10M16DAF484A7G - MAX 10 FPGA 16K LE 484-BGA | Intel
MPN: 10M16DAF484A7G ✓ פעיל10M16DAF484A7G סקירה
A field-programmable gate array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. The MAX 10 family belongs to the low-cost, non-volatile FPGA category, sitting between standard CPLDs and high-performance SRAM-based FPGAs in the programmable logic taxonomy: FPGA > programmable logic > programmable logic IC > semiconductor device.
Key features include a 1.0 V core with on-die voltage regulation, support for Nios II embedded processor cores, up to 250 MHz internal operation, integrated ADC blocks, and 3.3 V/1.8 V dual-configuration flash support for instant-on and remote field upgrades. The device also integrates phase-locked loops (PLLs), user I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and DDR3 memory interfaces. Together these features target glue-logic, bridge, and motor-control consolidation roles.
The 10M16DAF484 implements a TSMC 55 nm embedded flash process, which is why it ships with both flash and SRAM on the same die. The dual-supply 'DA' variant accepts a separate analog supply for the ADC subsystem, making it the family member of choice when internal sensing of board rails or thermistor voltages is required alongside logic and DSP operations.
Typical applications include industrial motor control, factory automation I/O expansion, automotive infotainment and sensor fusion pre-processing, portable medical instrumentation, and bridge/legacy interface consolidation in embedded systems. Its instant-on capability also suits safety-critical and deterministic-boot applications. Compared with SRAM-based FPGAs, the MAX 10 removes the need for a separate boot PROM, reducing BOM cost and board area.
When designing with this device, allocate sufficient PCB area for the 484-BGA FineLine BGA breakout and review the Quartus Prime pin planner for bank voltage constraints. Ensure the JTAG chain integrity for in-system programming and that the dual-supply power sequencing follows Intel's MAX 10 hardware design guide. For high-speed DDR3 interfaces, follow the matched-length and decoupling recommendations in the device handbook.
This page synthesizes Intel official product information, distributor pricing, drop-in same-package alternatives from the MAX 10 and Cyclone families, and practical design notes that are not aggregated on a single manufacturer or distributor page.
חלופות תחליף ישיר עבור 10M16DAF484A7G — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם 10M16DAF484A7G (אותו גורם צורה וטביעת רגל) — שונים ב Package, Operating Temperature, PLLs, Embedded Memory, Mounting Type.
10M25DAF484A7G
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←10M16DAF484C8G
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
10M16DAF484I7G
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←10M08DAF484C8G
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←10CL120YF484I8G
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
10CX220YF484I5G
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
10M16DAF484A7G דירוגים מרביים ומאפיינים חשמליים
| Product Family | MAX 10 |
| Series | 10M16 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory (SRAM) | 320 Kbits |
| Embedded User Flash | 562,176 bits |
| מארז | 484-BGA (FineLine BGA) |
| Supply Variant | DA (Dual-supply, with ADC) |
| Core Voltage | 1.0 V (internal regulator) |
| Configuration Mode | Internal flash, dual-image supported |
| ADC Blocks | Yes (integrated, on DA variants) |
| User I/O Banks | 8 |
| Maximum User I/O | 320 |
| PLLs | 4 |
| DSP Blocks | Yes |
| טמפרטורת פעולה | -40C to +125C (industrial) |
| סטטוס RoHS | Compliant |
| סוג הרכבה | Surface Mount (BGA) |
תצורת פינים של 10M16DAF484A7G
| פין A1 | I/O — General purpose user I/O (bank 1A) |
| פין A2 | I/O — General purpose user I/O (bank 1A) |
| פין A3 | VCCIO1A — I/O bank 1A supply voltage |
| פין A4 | I/O — General purpose user I/O (bank 1A) |
| פין A5 | GND — Ground |
| פין B1 | I/O — General purpose user I/O (bank 1A) |
| פין B2 | GND — Ground |
| פין B3 | I/O — General purpose user I/O (bank 1A) |
| פין B4 | I/O — General purpose user I/O (bank 1A) |
| פין B5 | VCCIO1B — I/O bank 1B supply voltage |
| פין C1 | VCCINT — Core voltage supply (1.0 V) |
| פין C2 | I/O — General purpose user I/O (bank 2A) |
| פין C3 | VCCIO2A — I/O bank 2A supply voltage |
| פין C4 | I/O — General purpose user I/O (bank 2A) |
| פין C5 | GND — Ground |
| פין D1 | GND — Ground |
| פין D2 | I/O — General purpose user I/O (bank 2A) |
| פין D3 | I/O — General purpose user I/O (bank 2A) |
| פין D4 | I/O — General purpose user I/O (bank 2B) |
| פין D5 | VCCIO2B — I/O bank 2B supply voltage |
| פין E1 | VCCA — Analog supply for ADC blocks |
| פין E2 | I/O — General purpose user I/O (bank 3A) |
| פין E3 | VCCIO3A — I/O bank 3A supply voltage |
| פין E4 | I/O — General purpose user I/O (bank 3A) |
| פין E5 | GND — Ground |
| פין F1 | GNDA — Analog ground for ADC blocks |
| פין F2 | I/O — General purpose user I/O (bank 3B) |
| פין F3 | I/O — General purpose user I/O (bank 3A) |
| פין F4 | I/O — General purpose user I/O (bank 3B) |
| פין F5 | VCCIO3B — I/O bank 3B supply voltage |
| פין G1 | ADC_IN — Analog-to-digital converter input channel |
| פין G2 | I/O — General purpose user I/O (bank 4A) |
| פין G3 | VCCIO4A — I/O bank 4A supply voltage |
| פין G4 | I/O — General purpose user I/O (bank 4A) |
| פין G5 | GND — Ground |
| פין H1 | I/O — General purpose user I/O (bank 4A) |
| פין H2 | I/O — General purpose user I/O (bank 4A) |
| פין H3 | I/O — General purpose user I/O (bank 4B) |
| פין H4 | I/O — General purpose user I/O (bank 4B) |
| פין H5 | VCCIO4B — I/O bank 4B supply voltage |
| פין J1 | I/O — General purpose user I/O (bank 5A) |
| פין J2 | VCCIO5A — I/O bank 5A supply voltage |
| פין J3 | I/O — General purpose user I/O (bank 5A) |
| פין J4 | I/O — General purpose user I/O (bank 5A) |
| פין J5 | GND — Ground |
| פין K1 | I/O — General purpose user I/O (bank 5B) |
| פין K2 | I/O — General purpose user I/O (bank 5A) |
| פין K3 | I/O — General purpose user I/O (bank 5B) |
| פין K4 | I/O — General purpose user I/O (bank 5B) |
| פין K5 | VCCIO5B — I/O bank 5B supply voltage |
| פין L1 | I/O — General purpose user I/O (bank 6A) |
| פין L2 | VCCIO6A — I/O bank 6A supply voltage |
| פין L3 | I/O — General purpose user I/O (bank 6A) |
| פין L4 | I/O — General purpose user I/O (bank 6A) |
| פין L5 | GND — Ground |
| פין M1 | GND — Ground |
| פין M2 | I/O — General purpose user I/O (bank 6B) |
| פין M3 | I/O — General purpose user I/O (bank 6B) |
| פין M4 | I/O — General purpose user I/O (bank 6B) |
| פין M5 | VCCIO6B — I/O bank 6B supply voltage |
| פין N1 | I/O — General purpose user I/O (bank 7A) |
| פין N2 | VCCIO7A — I/O bank 7A supply voltage |
| פין N3 | I/O — General purpose user I/O (bank 7A) |
| פין N4 | I/O — General purpose user I/O (bank 7A) |
| פין N5 | GND — Ground |
| פין P1 | I/O — General purpose user I/O (bank 7B) |
| פין P2 | I/O — General purpose user I/O (bank 7A) |
| פין P3 | I/O — General purpose user I/O (bank 7B) |
| פין P4 | I/O — General purpose user I/O (bank 7B) |
| פין P5 | VCCIO7B — I/O bank 7B supply voltage |
| פין R1 | I/O — General purpose user I/O (bank 8A) |
| פין R2 | VCCIO8A — I/O bank 8A supply voltage |
| פין R3 | I/O — General purpose user I/O (bank 8A) |
| פין R4 | I/O — General purpose user I/O (bank 8A) |
| פין R5 | GND — Ground |
| פין T1 | TCK — JTAG test clock |
| פין T2 | I/O — General purpose user I/O (bank 8B) |
| פין T3 | I/O — General purpose user I/O (bank 8B) |
| פין T4 | I/O — General purpose user I/O (bank 8B) |
| פין T5 | VCCIO8B — I/O bank 8B supply voltage |
| פין U1 | TMS — JTAG test mode select |
| פין U2 | TDI — JTAG test data in |
| פין U3 | TDO — JTAG test data out |
| פין U4 | nCONFIG — Configuration start (active low) |
| פין U5 | nSTATUS — Configuration status (active low) |
| פין V1 | CONF_DONE — Configuration complete indicator |
| פין V2 | MSEL0 — Configuration mode select bit 0 |
| פין V3 | MSEL1 — Configuration mode select bit 1 |
| פין V4 | MSEL2 — Configuration mode select bit 2 |
| פין V5 | GND — Ground |
| פין W1 | GND — Ground |
| פין W2 | I/O — General purpose user I/O (bank 8B) |
| פין W3 | I/O — General purpose user I/O (bank 8B) |
| פין W4 | I/O — General purpose user I/O (bank 8B) |
| פין W5 | I/O — General purpose user I/O (bank 8B) |
| פין Y1 | I/O — General purpose user I/O (bank 8B) |
| פין Y2 | VCCINT — Core voltage supply (1.0 V) |
| פין Y3 | I/O — General purpose user I/O (bank 8B) |
| פין Y4 | GND — Ground |
| פין Y5 | I/O — General purpose user I/O (bank 8B) |
יישומים טיפוסיים
10M16DAF484A7G מתאים עבור 7 יישוםs: Industrial Motor Control, Factory Automation I/O Expansion, Automotive Infotainment Pre-processing, Portable Medical Instrumentation, Legacy Interface Bridge and Consolidation, IoT Edge Sensor Hub, Industrial Control Panel HMI.
Industrial Motor Control
The 10M16DAF484A7G is ideal for industrial motor control due to its integrated ADC blocks (for current and voltage sensing), DSP blocks (for field-oriented control math), and 320 user I/Os (for multi-axis PWM and encoder interfaces). The 16,000 logic elements can implement FOC algorithms for multiple motor axes simultaneously. The dual-supply design separates analog and digital domains, reducing switching noise coupling into sensitive current measurements. Compared with discrete MCU+DSP solutions, the MAX 10 consolidates logic, sensing, and PWM generation in a single non-volatile device, reducing BOM cost and PCB area.
מומלץ
Factory Automation I/O Expansion
The 10M16DAF484A7G serves as an I/O expander and protocol bridge in factory automation, translating between industrial fieldbuses (EtherCAT, PROFINET, Modbus) and legacy sensor/actuator interfaces. With 320 user I/Os across 8 banks, it can aggregate multiple sensor clusters into a single FPGA fabric. The non-volatile flash enables instant-on behavior required for deterministic PLC boot. The integrated ADC blocks provide analog sensor conditioning without external ADC chips, reducing component count and BOM cost in distributed I/O modules.
מומלץ
Automotive Infotainment Pre-processing
The 10M16DAF484A7G handles video pipeline pre-processing, audio mixing, and display interface bridging in automotive infotainment head units. Its 320 user I/Os support multiple LVDS display channels, MIPI-CSI camera inputs (via soft IP), and I2S audio interfaces. The 562 Kbits of embedded user flash stores configuration for multiple car model variants, enabling one PCB design across product lines. The industrial temperature range (-40C to +100C) suits automotive cabin environments, though for under-hood applications a Q100-qualified part should be selected.
מומלץ
Portable Medical Instrumentation
The 10M16DAF484A7G is well-suited for portable medical devices such as patient monitors, pulse oximeters, and handheld ultrasound probes. The integrated ADC blocks digitize bioelectric signals (ECG, EMG) directly, eliminating external ADC components. The non-volatile instant-on capability reduces patient wait time at power-up. The low-power MAX 10 architecture (internal 1.0 V regulator) extends battery life in portable form factors. Per Intel's healthcare reference designs, MAX 10 devices are used in FDA Class II devices for signal conditioning and display driving.
מומלץ
Legacy Interface Bridge and Consolidation
The 10M16DAF484A7G functions as a multi-protocol bridge, converting between legacy parallel buses (ISA, SRAM, FIFO), modern serial interfaces (I2C, SPI, UART), and high-speed LVDS links. With 16,000 logic elements, it can implement multiple protocol converters simultaneously, replacing several discrete bridge chips with a single programmable device. The dual-configuration flash enables safe field upgrades with rollback capability, critical for deployed systems where firmware corruption is unacceptable. This makes the MAX 10 ideal for industrial controller modernization and military/aerospace system refresh programs.
מומלץ
IoT Edge Sensor Hub
The 10M16DAF484A7G serves as an edge sensor aggregation hub in IoT deployments, consolidating multiple sensor interfaces (I2C temperature, SPI accelerometers, analog load cells) into a single pre-processing node before forwarding to a gateway. The integrated ADC blocks digitize analog sensors directly, while the 16K logic elements implement edge analytics (threshold detection, simple ML inference). The 562 Kbits of embedded flash stores device firmware and configuration, supporting OTA updates via the dual-image architecture. Low active power (under 1 W typical) suits battery-powered remote sensor deployments.
מומלץ
Industrial Control Panel HMI
The 10M16DAF484A7G drives industrial HMI displays, handling TFT-LCD timing generation, touch screen scanning, and keypad matrix decoding in a single device. With 320 user I/Os, it can interface with multiple display sizes and support capacitive touch controllers via I2C/SPI. The DSP blocks accelerate graphics rendering primitives (line draw, bitmap blit) for simple GUIs without requiring an external graphics controller. The non-volatile flash stores GUI assets and multiple language configurations, enabling one hardware platform across global product variants.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור 10M16DAF484A7G — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | 10M25DAF484A7G | 10M16DAF484C8G | 10M16DAF484I7G | 10M08DAF484C8G | 10CL120YF484I8G | 10CX220YF484I5G |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same |
| Logic Elements | 16,000 | 25,000 (+56%) | 16,000 (same) | 16,000 (same) | 8,000 (-50%) | 120,000 (+650%) | 220,000 (+1275%) |
| Embedded Flash | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | None (external boot PROM required) | None (external boot PROM required) |
| ADC Blocks | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | No | No |
| Supply Variant | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Single-supply | Single-supply |
| User I/O | 320 | 320 (same) | 320 (same) | 320 (same) | 250 (-22%) | 320 (same) | 188 (-41%) |
| Speed Grade | 7 (industrial) | 7 (industrial) | 8 (faster) | 7 (industrial) | 8 (faster) | 8 (faster) | 5 (slower) |
| Configuration Type | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | SRAM-based (volatile) | SRAM-based (volatile) |
מבדילים עיקריים
- Largest MAX 10 DA with internal flash + ADC in F484 BGA (לעומת10M08DAF484C8G)
- Internal non-volatile flash eliminates external boot PROM (לעומת10CL120YF484I8G)
- Dual-supply (DA) variant with integrated ADC for sensor applications (לעומת10CX220YF484I5G)
הערות תכנון
The 484-BGA FineLine BGA package requires via-in-pad PCB technology for reliable breakout routing. Per Intel's MAX 10 hardware design guide, use 0.4 mm ball pitch with microvia stacks (laser-drilled 0.1 mm vias). Place decoupling capacitors within 2 mm of each power pin pair, with 0.1 uF ceramic on every VCCIO bank and bulk 10 uF tantalum or ceramic on VCCINT. Ground planes should be uninterrupted beneath the BGA footprint to provide return path and thermal dissipation.
The 484-BGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15 C/W with 4-layer JEDEC test board, meaning at 1 W dissipation the junction rises 15 C above ambient. For industrial temperature grade operation up to 100 C ambient, maximum dissipation is limited to about 5 W. Reduce internal toggle rate or use clock gating to manage self-heating. For higher-power applications, consider the larger 256-pin BGA with better thermal spreading or add a heatsink with thermal interface material.
Do not confuse the DA (dual-supply) variant with the SA (single-supply) variant when ordering - they share the same F484 footprint but the analog ADC pins differ in functionality. When migrating from a Cyclone IV design, verify that the MAX 10's internal flash provides equivalent boot behavior, as MAX 10 instant-on differs from Cyclone IV SRAM-based configuration. Always check Quartus Prime pin assignments for bank voltage compatibility before PCB fabrication, as 3.3 V LVCMOS inputs on a 2.5 V bank can damage the I/O cells.
מידע על תאימות
RoHS compliant and lead-free per Intel product declaration. Not AEC-Q100 qualified; for automotive applications requiring Q100, contact Intel for MAX 10 automotive-grade variants.