10M16DAF484A7G - MAX 10 FPGA 16K LE 484-BGA | Intel
MPN: 10M16DAF484A7G ✓ نشط10M16DAF484A7G نظرة عامة
A field-programmable gate array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. The MAX 10 family belongs to the low-cost, non-volatile FPGA category, sitting between standard CPLDs and high-performance SRAM-based FPGAs in the programmable logic taxonomy: FPGA > programmable logic > programmable logic IC > semiconductor device.
Key features include a 1.0 V core with on-die voltage regulation, support for Nios II embedded processor cores, up to 250 MHz internal operation, integrated ADC blocks, and 3.3 V/1.8 V dual-configuration flash support for instant-on and remote field upgrades. The device also integrates phase-locked loops (PLLs), user I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and DDR3 memory interfaces. Together these features target glue-logic, bridge, and motor-control consolidation roles.
The 10M16DAF484 implements a TSMC 55 nm embedded flash process, which is why it ships with both flash and SRAM on the same die. The dual-supply 'DA' variant accepts a separate analog supply for the ADC subsystem, making it the family member of choice when internal sensing of board rails or thermistor voltages is required alongside logic and DSP operations.
Typical applications include industrial motor control, factory automation I/O expansion, automotive infotainment and sensor fusion pre-processing, portable medical instrumentation, and bridge/legacy interface consolidation in embedded systems. Its instant-on capability also suits safety-critical and deterministic-boot applications. Compared with SRAM-based FPGAs, the MAX 10 removes the need for a separate boot PROM, reducing BOM cost and board area.
When designing with this device, allocate sufficient PCB area for the 484-BGA FineLine BGA breakout and review the Quartus Prime pin planner for bank voltage constraints. Ensure the JTAG chain integrity for in-system programming and that the dual-supply power sequencing follows Intel's MAX 10 hardware design guide. For high-speed DDR3 interfaces, follow the matched-length and decoupling recommendations in the device handbook.
This page synthesizes Intel official product information, distributor pricing, drop-in same-package alternatives from the MAX 10 and Cyclone families, and practical design notes that are not aggregated on a single manufacturer or distributor page.
بدائل مباشرة لـ 10M16DAF484A7G — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 10M16DAF484A7G (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, PLLs, Embedded Memory, Mounting Type.
10M25DAF484A7G
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←10M16DAF484C8G
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
10M16DAF484I7G
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←10M08DAF484C8G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10CL120YF484I8G
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
10CX220YF484I5G
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
10M16DAF484A7G الحدود القصوى والخصائص الكهربائية
| Product Family | MAX 10 |
| Series | 10M16 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory (SRAM) | 320 Kbits |
| Embedded User Flash | 562,176 bits |
| العلبة | 484-BGA (FineLine BGA) |
| Supply Variant | DA (Dual-supply, with ADC) |
| Core Voltage | 1.0 V (internal regulator) |
| Configuration Mode | Internal flash, dual-image supported |
| ADC Blocks | Yes (integrated, on DA variants) |
| User I/O Banks | 8 |
| Maximum User I/O | 320 |
| PLLs | 4 |
| DSP Blocks | Yes |
| درجة حرارة التشغيل | -40C to +125C (industrial) |
| حالة RoHS | Compliant |
| نوع التركيب | Surface Mount (BGA) |
تكوين أطراف 10M16DAF484A7G
| دبوس A1 | I/O — General purpose user I/O (bank 1A) |
| دبوس A2 | I/O — General purpose user I/O (bank 1A) |
| دبوس A3 | VCCIO1A — I/O bank 1A supply voltage |
| دبوس A4 | I/O — General purpose user I/O (bank 1A) |
| دبوس A5 | GND — Ground |
| دبوس B1 | I/O — General purpose user I/O (bank 1A) |
| دبوس B2 | GND — Ground |
| دبوس B3 | I/O — General purpose user I/O (bank 1A) |
| دبوس B4 | I/O — General purpose user I/O (bank 1A) |
| دبوس B5 | VCCIO1B — I/O bank 1B supply voltage |
| دبوس C1 | VCCINT — Core voltage supply (1.0 V) |
| دبوس C2 | I/O — General purpose user I/O (bank 2A) |
| دبوس C3 | VCCIO2A — I/O bank 2A supply voltage |
| دبوس C4 | I/O — General purpose user I/O (bank 2A) |
| دبوس C5 | GND — Ground |
| دبوس D1 | GND — Ground |
| دبوس D2 | I/O — General purpose user I/O (bank 2A) |
| دبوس D3 | I/O — General purpose user I/O (bank 2A) |
| دبوس D4 | I/O — General purpose user I/O (bank 2B) |
| دبوس D5 | VCCIO2B — I/O bank 2B supply voltage |
| دبوس E1 | VCCA — Analog supply for ADC blocks |
| دبوس E2 | I/O — General purpose user I/O (bank 3A) |
| دبوس E3 | VCCIO3A — I/O bank 3A supply voltage |
| دبوس E4 | I/O — General purpose user I/O (bank 3A) |
| دبوس E5 | GND — Ground |
| دبوس F1 | GNDA — Analog ground for ADC blocks |
| دبوس F2 | I/O — General purpose user I/O (bank 3B) |
| دبوس F3 | I/O — General purpose user I/O (bank 3A) |
| دبوس F4 | I/O — General purpose user I/O (bank 3B) |
| دبوس F5 | VCCIO3B — I/O bank 3B supply voltage |
| دبوس G1 | ADC_IN — Analog-to-digital converter input channel |
| دبوس G2 | I/O — General purpose user I/O (bank 4A) |
| دبوس G3 | VCCIO4A — I/O bank 4A supply voltage |
| دبوس G4 | I/O — General purpose user I/O (bank 4A) |
| دبوس G5 | GND — Ground |
| دبوس H1 | I/O — General purpose user I/O (bank 4A) |
| دبوس H2 | I/O — General purpose user I/O (bank 4A) |
| دبوس H3 | I/O — General purpose user I/O (bank 4B) |
| دبوس H4 | I/O — General purpose user I/O (bank 4B) |
| دبوس H5 | VCCIO4B — I/O bank 4B supply voltage |
| دبوس J1 | I/O — General purpose user I/O (bank 5A) |
| دبوس J2 | VCCIO5A — I/O bank 5A supply voltage |
| دبوس J3 | I/O — General purpose user I/O (bank 5A) |
| دبوس J4 | I/O — General purpose user I/O (bank 5A) |
| دبوس J5 | GND — Ground |
| دبوس K1 | I/O — General purpose user I/O (bank 5B) |
| دبوس K2 | I/O — General purpose user I/O (bank 5A) |
| دبوس K3 | I/O — General purpose user I/O (bank 5B) |
| دبوس K4 | I/O — General purpose user I/O (bank 5B) |
| دبوس K5 | VCCIO5B — I/O bank 5B supply voltage |
| دبوس L1 | I/O — General purpose user I/O (bank 6A) |
| دبوس L2 | VCCIO6A — I/O bank 6A supply voltage |
| دبوس L3 | I/O — General purpose user I/O (bank 6A) |
| دبوس L4 | I/O — General purpose user I/O (bank 6A) |
| دبوس L5 | GND — Ground |
| دبوس M1 | GND — Ground |
| دبوس M2 | I/O — General purpose user I/O (bank 6B) |
| دبوس M3 | I/O — General purpose user I/O (bank 6B) |
| دبوس M4 | I/O — General purpose user I/O (bank 6B) |
| دبوس M5 | VCCIO6B — I/O bank 6B supply voltage |
| دبوس N1 | I/O — General purpose user I/O (bank 7A) |
| دبوس N2 | VCCIO7A — I/O bank 7A supply voltage |
| دبوس N3 | I/O — General purpose user I/O (bank 7A) |
| دبوس N4 | I/O — General purpose user I/O (bank 7A) |
| دبوس N5 | GND — Ground |
| دبوس P1 | I/O — General purpose user I/O (bank 7B) |
| دبوس P2 | I/O — General purpose user I/O (bank 7A) |
| دبوس P3 | I/O — General purpose user I/O (bank 7B) |
| دبوس P4 | I/O — General purpose user I/O (bank 7B) |
| دبوس P5 | VCCIO7B — I/O bank 7B supply voltage |
| دبوس R1 | I/O — General purpose user I/O (bank 8A) |
| دبوس R2 | VCCIO8A — I/O bank 8A supply voltage |
| دبوس R3 | I/O — General purpose user I/O (bank 8A) |
| دبوس R4 | I/O — General purpose user I/O (bank 8A) |
| دبوس R5 | GND — Ground |
| دبوس T1 | TCK — JTAG test clock |
| دبوس T2 | I/O — General purpose user I/O (bank 8B) |
| دبوس T3 | I/O — General purpose user I/O (bank 8B) |
| دبوس T4 | I/O — General purpose user I/O (bank 8B) |
| دبوس T5 | VCCIO8B — I/O bank 8B supply voltage |
| دبوس U1 | TMS — JTAG test mode select |
| دبوس U2 | TDI — JTAG test data in |
| دبوس U3 | TDO — JTAG test data out |
| دبوس U4 | nCONFIG — Configuration start (active low) |
| دبوس U5 | nSTATUS — Configuration status (active low) |
| دبوس V1 | CONF_DONE — Configuration complete indicator |
| دبوس V2 | MSEL0 — Configuration mode select bit 0 |
| دبوس V3 | MSEL1 — Configuration mode select bit 1 |
| دبوس V4 | MSEL2 — Configuration mode select bit 2 |
| دبوس V5 | GND — Ground |
| دبوس W1 | GND — Ground |
| دبوس W2 | I/O — General purpose user I/O (bank 8B) |
| دبوس W3 | I/O — General purpose user I/O (bank 8B) |
| دبوس W4 | I/O — General purpose user I/O (bank 8B) |
| دبوس W5 | I/O — General purpose user I/O (bank 8B) |
| دبوس Y1 | I/O — General purpose user I/O (bank 8B) |
| دبوس Y2 | VCCINT — Core voltage supply (1.0 V) |
| دبوس Y3 | I/O — General purpose user I/O (bank 8B) |
| دبوس Y4 | GND — Ground |
| دبوس Y5 | I/O — General purpose user I/O (bank 8B) |
التطبيقات النموذجية
10M16DAF484A7G مناسب لـ 7 التطبيقs: Industrial Motor Control, Factory Automation I/O Expansion, Automotive Infotainment Pre-processing, Portable Medical Instrumentation, Legacy Interface Bridge and Consolidation, IoT Edge Sensor Hub, Industrial Control Panel HMI.
Industrial Motor Control
The 10M16DAF484A7G is ideal for industrial motor control due to its integrated ADC blocks (for current and voltage sensing), DSP blocks (for field-oriented control math), and 320 user I/Os (for multi-axis PWM and encoder interfaces). The 16,000 logic elements can implement FOC algorithms for multiple motor axes simultaneously. The dual-supply design separates analog and digital domains, reducing switching noise coupling into sensitive current measurements. Compared with discrete MCU+DSP solutions, the MAX 10 consolidates logic, sensing, and PWM generation in a single non-volatile device, reducing BOM cost and PCB area.
موصى به
Factory Automation I/O Expansion
The 10M16DAF484A7G serves as an I/O expander and protocol bridge in factory automation, translating between industrial fieldbuses (EtherCAT, PROFINET, Modbus) and legacy sensor/actuator interfaces. With 320 user I/Os across 8 banks, it can aggregate multiple sensor clusters into a single FPGA fabric. The non-volatile flash enables instant-on behavior required for deterministic PLC boot. The integrated ADC blocks provide analog sensor conditioning without external ADC chips, reducing component count and BOM cost in distributed I/O modules.
موصى به
Automotive Infotainment Pre-processing
The 10M16DAF484A7G handles video pipeline pre-processing, audio mixing, and display interface bridging in automotive infotainment head units. Its 320 user I/Os support multiple LVDS display channels, MIPI-CSI camera inputs (via soft IP), and I2S audio interfaces. The 562 Kbits of embedded user flash stores configuration for multiple car model variants, enabling one PCB design across product lines. The industrial temperature range (-40C to +100C) suits automotive cabin environments, though for under-hood applications a Q100-qualified part should be selected.
موصى به
Portable Medical Instrumentation
The 10M16DAF484A7G is well-suited for portable medical devices such as patient monitors, pulse oximeters, and handheld ultrasound probes. The integrated ADC blocks digitize bioelectric signals (ECG, EMG) directly, eliminating external ADC components. The non-volatile instant-on capability reduces patient wait time at power-up. The low-power MAX 10 architecture (internal 1.0 V regulator) extends battery life in portable form factors. Per Intel's healthcare reference designs, MAX 10 devices are used in FDA Class II devices for signal conditioning and display driving.
موصى به
Legacy Interface Bridge and Consolidation
The 10M16DAF484A7G functions as a multi-protocol bridge, converting between legacy parallel buses (ISA, SRAM, FIFO), modern serial interfaces (I2C, SPI, UART), and high-speed LVDS links. With 16,000 logic elements, it can implement multiple protocol converters simultaneously, replacing several discrete bridge chips with a single programmable device. The dual-configuration flash enables safe field upgrades with rollback capability, critical for deployed systems where firmware corruption is unacceptable. This makes the MAX 10 ideal for industrial controller modernization and military/aerospace system refresh programs.
موصى به
IoT Edge Sensor Hub
The 10M16DAF484A7G serves as an edge sensor aggregation hub in IoT deployments, consolidating multiple sensor interfaces (I2C temperature, SPI accelerometers, analog load cells) into a single pre-processing node before forwarding to a gateway. The integrated ADC blocks digitize analog sensors directly, while the 16K logic elements implement edge analytics (threshold detection, simple ML inference). The 562 Kbits of embedded flash stores device firmware and configuration, supporting OTA updates via the dual-image architecture. Low active power (under 1 W typical) suits battery-powered remote sensor deployments.
موصى به
Industrial Control Panel HMI
The 10M16DAF484A7G drives industrial HMI displays, handling TFT-LCD timing generation, touch screen scanning, and keypad matrix decoding in a single device. With 320 user I/Os, it can interface with multiple display sizes and support capacitive touch controllers via I2C/SPI. The DSP blocks accelerate graphics rendering primitives (line draw, bitmap blit) for simple GUIs without requiring an external graphics controller. The non-volatile flash stores GUI assets and multiple language configurations, enabling one hardware platform across global product variants.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 10M16DAF484A7G — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 10M25DAF484A7G | 10M16DAF484C8G | 10M16DAF484I7G | 10M08DAF484C8G | 10CL120YF484I8G | 10CX220YF484I5G |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same |
| Logic Elements | 16,000 | 25,000 (+56%) | 16,000 (same) | 16,000 (same) | 8,000 (-50%) | 120,000 (+650%) | 220,000 (+1275%) |
| Embedded Flash | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | None (external boot PROM required) | None (external boot PROM required) |
| ADC Blocks | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | No | No |
| Supply Variant | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Single-supply | Single-supply |
| User I/O | 320 | 320 (same) | 320 (same) | 320 (same) | 250 (-22%) | 320 (same) | 188 (-41%) |
| Speed Grade | 7 (industrial) | 7 (industrial) | 8 (faster) | 7 (industrial) | 8 (faster) | 8 (faster) | 5 (slower) |
| Configuration Type | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | SRAM-based (volatile) | SRAM-based (volatile) |
أبرز الفروقات
- Largest MAX 10 DA with internal flash + ADC in F484 BGA (مقابل10M08DAF484C8G)
- Internal non-volatile flash eliminates external boot PROM (مقابل10CL120YF484I8G)
- Dual-supply (DA) variant with integrated ADC for sensor applications (مقابل10CX220YF484I5G)
ملاحظات التصميم
The 484-BGA FineLine BGA package requires via-in-pad PCB technology for reliable breakout routing. Per Intel's MAX 10 hardware design guide, use 0.4 mm ball pitch with microvia stacks (laser-drilled 0.1 mm vias). Place decoupling capacitors within 2 mm of each power pin pair, with 0.1 uF ceramic on every VCCIO bank and bulk 10 uF tantalum or ceramic on VCCINT. Ground planes should be uninterrupted beneath the BGA footprint to provide return path and thermal dissipation.
The 484-BGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15 C/W with 4-layer JEDEC test board, meaning at 1 W dissipation the junction rises 15 C above ambient. For industrial temperature grade operation up to 100 C ambient, maximum dissipation is limited to about 5 W. Reduce internal toggle rate or use clock gating to manage self-heating. For higher-power applications, consider the larger 256-pin BGA with better thermal spreading or add a heatsink with thermal interface material.
Do not confuse the DA (dual-supply) variant with the SA (single-supply) variant when ordering - they share the same F484 footprint but the analog ADC pins differ in functionality. When migrating from a Cyclone IV design, verify that the MAX 10's internal flash provides equivalent boot behavior, as MAX 10 instant-on differs from Cyclone IV SRAM-based configuration. Always check Quartus Prime pin assignments for bank voltage compatibility before PCB fabrication, as 3.3 V LVCMOS inputs on a 2.5 V bank can damage the I/O cells.
معلومات الامتثال
RoHS compliant and lead-free per Intel product declaration. Not AEC-Q100 qualified; for automotive applications requiring Q100, contact Intel for MAX 10 automotive-grade variants.