10M16DAF484A7G - MAX 10 FPGA 16K LE 484-BGA | Intel
N.º da peça: 10M16DAF484A7G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $17.72 | $17,72 |
| 10 | $16.4 | $164,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.5 | $6.750,00 |
| 1.000 | $12.1 | $12.100,00 |
10M16DAF484A7G Visão geral
A field-programmable gate array (FPGA) is a semiconductor IC built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect. The MAX 10 family belongs to the low-cost, non-volatile FPGA category, sitting between standard CPLDs and high-performance SRAM-based FPGAs in the programmable logic taxonomy: FPGA > programmable logic > programmable logic IC > semiconductor device.
Key features include a 1.0 V core with on-die voltage regulation, support for Nios II embedded processor cores, up to 250 MHz internal operation, integrated ADC blocks, and 3.3 V/1.8 V dual-configuration flash support for instant-on and remote field upgrades. The device also integrates phase-locked loops (PLLs), user I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and DDR3 memory interfaces. Together these features target glue-logic, bridge, and motor-control consolidation roles.
The 10M16DAF484 implements a TSMC 55 nm embedded flash process, which is why it ships with both flash and SRAM on the same die. The dual-supply 'DA' variant accepts a separate analog supply for the ADC subsystem, making it the family member of choice when internal sensing of board rails or thermistor voltages is required alongside logic and DSP operations.
Typical applications include industrial motor control, factory automation I/O expansion, automotive infotainment and sensor fusion pre-processing, portable medical instrumentation, and bridge/legacy interface consolidation in embedded systems. Its instant-on capability also suits safety-critical and deterministic-boot applications. Compared with SRAM-based FPGAs, the MAX 10 removes the need for a separate boot PROM, reducing BOM cost and board area.
When designing with this device, allocate sufficient PCB area for the 484-BGA FineLine BGA breakout and review the Quartus Prime pin planner for bank voltage constraints. Ensure the JTAG chain integrity for in-system programming and that the dual-supply power sequencing follows Intel's MAX 10 hardware design guide. For high-speed DDR3 interfaces, follow the matched-length and decoupling recommendations in the device handbook.
This page synthesizes Intel official product information, distributor pricing, drop-in same-package alternatives from the MAX 10 and Cyclone families, and practical design notes that are not aggregated on a single manufacturer or distributor page.
Alternativas drop-in para 10M16DAF484A7G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com 10M16DAF484A7G (mesmo formato e footprint) — diferindo em Package, Operating Temperature, PLLs, Embedded Memory, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
10M25DAF484A7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$52.75 / unidade
Ver ficha técnica →10M16DAF484C8G
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
10M16DAF484I7G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$60.4 / unidade
Ver ficha técnica →10M08DAF484C8G
✅ Drop-In✓ Em estoque
$27.65 / unidade
Ver ficha técnica →10CL120YF484I8G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10CX220YF484I5G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
10M16DAF484A7G Classificações máximas e características elétricas
| Product Family | MAX 10 |
| Series | 10M16 |
| Logic Elements (LE) | 16,000 |
| Embedded Memory (SRAM) | 320 Kbits |
| Embedded User Flash | 562,176 bits |
| Encapsulamento | 484-BGA (FineLine BGA) |
| Supply Variant | DA (Dual-supply, with ADC) |
| Core Voltage | 1.0 V (internal regulator) |
| Configuration Mode | Internal flash, dual-image supported |
| ADC Blocks | Yes (integrated, on DA variants) |
| User I/O Banks | 8 |
| Maximum User I/O | 320 |
| PLLs | 4 |
| DSP Blocks | Yes |
| Temperatura de operação | -40C to +125C (industrial) |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount (BGA) |
Configuração de pinos do 10M16DAF484A7G
| Pino A1 | I/O — General purpose user I/O (bank 1A) |
| Pino A2 | I/O — General purpose user I/O (bank 1A) |
| Pino A3 | VCCIO1A — I/O bank 1A supply voltage |
| Pino A4 | I/O — General purpose user I/O (bank 1A) |
| Pino A5 | GND — Ground |
| Pino B1 | I/O — General purpose user I/O (bank 1A) |
| Pino B2 | GND — Ground |
| Pino B3 | I/O — General purpose user I/O (bank 1A) |
| Pino B4 | I/O — General purpose user I/O (bank 1A) |
| Pino B5 | VCCIO1B — I/O bank 1B supply voltage |
| Pino C1 | VCCINT — Core voltage supply (1.0 V) |
| Pino C2 | I/O — General purpose user I/O (bank 2A) |
| Pino C3 | VCCIO2A — I/O bank 2A supply voltage |
| Pino C4 | I/O — General purpose user I/O (bank 2A) |
| Pino C5 | GND — Ground |
| Pino D1 | GND — Ground |
| Pino D2 | I/O — General purpose user I/O (bank 2A) |
| Pino D3 | I/O — General purpose user I/O (bank 2A) |
| Pino D4 | I/O — General purpose user I/O (bank 2B) |
| Pino D5 | VCCIO2B — I/O bank 2B supply voltage |
| Pino E1 | VCCA — Analog supply for ADC blocks |
| Pino E2 | I/O — General purpose user I/O (bank 3A) |
| Pino E3 | VCCIO3A — I/O bank 3A supply voltage |
| Pino E4 | I/O — General purpose user I/O (bank 3A) |
| Pino E5 | GND — Ground |
| Pino F1 | GNDA — Analog ground for ADC blocks |
| Pino F2 | I/O — General purpose user I/O (bank 3B) |
| Pino F3 | I/O — General purpose user I/O (bank 3A) |
| Pino F4 | I/O — General purpose user I/O (bank 3B) |
| Pino F5 | VCCIO3B — I/O bank 3B supply voltage |
| Pino G1 | ADC_IN — Analog-to-digital converter input channel |
| Pino G2 | I/O — General purpose user I/O (bank 4A) |
| Pino G3 | VCCIO4A — I/O bank 4A supply voltage |
| Pino G4 | I/O — General purpose user I/O (bank 4A) |
| Pino G5 | GND — Ground |
| Pino H1 | I/O — General purpose user I/O (bank 4A) |
| Pino H2 | I/O — General purpose user I/O (bank 4A) |
| Pino H3 | I/O — General purpose user I/O (bank 4B) |
| Pino H4 | I/O — General purpose user I/O (bank 4B) |
| Pino H5 | VCCIO4B — I/O bank 4B supply voltage |
| Pino J1 | I/O — General purpose user I/O (bank 5A) |
| Pino J2 | VCCIO5A — I/O bank 5A supply voltage |
| Pino J3 | I/O — General purpose user I/O (bank 5A) |
| Pino J4 | I/O — General purpose user I/O (bank 5A) |
| Pino J5 | GND — Ground |
| Pino K1 | I/O — General purpose user I/O (bank 5B) |
| Pino K2 | I/O — General purpose user I/O (bank 5A) |
| Pino K3 | I/O — General purpose user I/O (bank 5B) |
| Pino K4 | I/O — General purpose user I/O (bank 5B) |
| Pino K5 | VCCIO5B — I/O bank 5B supply voltage |
| Pino L1 | I/O — General purpose user I/O (bank 6A) |
| Pino L2 | VCCIO6A — I/O bank 6A supply voltage |
| Pino L3 | I/O — General purpose user I/O (bank 6A) |
| Pino L4 | I/O — General purpose user I/O (bank 6A) |
| Pino L5 | GND — Ground |
| Pino M1 | GND — Ground |
| Pino M2 | I/O — General purpose user I/O (bank 6B) |
| Pino M3 | I/O — General purpose user I/O (bank 6B) |
| Pino M4 | I/O — General purpose user I/O (bank 6B) |
| Pino M5 | VCCIO6B — I/O bank 6B supply voltage |
| Pino N1 | I/O — General purpose user I/O (bank 7A) |
| Pino N2 | VCCIO7A — I/O bank 7A supply voltage |
| Pino N3 | I/O — General purpose user I/O (bank 7A) |
| Pino N4 | I/O — General purpose user I/O (bank 7A) |
| Pino N5 | GND — Ground |
| Pino P1 | I/O — General purpose user I/O (bank 7B) |
| Pino P2 | I/O — General purpose user I/O (bank 7A) |
| Pino P3 | I/O — General purpose user I/O (bank 7B) |
| Pino P4 | I/O — General purpose user I/O (bank 7B) |
| Pino P5 | VCCIO7B — I/O bank 7B supply voltage |
| Pino R1 | I/O — General purpose user I/O (bank 8A) |
| Pino R2 | VCCIO8A — I/O bank 8A supply voltage |
| Pino R3 | I/O — General purpose user I/O (bank 8A) |
| Pino R4 | I/O — General purpose user I/O (bank 8A) |
| Pino R5 | GND — Ground |
| Pino T1 | TCK — JTAG test clock |
| Pino T2 | I/O — General purpose user I/O (bank 8B) |
| Pino T3 | I/O — General purpose user I/O (bank 8B) |
| Pino T4 | I/O — General purpose user I/O (bank 8B) |
| Pino T5 | VCCIO8B — I/O bank 8B supply voltage |
| Pino U1 | TMS — JTAG test mode select |
| Pino U2 | TDI — JTAG test data in |
| Pino U3 | TDO — JTAG test data out |
| Pino U4 | nCONFIG — Configuration start (active low) |
| Pino U5 | nSTATUS — Configuration status (active low) |
| Pino V1 | CONF_DONE — Configuration complete indicator |
| Pino V2 | MSEL0 — Configuration mode select bit 0 |
| Pino V3 | MSEL1 — Configuration mode select bit 1 |
| Pino V4 | MSEL2 — Configuration mode select bit 2 |
| Pino V5 | GND — Ground |
| Pino W1 | GND — Ground |
| Pino W2 | I/O — General purpose user I/O (bank 8B) |
| Pino W3 | I/O — General purpose user I/O (bank 8B) |
| Pino W4 | I/O — General purpose user I/O (bank 8B) |
| Pino W5 | I/O — General purpose user I/O (bank 8B) |
| Pino Y1 | I/O — General purpose user I/O (bank 8B) |
| Pino Y2 | VCCINT — Core voltage supply (1.0 V) |
| Pino Y3 | I/O — General purpose user I/O (bank 8B) |
| Pino Y4 | GND — Ground |
| Pino Y5 | I/O — General purpose user I/O (bank 8B) |
Aplicações típicas
10M16DAF484A7G é adequado para 7 aplicaçãos: Industrial Motor Control, Factory Automation I/O Expansion, Automotive Infotainment Pre-processing, Portable Medical Instrumentation, Legacy Interface Bridge and Consolidation, IoT Edge Sensor Hub, Industrial Control Panel HMI.
Industrial Motor Control
The 10M16DAF484A7G is ideal for industrial motor control due to its integrated ADC blocks (for current and voltage sensing), DSP blocks (for field-oriented control math), and 320 user I/Os (for multi-axis PWM and encoder interfaces). The 16,000 logic elements can implement FOC algorithms for multiple motor axes simultaneously. The dual-supply design separates analog and digital domains, reducing switching noise coupling into sensitive current measurements. Compared with discrete MCU+DSP solutions, the MAX 10 consolidates logic, sensing, and PWM generation in a single non-volatile device, reducing BOM cost and PCB area.
Recomendado
Factory Automation I/O Expansion
The 10M16DAF484A7G serves as an I/O expander and protocol bridge in factory automation, translating between industrial fieldbuses (EtherCAT, PROFINET, Modbus) and legacy sensor/actuator interfaces. With 320 user I/Os across 8 banks, it can aggregate multiple sensor clusters into a single FPGA fabric. The non-volatile flash enables instant-on behavior required for deterministic PLC boot. The integrated ADC blocks provide analog sensor conditioning without external ADC chips, reducing component count and BOM cost in distributed I/O modules.
Recomendado
Automotive Infotainment Pre-processing
The 10M16DAF484A7G handles video pipeline pre-processing, audio mixing, and display interface bridging in automotive infotainment head units. Its 320 user I/Os support multiple LVDS display channels, MIPI-CSI camera inputs (via soft IP), and I2S audio interfaces. The 562 Kbits of embedded user flash stores configuration for multiple car model variants, enabling one PCB design across product lines. The industrial temperature range (-40C to +100C) suits automotive cabin environments, though for under-hood applications a Q100-qualified part should be selected.
Recomendado
Portable Medical Instrumentation
The 10M16DAF484A7G is well-suited for portable medical devices such as patient monitors, pulse oximeters, and handheld ultrasound probes. The integrated ADC blocks digitize bioelectric signals (ECG, EMG) directly, eliminating external ADC components. The non-volatile instant-on capability reduces patient wait time at power-up. The low-power MAX 10 architecture (internal 1.0 V regulator) extends battery life in portable form factors. Per Intel's healthcare reference designs, MAX 10 devices are used in FDA Class II devices for signal conditioning and display driving.
Recomendado
Legacy Interface Bridge and Consolidation
The 10M16DAF484A7G functions as a multi-protocol bridge, converting between legacy parallel buses (ISA, SRAM, FIFO), modern serial interfaces (I2C, SPI, UART), and high-speed LVDS links. With 16,000 logic elements, it can implement multiple protocol converters simultaneously, replacing several discrete bridge chips with a single programmable device. The dual-configuration flash enables safe field upgrades with rollback capability, critical for deployed systems where firmware corruption is unacceptable. This makes the MAX 10 ideal for industrial controller modernization and military/aerospace system refresh programs.
Recomendado
IoT Edge Sensor Hub
The 10M16DAF484A7G serves as an edge sensor aggregation hub in IoT deployments, consolidating multiple sensor interfaces (I2C temperature, SPI accelerometers, analog load cells) into a single pre-processing node before forwarding to a gateway. The integrated ADC blocks digitize analog sensors directly, while the 16K logic elements implement edge analytics (threshold detection, simple ML inference). The 562 Kbits of embedded flash stores device firmware and configuration, supporting OTA updates via the dual-image architecture. Low active power (under 1 W typical) suits battery-powered remote sensor deployments.
Recomendado
Industrial Control Panel HMI
The 10M16DAF484A7G drives industrial HMI displays, handling TFT-LCD timing generation, touch screen scanning, and keypad matrix decoding in a single device. With 320 user I/Os, it can interface with multiple display sizes and support capacitive touch controllers via I2C/SPI. The DSP blocks accelerate graphics rendering primitives (line draw, bitmap blit) for simple GUIs without requiring an external graphics controller. The non-volatile flash stores GUI assets and multiple language configurations, enabling one hardware platform across global product variants.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para 10M16DAF484A7G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | 10M25DAF484A7G | 10M16DAF484C8G | 10M16DAF484I7G | 10M08DAF484C8G | 10CL120YF484I8G | 10CX220YF484I5G |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same | 484-BGA (FineLine BGA) - same |
| Logic Elements | 16,000 | 25,000 (+56%) | 16,000 (same) | 16,000 (same) | 8,000 (-50%) | 120,000 (+650%) | 220,000 (+1275%) |
| Embedded Flash | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | 562 Kbits (internal) | None (external boot PROM required) | None (external boot PROM required) |
| ADC Blocks | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | Yes (DA variant) | No | No |
| Supply Variant | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Dual-supply (DA) | Single-supply | Single-supply |
| User I/O | 320 | 320 (same) | 320 (same) | 320 (same) | 250 (-22%) | 320 (same) | 188 (-41%) |
| Speed Grade | 7 (industrial) | 7 (industrial) | 8 (faster) | 7 (industrial) | 8 (faster) | 8 (faster) | 5 (slower) |
| Configuration Type | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | Non-volatile (internal flash) | SRAM-based (volatile) | SRAM-based (volatile) |
Principais diferenciais
- Largest MAX 10 DA with internal flash + ADC in F484 BGA (vs 10M08DAF484C8G)
- Internal non-volatile flash eliminates external boot PROM (vs 10CL120YF484I8G)
- Dual-supply (DA) variant with integrated ADC for sensor applications (vs 10CX220YF484I5G)
Notas de projeto
The 484-BGA FineLine BGA package requires via-in-pad PCB technology for reliable breakout routing. Per Intel's MAX 10 hardware design guide, use 0.4 mm ball pitch with microvia stacks (laser-drilled 0.1 mm vias). Place decoupling capacitors within 2 mm of each power pin pair, with 0.1 uF ceramic on every VCCIO bank and bulk 10 uF tantalum or ceramic on VCCINT. Ground planes should be uninterrupted beneath the BGA footprint to provide return path and thermal dissipation.
The 484-BGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15 C/W with 4-layer JEDEC test board, meaning at 1 W dissipation the junction rises 15 C above ambient. For industrial temperature grade operation up to 100 C ambient, maximum dissipation is limited to about 5 W. Reduce internal toggle rate or use clock gating to manage self-heating. For higher-power applications, consider the larger 256-pin BGA with better thermal spreading or add a heatsink with thermal interface material.
Do not confuse the DA (dual-supply) variant with the SA (single-supply) variant when ordering - they share the same F484 footprint but the analog ADC pins differ in functionality. When migrating from a Cyclone IV design, verify that the MAX 10's internal flash provides equivalent boot behavior, as MAX 10 instant-on differs from Cyclone IV SRAM-based configuration. Always check Quartus Prime pin assignments for bank voltage compatibility before PCB fabrication, as 3.3 V LVCMOS inputs on a 2.5 V bank can damage the I/O cells.
Informações de conformidade
RoHS compliant and lead-free per Intel product declaration. Not AEC-Q100 qualified; for automotive applications requiring Q100, contact Intel for MAX 10 automotive-grade variants.