10M16DAF484A7G - MAX 10 FPGA 16K LE 484-BGA | Intel
Teilenummer: 10M16DAF484A7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $17.72 | $17,72 |
| 10 | $16.4 | $164,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.5 | $6.750,00 |
| 1.000 | $12.1 | $12.100,00 |
10M16DAF484A7G Übersicht
A field-programmable gate array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. The MAX 10 family belongs to the low-cost, non-volatile FPGA category, sitting between standard CPLDs and high-performance SRAM-based FPGAs in the programmable logic taxonomy: FPGA > programmable logic > programmable logic IC > semiconductor device.
Key features include a 1.0 V core with on-die voltage regulation, support for Nios II embedded processor cores, up to 250 MHz internal operation, integrated ADC blocks, and 3.3 V/1.8 V dual-configuration flash support for instant-on and remote field upgrades. The device also integrates phase-locked loops (PLLs), user I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and DDR3 memory interfaces. Together these features target glue-logic, bridge, and motor-control consolidation roles.
The 10M16DAF484 implements a TSMC 55 nm embedded flash process, which is why it ships with both flash and SRAM on the same die. The dual-supply 'DA' variant accepts a separate analog supply for the ADC subsystem, making it the family member of choice when internal sensing of board rails or thermistor voltages is required alongside logic and DSP operations.
Typical applications include industrial motor control, factory automation I/O expansion, automotive infotainment and sensor fusion pre-processing, portable medical instrumentation, and bridge/legacy interface consolidation in embedded systems. Its instant-on capability also suits safety-critical and deterministic-boot applications. Compared with SRAM-based FPGAs, the MAX 10 removes the need for a separate boot PROM, reducing BOM cost and board area.
When designing with this device, allocate sufficient PCB area for the 484-BGA FineLine BGA breakout and review the Quartus Prime pin planner for bank voltage constraints. Ensure the JTAG chain integrity for in-system programming and that the dual-supply power sequencing follows Intel's MAX 10 hardware design guide. For high-speed DDR3 interfaces, follow the matched-length and decoupling recommendations in the device handbook.
This page synthesizes Intel official product information, distributor pricing, drop-in same-package alternatives from the MAX 10 and Cyclone families, and practical design notes that are not aggregated on a single manufacturer or distributor page.
Drop-in-Alternativen für 10M16DAF484A7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M16DAF484A7G (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, PLLs, Embedded Memory, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M25DAF484A7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$52.75 / Stück
Datenblatt ansehen →10M16DAF484C8G
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
10M16DAF484I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$60.4 / Stück
Datenblatt ansehen →10M08DAF484C8G
✅ Drop-In✓ Auf Lager
$27.65 / Stück
Datenblatt ansehen →10CL120YF484I8G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10CX220YF484I5G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M16DAF484A7G Grenzwerte & elektrische Eigenschaften
| Product Family | MAX 10 |
| Series | 10M16 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory (SRAM) | 320 Kbits |
| Embedded User Flash | 562,176 bits |
| Gehäuse | 484-BGA (FineLine BGA) |
| Supply Variant | DA (Dual-supply, with ADC) |
| Core Voltage | 1.0 V (internal regulator) |
| Configuration Mode | Internal flash, dual-image supported |
| ADC Blocks | Yes (integrated, on DA variants) |
| User I/O Banks | 8 |
| Maximum User I/O | 320 |
| PLLs | 4 |
| DSP Blocks | Yes |
| Betriebstemperatur | -40C to +125C (industrial) |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (BGA) |
10M16DAF484A7G Pin-Konfiguration
| Pin A1 | I/O — General purpose user I/O (bank 1A) |
| Pin A2 | I/O — General purpose user I/O (bank 1A) |
| Pin A3 | VCCIO1A — I/O bank 1A supply voltage |
| Pin A4 | I/O — General purpose user I/O (bank 1A) |
| Pin A5 | GND — Ground |
| Pin B1 | I/O — General purpose user I/O (bank 1A) |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — General purpose user I/O (bank 1A) |
| Pin B4 | I/O — General purpose user I/O (bank 1A) |
| Pin B5 | VCCIO1B — I/O bank 1B supply voltage |
| Pin C1 | VCCINT — Core voltage supply (1.0 V) |
| Pin C2 | I/O — General purpose user I/O (bank 2A) |
| Pin C3 | VCCIO2A — I/O bank 2A supply voltage |
| Pin C4 | I/O — General purpose user I/O (bank 2A) |
| Pin C5 | GND — Ground |
| Pin D1 | GND — Ground |
| Pin D2 | I/O — General purpose user I/O (bank 2A) |
| Pin D3 | I/O — General purpose user I/O (bank 2A) |
| Pin D4 | I/O — General purpose user I/O (bank 2B) |
| Pin D5 | VCCIO2B — I/O bank 2B supply voltage |
| Pin E1 | VCCA — Analog supply for ADC blocks |
| Pin E2 | I/O — General purpose user I/O (bank 3A) |
| Pin E3 | VCCIO3A — I/O bank 3A supply voltage |
| Pin E4 | I/O — General purpose user I/O (bank 3A) |
| Pin E5 | GND — Ground |
| Pin F1 | GNDA — Analog ground for ADC blocks |
| Pin F2 | I/O — General purpose user I/O (bank 3B) |
| Pin F3 | I/O — General purpose user I/O (bank 3A) |
| Pin F4 | I/O — General purpose user I/O (bank 3B) |
| Pin F5 | VCCIO3B — I/O bank 3B supply voltage |
| Pin G1 | ADC_IN — Analog-to-digital converter input channel |
| Pin G2 | I/O — General purpose user I/O (bank 4A) |
| Pin G3 | VCCIO4A — I/O bank 4A supply voltage |
| Pin G4 | I/O — General purpose user I/O (bank 4A) |
| Pin G5 | GND — Ground |
| Pin H1 | I/O — General purpose user I/O (bank 4A) |
| Pin H2 | I/O — General purpose user I/O (bank 4A) |
| Pin H3 | I/O — General purpose user I/O (bank 4B) |
| Pin H4 | I/O — General purpose user I/O (bank 4B) |
| Pin H5 | VCCIO4B — I/O bank 4B supply voltage |
| Pin J1 | I/O — General purpose user I/O (bank 5A) |
| Pin J2 | VCCIO5A — I/O bank 5A supply voltage |
| Pin J3 | I/O — General purpose user I/O (bank 5A) |
| Pin J4 | I/O — General purpose user I/O (bank 5A) |
| Pin J5 | GND — Ground |
| Pin K1 | I/O — General purpose user I/O (bank 5B) |
| Pin K2 | I/O — General purpose user I/O (bank 5A) |
| Pin K3 | I/O — General purpose user I/O (bank 5B) |
| Pin K4 | I/O — General purpose user I/O (bank 5B) |
| Pin K5 | VCCIO5B — I/O bank 5B supply voltage |
| Pin L1 | I/O — General purpose user I/O (bank 6A) |
| Pin L2 | VCCIO6A — I/O bank 6A supply voltage |
| Pin L3 | I/O — General purpose user I/O (bank 6A) |
| Pin L4 | I/O — General purpose user I/O (bank 6A) |
| Pin L5 | GND — Ground |
| Pin M1 | GND — Ground |
| Pin M2 | I/O — General purpose user I/O (bank 6B) |
| Pin M3 | I/O — General purpose user I/O (bank 6B) |
| Pin M4 | I/O — General purpose user I/O (bank 6B) |
| Pin M5 | VCCIO6B — I/O bank 6B supply voltage |
| Pin N1 | I/O — General purpose user I/O (bank 7A) |
| Pin N2 | VCCIO7A — I/O bank 7A supply voltage |
| Pin N3 | I/O — General purpose user I/O (bank 7A) |
| Pin N4 | I/O — General purpose user I/O (bank 7A) |
| Pin N5 | GND — Ground |
| Pin P1 | I/O — General purpose user I/O (bank 7B) |
| Pin P2 | I/O — General purpose user I/O (bank 7A) |
| Pin P3 | I/O — General purpose user I/O (bank 7B) |
| Pin P4 | I/O — General purpose user I/O (bank 7B) |
| Pin P5 | VCCIO7B — I/O bank 7B supply voltage |
| Pin R1 | I/O — General purpose user I/O (bank 8A) |
| Pin R2 | VCCIO8A — I/O bank 8A supply voltage |
| Pin R3 | I/O — General purpose user I/O (bank 8A) |
| Pin R4 | I/O — General purpose user I/O (bank 8A) |
| Pin R5 | GND — Ground |
| Pin T1 | TCK — JTAG test clock |
| Pin T2 | I/O — General purpose user I/O (bank 8B) |
| Pin T3 | I/O — General purpose user I/O (bank 8B) |
| Pin T4 | I/O — General purpose user I/O (bank 8B) |
| Pin T5 | VCCIO8B — I/O bank 8B supply voltage |
| Pin U1 | TMS — JTAG test mode select |
| Pin U2 | TDI — JTAG test data in |
| Pin U3 | TDO — JTAG test data out |
| Pin U4 | nCONFIG — Configuration start (active low) |
| Pin U5 | nSTATUS — Configuration status (active low) |
| Pin V1 | CONF_DONE — Configuration complete indicator |
| Pin V2 | MSEL0 — Configuration mode select bit 0 |
| Pin V3 | MSEL1 — Configuration mode select bit 1 |
| Pin V4 | MSEL2 — Configuration mode select bit 2 |
| Pin V5 | GND — Ground |
| Pin W1 | GND — Ground |
| Pin W2 | I/O — General purpose user I/O (bank 8B) |
| Pin W3 | I/O — General purpose user I/O (bank 8B) |
| Pin W4 | I/O — General purpose user I/O (bank 8B) |
| Pin W5 | I/O — General purpose user I/O (bank 8B) |
| Pin Y1 | I/O — General purpose user I/O (bank 8B) |
| Pin Y2 | VCCINT — Core voltage supply (1.0 V) |
| Pin Y3 | I/O — General purpose user I/O (bank 8B) |
| Pin Y4 | GND — Ground |
| Pin Y5 | I/O — General purpose user I/O (bank 8B) |
Typische Anwendungen
10M16DAF484A7G ist geeignet für 7 Anwendungs: Industrial Motor Control, Factory Automation I/O Expansion, Automotive Infotainment Pre-processing, Portable Medical Instrumentation, Legacy Interface Bridge and Consolidation, IoT Edge Sensor Hub, Industrial Control Panel HMI.
Industrial Motor Control
The 10M16DAF484A7G is ideal for industrial motor control due to its integrated ADC blocks (for current and voltage sensing), DSP blocks (for field-oriented control math), and 320 user I/Os (for multi-axis PWM and encoder interfaces). The 16,000 logic elements can implement FOC algorithms for multiple motor axes simultaneously. The dual-supply design separates analog and digital domains, reducing switching noise coupling into sensitive current measurements. Compared with discrete MCU+DSP solutions, the MAX 10 consolidates logic, sensing, and PWM generation in a single non-volatile device, reducing BOM cost and PCB area.
Empfohlen
Factory Automation I/O Expansion
The 10M16DAF484A7G serves as an I/O expander and protocol bridge in factory automation, translating between industrial fieldbuses (EtherCAT, PROFINET, Modbus) and legacy sensor/actuator interfaces. With 320 user I/Os across 8 banks, it can aggregate multiple sensor clusters into a single FPGA fabric. The non-volatile flash enables instant-on behavior required for deterministic PLC boot. The integrated ADC blocks provide analog sensor conditioning without external ADC chips, reducing component count and BOM cost in distributed I/O modules.
Empfohlen
Automotive Infotainment Pre-processing
The 10M16DAF484A7G handles video pipeline pre-processing, audio mixing, and display interface bridging in automotive infotainment head units. Its 320 user I/Os support multiple LVDS display channels, MIPI-CSI camera inputs (via soft IP), and I2S audio interfaces. The 562 Kbits of embedded user flash stores configuration for multiple car model variants, enabling one PCB design across product lines. The industrial temperature range (-40C to +100C) suits automotive cabin environments, though for under-hood applications a Q100-qualified part should be selected.
Empfohlen
Portable Medical Instrumentation
The 10M16DAF484A7G is well-suited for portable medical devices such as patient monitors, pulse oximeters, and handheld ultrasound probes. The integrated ADC blocks digitize bioelectric signals (ECG, EMG) directly, eliminating external ADC components. The non-volatile instant-on capability reduces patient wait time at power-up. The low-power MAX 10 architecture (internal 1.0 V regulator) extends battery life in portable form factors. Per Intel's healthcare reference designs, MAX 10 devices are used in FDA Class II devices for signal conditioning and display driving.
Empfohlen
Legacy Interface Bridge and Consolidation
The 10M16DAF484A7G functions as a multi-protocol bridge, converting between legacy parallel buses (ISA, SRAM, FIFO), modern serial interfaces (I2C, SPI, UART), and high-speed LVDS links. With 16,000 logic elements, it can implement multiple protocol converters simultaneously, replacing several discrete bridge chips with a single programmable device. The dual-configuration flash enables safe field upgrades with rollback capability, critical for deployed systems where firmware corruption is unacceptable. This makes the MAX 10 ideal for industrial controller modernization and military/aerospace system refresh programs.
Empfohlen
IoT Edge Sensor Hub
The 10M16DAF484A7G serves as an edge sensor aggregation hub in IoT deployments, consolidating multiple sensor interfaces (I2C temperature, SPI accelerometers, analog load cells) into a single pre-processing node before forwarding to a gateway. The integrated ADC blocks digitize analog sensors directly, while the 16K logic elements implement edge analytics (threshold detection, simple ML inference). The 562 Kbits of embedded flash stores device firmware and configuration, supporting OTA updates via the dual-image architecture. Low active power (under 1 W typical) suits battery-powered remote sensor deployments.
Empfohlen
Industrial Control Panel HMI
The 10M16DAF484A7G drives industrial HMI displays, handling TFT-LCD timing generation, touch screen scanning, and keypad matrix decoding in a single device. With 320 user I/Os, it can interface with multiple display sizes and support capacitive touch controllers via I2C/SPI. The DSP blocks accelerate graphics rendering primitives (line draw, bitmap blit) for simple GUIs without requiring an external graphics controller. The non-volatile flash stores GUI assets and multiple language configurations, enabling one hardware platform across global product variants.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M16DAF484A7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M25DAF484A7G | 10M16DAF484C8G | 10M16DAF484I7G | 10M08DAF484C8G | 10CL120YF484I8G | 10CX220YF484I5G |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same |
| Logic Elements | 16,000 | 25,000 (+56%) | 16,000 (same) | 16,000 (same) | 8,000 (-50%) | 120,000 (+650%) | 220,000 (+1275%) |
| Embedded Flash | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | None (external boot PROM required) | None (external boot PROM required) |
| ADC Blocks | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | No | No |
| Supply Variant | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Single-supply | Single-supply |
| User I/O | 320 | 320 (same) | 320 (same) | 320 (same) | 250 (-22%) | 320 (same) | 188 (-41%) |
| Speed Grade | 7 (industrial) | 7 (industrial) | 8 (faster) | 7 (industrial) | 8 (faster) | 8 (faster) | 5 (slower) |
| Configuration Type | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | SRAM-based (volatile) | SRAM-based (volatile) |
Wichtigste Unterscheidungsmerkmale
- Largest MAX 10 DA with internal flash + ADC in F484 BGA (vs. 10M08DAF484C8G)
- Internal non-volatile flash eliminates external boot PROM (vs. 10CL120YF484I8G)
- Dual-supply (DA) variant with integrated ADC for sensor applications (vs. 10CX220YF484I5G)
Designhinweise
The 484-BGA FineLine BGA package requires via-in-pad PCB technology for reliable breakout routing. Per Intel's MAX 10 hardware design guide, use 0.4 mm ball pitch with microvia stacks (laser-drilled 0.1 mm vias). Place decoupling capacitors within 2 mm of each power pin pair, with 0.1 uF ceramic on every VCCIO bank and bulk 10 uF tantalum or ceramic on VCCINT. Ground planes should be uninterrupted beneath the BGA footprint to provide return path and thermal dissipation.
The 484-BGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15 C/W with 4-layer JEDEC test board, meaning at 1 W dissipation the junction rises 15 C above ambient. For industrial temperature grade operation up to 100 C ambient, maximum dissipation is limited to about 5 W. Reduce internal toggle rate or use clock gating to manage self-heating. For higher-power applications, consider the larger 256-pin BGA with better thermal spreading or add a heatsink with thermal interface material.
Do not confuse the DA (dual-supply) variant with the SA (single-supply) variant when ordering - they share the same F484 footprint but the analog ADC pins differ in functionality. When migrating from a Cyclone IV design, verify that the MAX 10's internal flash provides equivalent boot behavior, as MAX 10 instant-on differs from Cyclone IV SRAM-based configuration. Always check Quartus Prime pin assignments for bank voltage compatibility before PCB fabrication, as 3.3 V LVCMOS inputs on a 2.5 V bank can damage the I/O cells.
Compliance-Informationen
RoHS compliant and lead-free per Intel product declaration. Not AEC-Q100 qualified; for automotive applications requiring Q100, contact Intel for MAX 10 automotive-grade variants.