power planes for designs above 50 MHz internal clock rates to maintain signal integrity.
Do not leave unused I/O pins floating. Configure them as outputs driving ground or as inputs with internal weak pull-up enabled to prevent excessive shoot-through current. The nCONFIG pin must be held high for at least 100 us after all power rails reach regulation before initiating configuration. When using AS (Active Serial) mode, ensure the configuration flash clock (AS_CLK) does not exceed 40 MHz at the FPGA pin and that the series resistor (typically 33 ohm) is placed close to the FPGA driver. Refer to AN 524: Using the Cyclone 10 LP Configuration Bitstream Error Detection feature for production designs.
Estimated: At full logic utilization (24,624 LE at 100 MHz, 1.2 V core), the device can dissipate up to 2.0 W requiring either 6 C/W thermal dissipation path or airflow of 1 m/s. The EQFP-144 with soldered exposed pad achieves theta_JA of approximately 18 C/W on a 4-layer JEDEC test board, which keeps junction temperature below 100 C at 70 C ambient for typical designs. For industrial temperature designs using 10CL025YE144I7G variant, derate 10% to account for elevated ambient operation. Use Quartus Prime PowerPlay Power Analyzer for design-specific thermal analysis.
معلومات الامتثال
RoHS and lead-free compliant per Intel product declaration. Not AEC-Q100 qualified; for automotive applications use AEC-Q100 qualified Cyclone 10 LP automotive variants or higher-grade families.
