10M40DAF256I7G - MAX 10 FPGA 40K LE, 178 I/O, 256-FBGA | Intel
MPN: 10M40DAF256I7G ✓ نشط10M40DAF256I7G نظرة عامة
What is a non-volatile FPGA? A non-volatile FPGA is a field-programmable gate array that retains its configuration bitstream in on-chip flash memory, eliminating the need for an external boot PROM and enabling instant-on operation within milliseconds of power-up. MAX 10 FPGAs sit at the lowest end of Intel's FPGA portfolio in terms of logic density but offer the highest integration of analog/mixed-signal features (12-bit SAR ADC, temperature sensors, PLLs), making them ideal for I/O expansion, glue-logic replacement, and low-cost control-plane designs. Within the broader taxonomy they belong to: FPGA -> programmable logic -> digital IC -> semiconductor.
Key features of the 10M40DAF256I7G include 40K logic elements (LEs), 1,290,240 bits (M9K + M144K) embedded user RAM, 4 PLLs, 56 (18x18) multipliers for DSP, and an integrated hard IP block set including DDR3 external memory interfaces, 12-bit ADC, and PCIe Gen2 hard IP (x1/x2). The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socket support and on-die termination.
Technically the 10M40DAF256I7G uses Intel's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables, providing superior logic packing versus legacy 4-input LUT architectures. The on-chip flash stores two configuration images for fail-safe dual-boot, and the analog block integrates up to 16 channels of 12-bit 1 MSPS SAR ADC plus on-die temperature sensing diodes that connect to the FPGA fabric.
Typical applications include industrial motor control, factory automation I/O concentrators, portable medical device displays, low-cost video bridging, automotive infotainment pre-processing, and PCIe endpoint cards. The 256-FBGA package also fits space-constrained designs requiring a BGA footprint with high pin count and good thermal dissipation via the exposed die paddle.
When designing with this device, route the dedicated configuration/JTAG pins (nCONFIG, nSTATUS, CONF_DONE, TMS, TCK, TDI, TDO) to the board test access points and provide at least one 10 uF + one 100 nF decoupling pair per power rail (VCCINT, VCCA, VCCIO bank). The dual-boot flash allows in-field updates over PCIe or serial protocols, but designers must budget flash update time and provide an external watchdog to recover from corrupted images.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from Intel's MAX 10 family, application-specific design notes, and comparison tables not consolidated in the manufacturer datasheet.
بدائل مباشرة لـ 10M40DAF256I7G — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 10M40DAF256I7G (نفس عامل الشكل والبصمة) — يختلف في Package, Process Technology, Operating Temperature, Logic Elements (LE), Family.
10M40DAF256C7G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M40DAF256C8G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M40DAF256I7P
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
10M25DAF256I7G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M16DAF256I7G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M40DCF256C7G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M40DAF256I7G الحدود القصوى والخصائص الكهربائية
| Series | MAX 10 |
| Logic Elements (LE) | 40,000 |
| Embedded Memory (bits) | 1,290,240 (M9K + M144K blocks) |
| User I/O Count | 178 |
| العلبة | 256-FBGA (FineLine BGA), 17x17 mm |
| Process Technology | 55 nm TSMC |
| Core Voltage | 1.2 V |
| درجة حرارة التشغيل | -40C to +100C (Industrial, I7) |
| Maximum Internal Frequency | 472.5 MHz |
| Number of PLLs | 4 |
| Embedded Multipliers (18x18) | 56 |
| ADC | 12-bit SAR, up to 16 channels, 1 MSPS |
| Configuration Memory | On-chip dual-configuration flash |
| PCIe Hard IP | PCIe Gen2 x1/x2 (soft IP in 256-FBGA variant) |
| نوع التركيب | Surface Mount (BGA) |
| مستوى MSL | 3 (168 hours) |
| حالة RoHS | Compliant |
| نمط التركيب | SMD/SMT |
| Lead-Free / Halogen-Free | Yes / Yes |
دليل تكوين أطراف 10M40DAF256I7G 256-fbga (fineline bga), 17x17 mm
تكوين الأطراف لـ 10M40DAF256I7G (حزمة 256-fbga (fineline bga), 17x17 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ 10M40DAF256I7G.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
10M40DAF256I7G مناسب لـ 6 التطبيقs: Industrial Motor Control, Factory Automation I/O Concentrator, Portable Medical Device Display Controller, Low-Cost Video Bridge / Format Converter, Automotive Infotainment Pre-Processor, PCIe Endpoint Card / Industrial Add-In.
Industrial Motor Control
The 10M40DAF256I7G's 4 PLLs, 56 (18x18) hardware multipliers, and integrated 12-bit SAR ADC (up to 16 channels at 1 MSPS) make it ideal for field-oriented control (FOC) of three-phase AC induction and PMSM motors. The 40K logic elements can implement the entire control loop including PID, space-vector modulation, encoder interface (QEI), and commutation logic on a single chip. Designers benefit from the instant-on flash configuration, allowing the motor controller to be operational within 10 ms of power-up - critical for safety-critical industrial drives.
موصى به
Factory Automation I/O Concentrator
The 178 user I/O pins and 1,290,240-bit embedded memory array let the 10M40DAF256I7G aggregate multiple industrial protocols (EtherCAT, PROFINET, Modbus TCP, RS-485) into a single programmable platform. The non-volatile flash configuration eliminates external boot PROMs, reducing BOM cost for distributed I/O nodes mounted in factory cabinets. Hot-socket support and on-die termination simplify live maintenance scenarios typical in 24/7 production lines.
موصى به
Portable Medical Device Display Controller
The 10M40DAF256I7G drives LCD/TFT panels, processes ECG/spO2 waveforms, and manages USB/HID interfaces in portable patient monitors. Its integrated ADC digitizes sensor signals without an external analog front end, and the non-volatile configuration ensures the device boots correctly after battery-swap events. The 1.2 V core operating voltage keeps total power consumption under 1.5 W typical, extending battery life in handheld diagnostic equipment.
موصى به
Low-Cost Video Bridge / Format Converter
With 56 (18x18) multipliers and 1.29 Mbits of embedded memory, the 10M40DAF256I7G implements HDMI-to-LVDS, MIPI-to-Parallel, and other video format conversions at resolutions up to 1080p60. The 178 I/O lines accept multiple video input formats simultaneously, and the on-chip DDR3 controller interfaces to external frame buffers. Compared to dedicated video ASSPs, the MAX 10 FPGA offers design flexibility for emerging standards like V-by-One and embedded DisplayPort.
موصى به
Automotive Infotainment Pre-Processor
The 10M40DAF256I7G handles CAN/LIN bus aggregation, audio DSP pre-processing, and rear-seat entertainment switching before passing data to the main head-unit SoC. Its industrial-grade temperature range (-40C to +100C) tolerates cabin environments, and instant-on flash configuration enables sub-50 ms startup for rear-view camera overlays. Designers pair it with the Cyclone V SoC for higher-tier infotainment stacks requiring ARM Cortex-A9 hard cores.
موصى به
PCIe Endpoint Card / Industrial Add-In
The 10M40DAF256I7G implements PCIe Gen2 x1 endpoints on industrial PCs, data-acquisition cards, and machine-vision frame grabbers. Its hard IP block accelerates protocol handling while leaving the 40K LE fabric free for custom DMA engines, on-card processing, and I/O expansion. The 256-FBGA package's 17x17 mm footprint fits half-height, half-length PCIe card form factors.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 10M40DAF256I7G — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 10M40DAF256C7G | 10M40DAF256C8G | 10M40DAF256I7P | 10M25DAF256I7G | 10M16DAF256I7G | 10M40DCF256C7G |
|---|---|---|---|---|---|---|---|
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same | 256-FBGA (17x17 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 | 16,000 | 40,000 |
| Embedded Memory (bits) | 1,290,240 | 1,290,240 | 1,290,240 | 1,290,240 | 837,120 | 549,888 | 1,290,240 |
| User I/O Count | 178 | 178 | 178 | 178 | 178 | 178 | 178 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Supply Variant | Dual-supply (2.5 V/3.3 V) | Dual-supply (2.5 V/3.3 V) | Dual-supply (2.5 V/3.3 V) | Dual-supply (2.5 V/3.3 V) | Dual-supply (2.5 V/3.3 V) | Dual-supply (2.5 V/3.3 V) | Single-supply (1.2 V) |
| Unit Price (qty-1, USD) | 96.13 | 78.20 | 82.40 | 98.50 | 65.00 | 48.50 | 74.80 |
| Embedded Multipliers (18x18) | 56 | 56 | 56 | 56 | 36 | 24 | 56 |
أبرز الفروقات
- Dual-configuration flash with instant-on support (مقابل10M25DAF256I7G)
- Industrial temperature grade with extended I/O count (مقابل10M40DAF256C7G)
- Higher density and multiplier count for DSP workloads (مقابل10M16DAF256I7G)
ملاحظات التصميم
The 10M40DAF256I7G requires separate power rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), and VCCIO (1.2 V to 3.3 V per I/O bank). Place a 10 uF tantalum bulk cap plus 100 nF ceramic decoupling per power pin pair. Per the MAX 10 power distribution guidelines, the VCCA rail must be filtered with an LC pi-network (10 uH + 10 uF) to minimize PLL jitter. Estimated: total quiescent current at typical logic utilization (~50%) is approximately 600 mA from VCCINT.
The 256-FBGA package uses a 17x17 mm body with 1.0 mm ball pitch. Per the MAX 10 board design guidelines, route signals on the top layer and breakout the inner balls with micro-via-in-pad (0.2 mm) or dog-bone fanout. Keep all eight I/O bank power pins (VCCIO_x) decoupled with 0.1 uF capacitors placed within 5 mm of the package. Maintain at least four ground vias per square centimeter of copper pour under the exposed die paddle for thermal dissipation.
Estimated: leaving the nCONFIG pin floating during power-up may cause intermittent configuration failures. Tie nCONFIG to VCCIO through a 10 kohm pull-up. The dual-boot flash feature can mask corrupted images if the watchdog timer is not enabled in the Quartus Prime programming file. Verify CONF_DONE timing with at least a 100 ms delay after power-up before accessing user I/O. Do not use I/O bank 8 for high-speed interfaces (LVDS > 800 Mbps) without checking the dedicated clock input placement rules.
معلومات الامتثال
RoHS compliant per Altera product page. Industrial temperature grade (I7) but not AEC-Q100 qualified - designers targeting AEC-Q100 automotive applications should verify with the Intel/Altera automotive-grade product roadmap.
